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Advanced Micro Devices ARM architecture-based chip
AMD intends to release ARM System on
Chips (SoC) that will begin sampling in early
2014 and release later in the year. They will
be for use in servers as a low-power
alternative to current x86 chips. The ARM
architecture is codenamed "Seattle" and will
be 64 bit ARM processors, based on the
Cortex A57 core design (ARM v8), and will
contain 8 and 16 cores each. They will
include the proprietary SeaMicro "Freedom
Fabric", as well as support for 128 GB RAM,
and ten gigabit Ethernet.
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Advanced Micro Devices AMD chipsets
1
This was the “Open Platform Management
Architecture” with ATI, VIA and SiS
developing their own chipset for Athlon 64
processors and later Athlon 64 X2 and
Athlon 64 FX processors, including the
Quad FX platform chipset from Nvidia.
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Advanced Micro Devices AMD chipsets
The initiative went further with the
release of Opteron server processors
as AMD stopped the design of server
chipsets in 2004 after releasing the
AMD-8111 chipset, and again opened
the server platform for firms to develop
chipsets for Opteron processors. As of
today, Nvidia and Broadcom are the
sole designing firms of server chipsets
for Opteron processors.
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Advanced Micro Devices AMD chipsets
1
Although AMD states the firm will still
produce Intel chipsets, Intel had not
granted the license of 1333 MHz FSB to
ATI.
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Advanced Micro Devices AMD chipsets
1
Discrete graphics chipsets were launched
on November 15, 2007 as part of the
codenamed Spider desktop platform, and
IGP chipsets were launched at a later time
in Spring 2008 as part of the codenamed
Cartwheel platform.
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Advanced Micro Devices AMD chipsets
AMD returned to the server chipsets
market with the AMD 800S series server
chipsets. It includes support for up to six
SATA 6.0 Gbit/s ports, the C6 power state,
which is featured in Fusion processors and
AHCI 1.2 with SATA FIS–based switching
support. This is a chipset family supporting
Phenom processors and Quad FX
enthusiast platform (890FX), IGP(890GX).
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Chipset
1
A chipset is a set of electronic components in
an integrated circuit that manage the data
flow between the processor, memory and
peripherals. It is usually found in the
motherboard of a computer. Chipsets are
usually designed to work with a specific
family of microprocessors. Because it
controls communications between the
processor and external devices, the chipset
plays a crucial role in determining system
performance.
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Chipset
In computing, the term chipset is
commonly used to refer to a set of
specialized chips on a computer's
motherboard or an expansion card. In
personal computers, the first chipset
for the IBM PC AT was the NEAT
chipset by Chips and Technologies for
the Intel 80286 CPU.
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Chipset
1
In home computers, game consoles
and arcade game hardware of the
1980s and 1990s, the term chipset was
used for the custom audio and
graphics chips. Examples include the
Commodore Amiga's Original Chip
Set or SEGA's System 16 chipset.
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Chipset
1
Based on Intel Pentium-class microprocessors,
the term chipset often refers to a specific pair of
chips on the motherboard: the northbridge and the
southbridge. The northbridge links the CPU to very
high-speed devices, especially RAM and graphics
controllers, and the southbridge connects to lowerspeed peripheral buses (such as PCI or ISA). In
many modern chipsets, the southbridge contains
some on-chip integrated peripherals, such as
Ethernet, USB, and audio devices.
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Chipset
1
The manufacturer of a chipset often is
independent from the manufacturer of
the motherboard. Current
manufacturers of chipsets for x86
motherboards include AMD,
Broadcom, Intel, NVIDIA, SiS and VIA
Technologies. Apple computers and
Unix workstations have traditionally
used custom-designed chipsets. Some
server manufacturers also develop
custom chipsets for their products.
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Chipset
In the 1980s, Chips and Technologies
pioneered the manufacturing of chipsets for
PC-compatible computers. Computer
systems produced since then often share
commonly used chipsets, even across widely
disparate computing specialties. For
example, the NCR 53C9x, a low-cost chipset
implementing a SCSI interface to storage
devices, could be found in Unix machines
such as the MIPS Magnum, embedded
devices, and personal computers.
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Chipset Move toward processor integration in PCs
1
This made processor performance highly
dependent on the system chipset especially the northbridge's memory
performance and ability to shuttle this
information back to the processor.
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Chipset Move toward processor integration in PCs
1
As fewer functions are left un-handled by
the processor itself, chipset venders have
condensed the remaining north and
southbridge functions into a single chip
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Amiga Custom chipset
In addition, some models featured
auxiliary custom chips which
performed tasks such as SCSI control
and display de-interlacing.
