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Telecosm 2004 John Trezza © 2004 Xanoptix, Inc 1 Xanoptix Purpose Xanoptix exists to permit the concept of a “Chip” to transcend materials, technologies and distances. Xanoptix will enable a world free of hardware bottlenecks by allowing unimpeded communication between integrated circuits Many data paths, Unrestricted speed, and Vast reach (microns to kilometers). By doing so, we will Radically improve the price/performance electronics, Merge ‘chips’ and ‘the network’, and Move the IC industry from a ‘mainframe-like’ model to a ‘PC-like’ model. © 2004 Xanoptix, Inc 2 Bit Rate (Megabits/second) More Complex Chips with More I/O 1.E+15 1.E+14 1.E+13 1.E+12 1.E+11 1.E+10 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 1.E+04 1.E+03 1.E+02 1.E+01 1.E+00 1970 10,000 x \ 1980 1990 2000 2010 Year © 2004 Xanoptix, Inc 3 Industry Problems ICs: Poor Communication & Performance •IN SYSTEM: Can send 0.01% of Desired CHIP Data •BY USING 10% to 50% of CHIP POWER AND AREA •IN NETWORK: 0.0001% ICs:complex to design & Limited In Roadmap & Expensive •Material Choices Like the Model-T Colors •IP sharing hard •$1million & Months of Design for Each Attempt •No Upgradability •Large chips = “wafers-per-chip” Yields •Million costs when 90% of chip needs Inexpensive •Chips not expected to grow in next 10 years! © 2004 Xanoptix, Inc 4 What we do – 3D Integrated Circuits Material-Neutral, Chip-level, direct die-to-die interconnection THE XANOPTIX DIFFERENCE Integrate 3D Wafer MILLIONS of Connections per cm2 Daughter Wafers Mother Wafer (e.g. CMOS) Electronic Passive Optical ANY Material / Process / Fab Stack Semiconductor Economies of Scale. GaAs Si GaAs, InP Ceramic Si Si Si Si Multi-Vertical-Stack Silicon CMOS, Bi-CMOS, GaAs IC, etc. 1000s Optical Connections Electronic Connections (um sized) © 2004 Xanoptix, Inc (Chips kilometers Apart Act as 1 Chip) 5 Process Base Process Electrical, Mechanical, Thermal Connection 4 to 14um Daughter IC I/O Pad Openings <5um Mother Wafer 7 to 50um Multi-Stacking Chips w/ vias © 2004 Xanoptix, Inc 6 What we are working to achieve Repeat the IC Revolution Transform Boards of Chips & Modules Into Individual Stacked Chips PROCSSOR WLAN USB/Audio USB/ HDD Audio/HDD OPTICAL GRAPHICS DRAM © 2004 Xanoptix, Inc 7 What we are working to achieve Move the IC Industry from a ‘mainframe-like’ to a ‘PC-like’ model Transform Large, Complex Chips Into Modular Stacked Chips PC-Like Mainframe-Like Processor Core L2 Cache Bus Logic L3 Cache © 2004 Xanoptix, Inc L3 Cache L3 Cache L3 Cache Bus Logic L2 Cache Processor Core Bus Logic Processor L3 L3 L3 L2 Cache Cache Core Cache Cache 8 What we are working to achieve Remove I/O Bottlenecks over Any Distance. Transform Many ICs & the network Into One Big ‘Chip’ Kilometers Transceiver Microns DRAM Optical I/O SRAM Mixed Signal IC RF Chip Silicon CMOS IC (e.g. Microprocessor) © 2004 Xanoptix, Inc DRAM Optical I/O SRAM Mixed Signal IC RF Chip Silicon CMOS IC (e.g. Microprocessor) 9 3D Stacked ICs: ICs are Dramatically Improved in Performance •ALL Data Available over ANY distance (The chip =network) •90% Less I/O Power •99% Less I/O Space ICs are Unlimited in Flexibility & Decreased in Cost •Mix & Match Processes & Material From Best Suppliers •The chip IS the board •Days of Design for new version of a chip •Customize & Upgrade your chip just a PC. •Several Smaller chips each with very high yield •Cost is on function-by Function basis •‘Unlimited’ chip size © 2004 Xanoptix, Inc 10 Key Capabilities ELECTRONICS Mixed Signal IC Design 3-D Folded Packaging Design © 2004 Xanoptix, Inc 3D Stacked IC OPTICS Optical Device Design & Fabrication Optical Packaging Design 11 Xanoptix Has Advanced 3D Capabilities Electrical Chips Demonstrated Chips for Products Capability ~ 600 10,000 Million Million+ 14 um 7 um 4 um 2 um 40,000/cm2 160,000 / cm2 1,000,000/cm2 1,000,000+/ cm2 216 N/A ~ 300,000 > 300,000 1st Optical Product # contacts/chip Contact Size Contact Density # Optical devices Contact yields 99.9995% © 2004 Xanoptix, Inc 12 First Commercial Application Combines active optics and electronics into single