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BIOS - Chips
1
Flash chips are programmed (and reprogrammed) in-circuit, while EPROM
chips need to be removed from the
motherboard for re-programming
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BIOS - Chips
Beginning with the IBM AT, PCs
supported a hardware clock settable
through BIOS. It had a century bit
which allowed for manually changing
the century when the year 2000
happened. Most BIOS revisions
created in 1995 and nearly all BIOS
revisions in 1997 supported the year
2000 by setting the century bit
automatically when the clock rolled
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BIOS - Chips
1
The first flash chips were attached to
the ISA bus. Starting in 1997, the BIOS
flash moved to the LPC bus, a
functional replacement for ISA,
following a new standard
implementation known as "firmware
hub" (FWH). In 2006, the first systems
supporting a Serial Peripheral
Interface (SPI) appeared, and the BIOS
flash memory moved again.
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BIOS - Chips
1
The size of the BIOS, and the capacities of
the ROM, EEPROM and other media it
may be stored on, has increased over time
as new features have been added to the
code; BIOS versions now exist with sizes
up to 16 megabytes
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BIOS - Chips
1
Some manufacturers used an EPROM version of
this chip which resembled an EPROM
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BIOS - BIOS chip vulnerabilities
EEPROM chips are advantageous
because they could be easily updated by
the user; hardware manufacturers
frequently issue BIOS updates to upgrade
their products, improve compatibility and
remove bugs
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Intel 8086 - Chip versions
The clock frequency was originally
limited to 5 MHz (IBM PC used 4.77
MHz, 4/3 the standard NTSC color
burst frequency), but the last versions
in HMOS were specified for 10 MHz.
HMOS-III and CMOS versions were
manufactured for a long time (at least
a while into the 1990s) for embedded
systems, although its successor, the
80186/80188 (which includes some onchip peripherals), has been more
popular for embedded use.
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Intel 8086 - Chip versions
The 80C86, the CMOS version of the
8086, was used in the GRiDPad, Toshiba
T1200, HP 110, and finally the 1998-1999
Lunar Prospector.
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Intel - Server chips
In July 2011, Intel announced that its
server chips, the Xeon series, will use new
sensors that can improve data center
cooling efficiency.
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ETRAX CRIS - Types of chips
The TGA-1, developed in 1986, was a
communications transceiver for the AS/400
architecture.
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ETRAX CRIS - Types of chips
1
The CGA-1 was just a performance
improvement over the TGA-1.
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Three-dimensional integrated circuit - Notable 3D chips
1
The chip was manufactured with two dies
using face-to-face stacking, which allowed
a dense via structure
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Three-dimensional integrated circuit - Notable 3D chips
1
The Teraflops Research Chip introduced
in 2007 by Intel is an experimental 80core design with stacked memory. Due to
the high demand for memory
bandwidth, a traditional I/O approach
would consume 10 to 25 W. To improve
upon that, Intel designers implemented
a TSV-based memory bus. Each core is
connected to one memory tile in the
SRAM die with a link that provides 12
GB/s bandwidth, resulting in a total
bandwidth of 1 TB/s while consuming
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Three-dimensional integrated circuit - Notable 3D chips
1
One challenge in manufacturing of the
three-dimensional chip was to make all
of the layers work in harmony without
any obstacles that would interfere with
a piece of information traveling from
one layer to another.
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Three-dimensional integrated circuit - Notable 3D chips
1
In ISSCC 2012, two 3D-IC-based multicore designs using GlobalFoundries' 130
nm process and Tezzazon's FaStack
technology were presented and
demonstrated
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Integrated circuit - Chip labeling and manufacture date
1
Most integrated circuits large enough to
include identifying information include four
common sections: the manufacturer's
name or logo, the part number, a part
production batch number and/or serial
number, and a four-digit code that
identifies when the chip was
manufactured. Extremely small surface
mount technology parts often bear only a
number used in a manufacturer's lookup
table to find the chip characteristics.
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Integrated circuit - Chip labeling and manufacture date
1
The manufacturing date is commonly
represented as a two-digit year
followed by a two-digit week code,
such that a part bearing the code 8341
was manufactured in week 41 of 1983,
or approximately in October 1983.
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Integrated circuit - Legal protection of semiconductor chip layouts
1
Integrated circuit layout
design protection
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Integrated circuit - Legal protection of semiconductor chip layouts
1
Like most of the other forms of intellectual
property, IC layout designs are creations
of the human mind
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Integrated circuit - Legal protection of semiconductor chip layouts
The possibility of copying by
photographing each layer of an integrated
circuit and preparing photomasks for its
production on the basis of the photographs
obtained is the main reason for the
introduction of legislation for the protection
of layout-designs.
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Integrated circuit - Legal protection of semiconductor chip layouts
1
A diplomatic conference was held at
Washington, D.C., in 1989, which
adopted a Treaty on Intellectual
Property in Respect of Integrated
Circuits (IPIC Treaty).
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Integrated circuit - Legal protection of semiconductor chip layouts
1
The Treaty on Intellectual Property in
respect of Integrated Circuits, also
called Washington Treaty or IPIC
Treaty (signed at Washington on 26
May 1989) is currently not in force, but
was partially integrated into the TRIPS
agreement.
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Integrated circuit - Legal protection of semiconductor chip layouts
1
National laws protecting IC layout designs
have been adopted in a number of countries.
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Chip (CDMA)
1
In digital communications, a chip is a
pulse of a direct-sequence spread
spectrum (DSSS) code, such as a
pseudo-noise code sequence used in
direct-sequence code division multiple
access (CDMA) channel access
techniques.
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Chip (CDMA)
In a binary direct-sequence system,
each chip is typically a rectangular
pulse of +1 or –1 amplitude, which is
multiplied by a data sequence (similarly
+1 or –1 representing the message bits)
and by a carrier waveform to make the
transmitted signal. The chips are
therefore just the bit sequence out of
the code generator; they are called
chips to avoid confusing them with
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Chip (CDMA)
1
The chip rate of a code is the number of
pulses per second (chips per second) at
which the code is transmitted (or
received). The chip rate is larger than the
symbol rate, meaning that one symbol is
represented by multiple chips. The ratio is
known as the spreading factor (SF) or
processing gain:
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Chip (CDMA) - Orthogonal variable spreading factor
1
Orthogonal variable spreading factor
(OVSF) is an implementation of Code
division multiple access (CDMA) where
before each signal is transmitted, the
signal is spread over a wide spectrum
range through the use of a user's code.
Users' codes are carefully chosen to be
mutually orthogonal to each other.
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Chip (CDMA) - Orthogonal variable spreading factor
1
These codes are derived from an OVSF
code tree, and each user is given a
different, unique code. An OVSF code tree
is a complete binary tree that reflects the
construction of Hadamard matrices.
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Thermal copper pillar bump - A brief history of solder and flip chip/chip scale
packaging
1
This system became known as the controlled
collapse chip connection (C3 or C4).
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Thermal copper pillar bump - A brief history of solder and flip chip/chip scale
packaging
Around this time, Delco sought to
commercialize its technology and formed
Flip Chip Technologies with Kulicke &
Soffa as a partner
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Thermal copper pillar bump - A brief history of solder and flip chip/chip scale packaging
1
(where the package wiring had been
transferred to the chip, and after
bumping, they were ready to be
placed).
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Thermal copper pillar bump - A brief history of solder and flip chip/chip scale
packaging
One of the issues with the CSP type of
package (which was intended to be
soldered directly to an FR4 or flex circuit)
was that for high-density interconnects,
the soft solder bump provided less of a
stand-off as the solder bump diameter and
pitch were decreased
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Thermal copper pillar bump - A brief history of solder and flip chip/chip scale
packaging
Today, flip chip is a well established
technology and collapsed soft solder
connections are used in the vast majority
of assemblies. Interestingly, the copper
post stand-off developed for the CSP
market has found a home in high-density
interconnects for advanced microprocessors and is used today by IBM for
its CPU packaging.
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Infineon Technologies - Chip Card & Security (CCS)
The CCS business provides
microcontrollers for mobile phone SIM
cards, payment cards, security chips and
chip-based solutions for passports, identity
cards and other official documents.
Infineon delivers a significant number of
chips for the new German identity card. In
addition, CCS provides solutions for
applications with high security
requirements such as pay television and
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Digital Light Processing - Single-chip projectors
1
In a projector with a single DLP chip,
colors are produced either by placing a
color wheel between a white lamp and
the DLP chip or by using individual
light sources to produce the primary
colors, LEDs or lasers for example
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Digital Light Processing - Single-chip projectors
The DLP chip is synchronized with the
rotating motion of the color wheel so that
the green component is displayed on the
DMD when the green section of the color
wheel is in front of the lamp. The same is
true for the red, blue and other sections.
The colors are thus displayed sequentially
at a sufficiently high rate that the observer
sees a composite "full color" image. In
early models, this was one rotation per
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Digital Light Processing - Three-chip projectors
1
A three-chip DLP projector uses a prism to
split light from the lamp, and each primary
color of light is then routed to its own DLP
chip, then recombined and routed out
through the lens. Three chip systems are
found in higher-end home theater
projectors, large venue projectors and
DLP Cinema projection systems found in
digital movie theaters.