chips Single Chip Optoelectronic Transceiver 250 Gb/s (equivalent to 1,250 Ethernet Cards) © 2004 Xanoptix, Inc 13 Para-Optix Product Line Xanoptix Component Xanoptix IC •15x number of optical devices •3:1 Laser redundancy •Programmable Chip Optical Connector Heat Sink Xanoptix 3-D Packaging Optical Output Electrical Connector 1cm P R O G R A M MING XTM-12 XTM-16 5Gb/s © 2004 Xanoptix, Inc XTM-24 XTM-32 XTM-48 XTM-72 400Gb/s 14 PARA-OPTIX VS. LC SFF IP Routers Core Switching CATV/Metro Switching Storage/Data Switching Computing & Server © 2004 Xanoptix, Inc 15 Next Generation: Fiber Cables NEXT GENERATION PASSIVE OPTICAL CABLING “100,000 points of light” 100,000 fibers 3mm 100,000s of fibers 1000s Optical I/O © 2004 Xanoptix, Inc 16 Future Development Roadmaps Intelligence Tx / Rx Transceiver Backup/redundancy Power monitoring Pre-Emphasis Equalization SERDES Clock Recovery Microprocessor FPGA Graphics Network Processors SRAM &DRAM BIOS Chipsets Memory controllers Drive controllers Data aggregators Microprocessors GbE / FibCh codec SONET scrambling Crossbar Switching Drop/Add ECC & CRC Regenerators Framing Header Decoding Digital Crossconnect WDM Crossconnecct Clocking distribution Bus Controller © 2004 Xanoptix, Inc Speed/I/O 640 Mb/s/ch 1 Gb/s/ch 1.25 Gb/s/ch 2.5 Gb/s/ch 3.125 Gb/s/ch 5.5 Gb/s/ch 6.25 Gb/s/ch 10 Gb/s/ch 12.5 Gb/s/ch 40 Gb/s/ch # optical I/O 1 2 4 8 12 16 24 32 48 72 96 128 144 256 288 576 9216 36864 589824 Wavelength(s) 850nm VCSEL 1310nm DFB Single Mode devices CWDM (2-16 l) 1550nm DFB DWDM(16-256+ l) 600nm VCSEL 1310nm VCSEL 17 Example: Communication Systems Expensive Monolithic Routers, Servers, DWDM systems $1 Million ; 6ft System. Commodity Systems • 1000s of Optical I/O channels • Hundreds of wavelengths $1,000 ; 1in System. Microprocessor, Router, DWDM System © 2004 Xanoptix, Inc 18 Kilometers Transceiver Microns DRAM Optical I/O SRAM Mixed Signal IC RF Chip Silicon CMOS IC (e.g. Microprocessor) © 2004 Xanoptix, Inc DRAM Optical I/O SRAM Mixed Signal IC RF Chip Silicon CMOS IC (e.g. Microprocessor) 19 Computing, Storage, Office, and Consumer Opportunities Single Chip Digital Cameras (Sensor, Logic, Memory, display, and Network in one) Highly Parallel Communication For storage systems Other Consumer Electronics •Single Chip DVD Recorder (read the disk in one rotation) •Memory Stacks •Single chip “Xbox in a wristwatch” •Printer/Scanner/Copier Chip © 2004 Xanoptix, Inc 20 Next Generation: Telecom & Communications Products WLAN on a Chip Cell Phone / Base Station “on a Chip” LNB devices/Modules for Satellite TV Single-Chip, Ultra Redundant Undersea Repeaters Single Chip Fiber to The Home ‘box’ Modular ASICs © 2004 Xanoptix, Inc 21 Next Generation: Consumer, Industrial, Military, and Commercial Active printed circuit boards, Cables & IC sockets The Connector/Cable *IS* the Electronics/Optics/network In-Flight Networking & Entertainment Chips Single Chip High-Temp Industrial Control Sytems Avionics & Space © 2004 Xanoptix, Inc 22 Next Generation: Automotive Products Active Auto Fiber Harness (embedded Electronics and/or optics in cables/connectors) Drive by Wire; In Car network. Sensor Modules / Engine Control Modules On Board Computer Networks Silicon GaAs / InP MEMS © 2004 Xanoptix, Inc GaN RF Optics 23 Summary: Performance, Functionality, Yield, Cost •A Chip combines the best of all technologies. •Merge ‘chips’ and the ‘network’ •Increased Communication Bandwidth & Functionality (millions / cm2) •Extended communication distance (1um kms) •Lower communication power •Upgradability: Treat ICs like PCs •Eliminate the need for entire classes of other components •1st Commerical Chips: 245 Gb/s in 1 square centimeter --more bandwidth than 1000 Ethernet cards •Huge opportunities throughout the industry. © 2004 Xanoptix, Inc 24 The Vision Event Integrated Circuits Developed (1961) Significance First Product Market Result Revolutionized Electronics Hearing Aid $100s Billions Electronics industry now (TI & Fairchild) 3D and OPTICALLY Revolutionizes ENABLED Electronics & Integrated The Network Circuits Developed (2001) Intelligent Transceiver $ (Xanoptix) © 2004 Xanoptix, Inc 25