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Digital Light Processing - Three-chip projectors
In contrast, it is the one-chip DLP
projectors that have the advantage of
allowing any number of primary colors
in a sufficiently fast color filter wheel,
and so the possibility of improved color
gamuts is available.
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Nanorobotics - Biochip
The joint use of nanoelectronics,
photolithography, and new biomaterials
provides a possible approach to
manufacturing nanorobots for common
medical applications, such as for surgical
instrumentation, diagnosis and drug delivery.
This method for manufacturing on
nanotechnology scale is currently in use in
the electronics industry. So, practical
nanorobots should be integrated as
nanoelectronics devices, which will allow teleoperation and advanced capabilities for
medical instrumentation.
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Organ-on-a-chip
1
The convergence of Lab-on-Chips (LOCs)
and cell biology has permitted the study of
human physiology in an organ-specific
context, introducing a novel model of in
vitro multicellular human organisms
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Organ-on-a-chip
Although multiple publications claim to
have translated organ functions onto this
interface, the movement towards this
microfluidic application is still in its infancy.
Organs-on-chips will vary in design and
approach between different researchers.
As such, validation and optimization of
these systems will likely be a long
process. Organs that have been simulated
by microfluidic devices include the heart,
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Organ-on-a-chip
1
A common concern with Organs-on-Chips lies
in the isolation of organs during testing
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Organ-on-a-chip - Brief Overview of Lab-on-Chips (LOCs)
A Lab-on-a-Chip is a device that
integrates one or several laboratory
functions on a single chip that deals
with handling particles in hollow
microfluidic channels
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Organ-on-a-chip - Transitioning from 3D Cell-Culture Models to Organs-onChips
1
Organs-on-Chips are referred to as the
next wave of 3D cell-culture models that
mimic whole living organs’ biological
activities, dynamic mechanical properties
and biochemical functionalities.
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Organ-on-a-chip - Lung-on-a-Chip
1
Lung-on-a-chips are being designed in
an effort to improve the physiological
relevance of existing in vitro alveolarcapillary interface models. Such a
multifunctional microdevice can
reproduce key structural, functional
and mechanical properties of the
human alveolar-capillary interface (i.e.,
the fundamental functional unit of the
living lung).
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Organ-on-a-chip - Lung-on-a-Chip
1
Dongeun Huh from Wyss Institute for
Biologically Inspired Engineering at
Harvard describes their fabrication of a
system containing two closely apposed
microchannels separated by a thin
(10µm) porous flexible membrane made
of PDMS
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Organ-on-a-chip - Lung-on-a-Chip
The compartmentalization of the
channels facilitates not only the flow
of air as a fluid which delivers cells
and nutrients to the apical surface of
the epithelium, but also allows for
pressure differences to exist between
the middle and side channels
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Organ-on-a-chip - Lung-on-a-Chip
1
In order to fully validate the biological
accuracy of a device, its whole-organ
responses must be evaluated. In this
instance, researchers inflicted injuries to
the cells:
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Organ-on-a-chip - Lung-on-a-Chip
1
Pulmonary inflammatory responses entail
a multistep strategy, but alongside an
increased production of epithelial cells and
an early response release of cytokines,
the interface should undergo an increased
number of leukocyte adhesion molecules
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Organ-on-a-chip - Lung-on-a-Chip
Living E-coli bacteria was used to
demonstrate how the system can even
mimic the innate cellular response to a
bacterial pulmonary infection. The bacteria
were introduced onto the apical surface of
the alveolar epithelium. Within hours,
neutrophils were detected in the alveolar
compartment, meaning they had
transmigrated from the vascular
microchannel where the porous
1
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Organ-on-a-chip - Lung-on-a-Chip
1
Nevertheless, published studies admit that
responses of a lung-on-a-chip don’t yet
fully reproduce the responses of native
alveolar epithelial cells.
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Organ-on-a-chip - Heart-on-a-Chip
1
Past efforts to replicate in vivo cardiac
tissue environments have proven to be
challenging due to difficulties when
mimicking contractility and
electrophysiological responses. Such
features would greatly increase the
accuracy of in vitro experiments.
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Organ-on-a-chip - Heart-on-a-Chip
1
Another lab-on-a-chip similarly combined a
microfluidic network in PDMS with planar
microelectrodes, this time to measure
extracellular potentials from single adult
murine cardiomyocytes.
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Organ-on-a-chip - Heart-on-a-Chip
1
This heart-on-a-chip is a biohybrid
construct: an engineered anisotropic
ventricular myocardium is an
elastomeric thin film.
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Organ-on-a-chip - Heart-on-a-Chip
1
The design and fabrication process of
this particular microfluidic device
entails first covering the edges of a
glass surface with tape (or any
protective film) such as to contour the
substrate’s desired shape
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Organ-on-a-chip - Heart-on-a-Chip
1
Researchers have developed a correlation
between tissue stress and the radius of
curvature of the MTF strips during the
contractile cycle, validating the
demonstrated chip as a “platform for
quantification of stress, electrophysiology
and cellular architecture.”
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Organ-on-a-chip - Kidney-on-a-Chip
A kidney-on-a-chip device has the
potential to accelerate research
encompassing artificial replacement for
lost kidney function
1
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Organ-on-a-chip - Kidney-on-a-Chip
The nephron is the functional unit of
the kidney and is composed of a
glomerulus and a tubular component.
Researchers at MIT claim to have
designed a bioartificial device that
replicates the function of the nephron’s
glomerulus, proximal convoluted
tubule and loop of Henle.
1
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Organ-on-a-chip - Kidney-on-a-Chip
1
Each part of the device has its unique
design, generally consisting of two
microfabricated layers separated by a
membrane
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Organ-on-a-chip - Kidney-on-a-Chip
1
In the tubules, some substances are
added to the filtrate as part of the
urine formation, and some substances
reabsorbed out of the filtrate and back
into the blood
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Organ-on-a-chip - Kidney-on-a-Chip
One step towards validating the
microfluidic device’s simulation of the full
filtration and reabsorption behavior of a
physiological nephron would include
demonstrating that the transport properties
between blood and filtrate are identical
with regards to where they occur and what
is being let in by the membrane
1
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Organ-on-a-chip - Artery-on-a-Chip
1
Cardiovascular diseases are often
caused by changes in structure and
function of small blood vessels
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Organ-on-a-chip - Artery-on-a-Chip
Conventional methods used to
examine intrinsic properties of
isolated resistance vessels (arterioles
and small arteries with diameters
varying between 30 µm and 300 µm)
include the pressure myography
technique. However, such methods
currently require manually skilled
personnel and are not scalable. An
artery-on-a-chip could overcome
1
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Organ-on-a-chip - Artery-on-a-Chip
1
An organ-based microfluidic platform has
been developed as a lab-on-a-chip onto
which a fragile blood vessel can be fixed,
allowing for determinants of resistance
artery malfunctions to be studied.
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Organ-on-a-chip - Artery-on-a-Chip
The artery microenvironment is
characterized by surrounding temperature,
transmural pressure, and luminal &
abluminal drug concentrations
1
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Organ-on-a-chip - Artery-on-a-Chip
A thermoelectric heater and a
thermoresistor are connected to the
chip and maintain physiological
temperatures at the artery inspection
area.
1
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Organ-on-a-chip - Artery-on-a-Chip
1
The protocol of loading and securing the
tissue sample into the inspection zone
helps understand how this approach
acknowledges whole organ functions
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Organ-on-a-chip - Human-on-a-Chip
1
Researchers are working towards building
a multi-channel 3D microfluidic cell culture
system that compartmentalizes
microenvironments in which 3D cellular
aggregates are cultured to mimic multiple
organs in the body. Most organ-on-a-chip
models today only culture one cell type, so
even though they may be valid models for
studying whole organ functions, the
systemic effect of a drug on the human
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Organ-on-a-chip - Human-on-a-Chip
Optimized standard media are
generally targeted to one specific celltype, whereas a human-on-a-chip will
evidently require a common medium
(CM)
1
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Organ-on-a-chip - Human-on-a-Chip
Designing whole body biomimetic
devices addresses a major reservation
that pharmaceutical companies have
towards organs-on-chips, namely the
isolation of organs
1
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Organ-on-a-chip - Replacing Animal Testing with Organs-on-Chips
In the early phase of drug
development, animal models were the
only way of obtaining in vivo data that
would predict the human
pharmacokinetic responses
1
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Organ-on-a-chip - Replacing Animal Testing with Organs-on-Chips
The development of MEMS-based
biochips that reproduce complex organlevel pathological responses could
revolutionize many fields, including
toxicology and the developmental process
of pharmaceuticals and cosmetics that rely
on animal testing and clinical trials.
1
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Intel 4004 - Support chips
1
4001: 256-byte ROM (256 8-bit program
instructions), and one built-in 4-bit I/O port.
A 4001 ROM+I/O chip cannot be used in a
system along with a 4008/4009 pair.
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Intel 4004 - Support chips
1
4002: 40-byte RAM (80 4-bit data words),
and one built-in 4-bit output port; the RAM
portion of the chip is organized into four
"registers" of 20 4-bit words:
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Intel 4004 - Support chips
1
16 data words (used for mantissa
digits in the original calculator
design)
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Intel 4004 - Support chips
1
4 status words (used for exponent digits and signs
in the original calculator design)
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Intel 4004 - Support chips
1
4003: 10-bit parallel output shift register for
scanning keyboards, displays, printers, etc.
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Intel 4004 - Support chips
4008: 8-bit address latch for access to
standard memory chips, and one built-in 4bit chip select and I/O port
1
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Intel 4004 - Support chips
1
4289: memory interface (combined
functions of 4008 and 4009)
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Bluetooth low energy - Chip
Bluetooth LE integrated circuit
implementations were announced by
a number of manufacturers
(Broadcom, Texas Instruments, CSR
and Nordic Semiconductor), starting
in late 2009. Commonly, these
implementations use software radio,
so that updates to the specification
can be accommodated through a
device firmware upgrade.
1
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MediaTek - Closed nature of system-on-chip solutions
1
A petition was launched on February,
2013, to ask MediaTek to provide
support for AOSP and custom ROMs.
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Proteomics - Protein Chips
1
The global ICAT technology has striking
advantages over protein chip technologies.
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Apple system on a chip
Apple Inc. has developed a range of
system on a chip|Systems on Chip
(SoC) to power their mobile
device|mobile consumer devices. In
order to meet the stringent power and
space constraints common to mobile
devices, these SoCs combine a central
processing unit (CPU) with other
components into a single compact
physical package.
1
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Apple system on a chip - Early series
Prior to the introduction of the Apple A
series of SoCs, Apple used several SoCs
in early revisions of the iPhone and iPod
Touch. They were specified by Apple and
manufactured by Samsung. They integrate
a single ARM architecture|ARM-based
processing core (CPU), a graphics
processing unit (GPU), and other
electronics necessary to provide mobile
computing functions within a single
1
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Apple system on a chip - Early series
1
The 'APL0098' (also 8900B or S5L8900)
is a package on package (PoP) system
on a chip (SoC) that was introduced on
June 29, 2007 at the launch of the
iPhone (1st generation)|original
iPhone. It includes a 412MHz singlecore ARM11 CPU and a PowerVR MBX
Lite GPU. It is manufactured by
Samsung on a 90 nm semiconductor
device fabrication|process.
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Apple system on a chip - Early series
The 'APL0278' (also S5L8720) is a
package on package (PoP) system on a
chip (SoC) that was introduced on
September 9, 2008 at the launch of the
iPod touch|second generation iPod
touch. It includes a 533MHz singlecore ARM11 CPU and a PowerVR MBX
Lite GPU. It is manufactured by
Samsung on a 65 nm process.
1
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Apple system on a chip - Early series
The 'APL0298' (also S5L8920) is a
package on package (PoP) system on a
chip (SoC) that was introduced on June 8,
2009 at the launch of the iPhone 3GS. It
includes a 600MHz single-core ARM
Cortex-A8|Cortex-A8 CPU and a PowerVR
SGX535 GPU. It is manufactured by
Samsung on a 65nm process. A 45 nm die
shrink|die shrunk version of this SoC, the
'APL2298' (also S5L8922), was introduced
1
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Apple system on a chip - A series
1
The Apple A series is a family of system on
a chip|Systems on Chip (SoC) used in the
iPhone, iPad, iPod, and Apple TV
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Apple system on a chip - Apple A4
1
The chip commercially debuted with the
release of Apple's iPad tablet
computer|tablet; followed shortly by the
iPhone 4 smartphone, the 4th generation
iPod Touch and the 2nd generation Apple
TV
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Apple system on a chip - Apple A4
1
Apple A4 is based on
the ARM processor
architecture.
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Apple system on a chip - Apple A4
1
The first version released ran at 1GHz for
the iPad and contains an ARM Cortex-A8
CPU core paired with a PowerVR#Series5
(SGX)|PowerVR SGX 535 graphics
processing unit|graphics processor (GPU)
built on Samsung's 45-nanometer (nm)
silicon chip fabrication process. The clock
speed for the units used in the iPhone 4
and the iPod Touch (4th generation) is
800MHz. The clock speed for the unit
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Apple system on a chip - Apple A4
1
The Cortex-A8 core used in the A4 is
thought to use performance
enhancements developed by chip
designer Intrinsity (which was
subsequently acquired by Apple) in
collaboration with Samsung
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Apple system on a chip - Apple A4
1
Hence, there is a package with two lowpower 128MB DDR SDRAM Integrated
circuit|chips (totaling 256MB) mounted on
top of the A4 used in the first-generation
iPad, the fourth-generation iPod Touch,
and the second-generation Apple TV
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Apple system on a chip - Apple A5
The 'Apple A5' is a system on a chip
(SoC) designed by Apple and
manufactured by Samsung that
replaced the Apple A4|A4. The chip
commercially debuted with the release
of Apple's iPad 2 tablet computer|tablet
in March 2011, followed by its release in
the iPhone 4S smartphone later that
year. Apple claims that compared with
its predecessor, the A4, the A5 CPU can
1
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Apple system on a chip - Apple A5
The A5 contains a dual-core ARM
Cortex-A9 MPCore|ARM Cortex-A9
CPU with ARM's advanced SIMD
extension, marketed as ARM
NEON|NEON, and a dual core
PowerVR|PowerVR SGX543MP2 GPU
1
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Apple system on a chip - Apple A5
An updated 32 nm version of the A5
processor was used in the third generation
Apple TV, the iPad Mini, and the new
version of iPad 2 (version iPad2,4). The
chip in the Apple TV has one core
disabled. The markings of the square
package indicates that it's named
APL2498, and in software, the chip is
called S5L8942. The 32nm variant of the
A5 provides around 15% better battery life
1
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Apple system on a chip - Apple A5
1
Markings tell that it's named APL7498, and in
software, the chip is called S5L8947.
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Apple system on a chip - Apple A5X
The 'Apple A5X' is a System on a
chip|system-on-a-chip (SoC) designed
by Apple that was announced on
March 7, 2012 at the launch of the iPad
(3rd generation)|third generation
iPad. It is a high performance variant
of the Apple A5; Apple claims it has
twice the graphics performance of the
A5. It was superseded in the iPad (4th
generation)|fourth generation iPad by
1
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Apple system on a chip - Apple A5X
1
This SoC has a quad-core graphics unit
(PowerVR SGX543MP4) instead of the
previous dual-core as well as a quadchannel memory controller that
provides a memory bandwidth of
12.8GB/sec, roughly three times more
than in the A5
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Apple system on a chip - Apple A6
The 'Apple A6' is a package on
package (PoP) system on a chip (SoC)
designed by Apple that was
introduced on September 12, 2012 at
the launch of the iPhone 5. Apple
states that it is up to twice as fast and
has up to twice the graphics power
compared to its predecessor the Apple
A5. It is 22% smaller and draws less
power than the 45nm A5.
1
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Apple system on a chip - Apple A6
1
The A6 is said to use a 1.3GHz custom
Apple-designed ARM
architecture|ARMv7 based Multi-core
processor|dual-core CPU, called
Swift, rather than a licensed CPU from
ARM like in previous designs, and an
integrated 266MHz triple-core
PowerVR SGX 543MP3 graphics
processing unit (GPU)
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Apple system on a chip - Apple A6X
1
'Apple A6X' is a system-on-a-chip (SoC)
designed by Apple, introduced at the
launch of the iPad (4th generation)|fourth
generation iPad on October 23, 2012. It is
a high performance variant of the Apple
A6. Apple claims the A6X has twice the
CPU performance and up to twice the
graphics performance of its predecessor,
the Apple A5X.
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Apple system on a chip - Apple A6X
1
Like the A6, this SoC continues to use
the dual-core Swift CPU, but it has a
new quad core GPU, quad channel
memory and slightly higher 1.4GHz
CPU clock rate. It uses an integrated
quad-core PowerVR SGX 554MP4
graphics processing unit (GPU)
running at 300MHz and a quadchannel Memory controller|memory
subsystem. Compared to the A6 the
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Apple system on a chip - Apple A7
1
The 'Apple A7' is a package on package
(PoP) 64-bit computing|64-bit systemon-a-chip (SoC) designed by Apple. Its
first appearance was in the iPhone 5S,
which was introduced on September
10, 2013. Apple states that it is up to
twice as fast and has up to twice the
graphics power compared to its
predecessor the Apple A6.
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Apple system on a chip - Apple A7
1
The A7 is manufactured by Samsung
on a High-k dielectric|high-κ metal
gate (HKMG) 28 nanometer|28 nm
process and the chip includes over 1
billion transistors on a die 102mm2 in
size.
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AMD - ARM architecture-based chip
AMD intends to release ARM
architecture|ARM System on Chips
(SoC) that will begin sampling in early
2014 and release later in the year.
They will be for use in servers as a
low-power alternative to current x86
chips. The ARM architecture is
codenamed Seattle and will be 64 bit
ARM processors, based on the Cortex
A57 core design (ARM v8), and will
1
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AMD - AMD chipsets
1
This was the “Open Platform Management
Architecture” with ATI Technologies|ATI,
VIA Technologies|VIA and Silicon
Integrated Systems|SiS developing their
own chipset for Athlon 64 processors and
later Athlon 64 X2 and Athlon 64 FX
processors, including the AMD Quad FX
platform|Quad FX platform chipset from
Nvidia.
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AMD - AMD chipsets
1
Although AMD states the firm will still
produce Intel chipsets, Intel had not
granted the license of FSB to ATI.
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AMD - AMD chipsets
Discrete graphics chipsets were
launched on November 15, 2007 as
part of the codenamed Spider desktop
platform, and IGP chipsets were
launched at a later time in Spring 2008
as part of the codenamed Cartwheel
platform.
1
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AMD - AMD chipsets
This is a chipset family supporting
Phenom (processor)|Phenom processors
and AMD Quad FX platform|Quad FX
enthusiast platform (890FX), Integrated
Graphics Processor|IGP(890GX).
1
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History of video game consoles (first generation) - Pong on a chip
1
The table lists only the most known
consoles and relative used chip.
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History of video game consoles (first generation) - Pong on a chip
1
(1) Colors could be
obtained adding the
AY-3-8515 chip
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History of video game consoles (first generation) - Pong on a chip
1
(2) Colors could be
obtained adding the
AY-3-8615 chip
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History of video game consoles (first generation) - Pong on a chip
1
(4) Advanced chip compared to classic Pong-ina-chip: include a microcontroller and a little
RAM.
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Semiconductor chip
1
An 'integrated circuit' or 'monolithic
integrated circuit' (also referred to as
an 'IC', a 'chip', or a 'microchip') is a
set of electronic circuits on one small
plate (chip) of semiconductor
material, normally silicon. This can
be made much smaller than a discrete
circuit made from independent
components.
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Semiconductor chip
1
Integrated circuits are used in virtually all
electronic equipment today and have
revolutionized the world of electronics.
Computers, mobile phones, and other
digital home appliances are now
inextricable parts of the structure of
modern societies, made possible by the
low cost of producing integrated circuits.
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Semiconductor chip
ICs can be made very compact,
having up to several billion transistors
and other electronic components in an
area the size of a fingernail. The width
of each conducting line in a circuit
can be made smaller and smaller as
the technology advances; in 2008 it
dropped below 100 nanometers and in
2013 it is expected to be in the tens of
nanometers.
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Semiconductor chip - Introduction
1
The integration of large numbers of tiny
transistors into a small chip was an
enormous improvement over the manual
assembly of circuits using discrete
electronic components
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Semiconductor chip - Introduction
1
As of 2012, typical chip areas range
from a few square millimeters to
around 450mm2, with up to 9 million
transistors per mm2.
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Semiconductor chip - Terminology
1
An integrated circuit is defined as: A circuit
in which all or some of the circuit elements
are inseparably associated and electrically
interconnected so that it is considered to
be indivisible for the purposes of
construction and commerce
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Semiconductor chip - Invention
Early developments of the integrated
circuit go back to 1949, when the German
engineer (Siemens AG|SiemensAG) filed
a patent for an integrated-circuit-like
semiconductor amplifying device showing
five transistors on a common substrate in
a 3-stage amplifier arrangement. Jacobi
disclosed small and cheap hearing aids as
typical industrial applications of his patent.
An immediate commercial use of his
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Semiconductor chip - Invention
The idea of the integrated circuit was
conceived by a radar scientist working for
the Royal Radar Establishment of the
British Ministry of Defence (United
Kingdom)|Ministry of Defence, Geoffrey
Dummer|Geoffrey W.A
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Semiconductor chip - Invention
1
A precursor idea to the IC was to create
small ceramic squares (wafers), each one
containing a single miniaturized
component
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Semiconductor chip - Invention
Newly employed by Texas
Instruments, Kilby recorded his
initial ideas concerning the integrated
circuit in July 1958, successfully
demonstrating the first working
integrated example on 12 September
1958.[http://www.ti.com/corp/docs/k
ilbyctr/jackbuilt.shtml The Chip that
Jack Built], (c
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Semiconductor chip - Invention
1
Kilby won the 2000 Nobel Prize in Physics
for his part of the invention of the
integrated circuit.Nobel Web AB, (10
October
2000),([http://nobelprize.org/nobel_prizes/
physics/laureates/2000/press.html The
Nobel Prize in Physics 2000], Retrieved 29
May 2008 Kilby's work was named an List
of IEEE milestones|IEEE Milestone in
2009.
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Semiconductor chip - Invention
1
Noyce also came up with his own idea of
an integrated circuit half a year later than
Kilby. His chip solved many practical
problems that Kilby's had not. Produced at
Fairchild Semiconductor, it was made of
silicon, whereas Kilby's chip was made of
germanium.
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Semiconductor chip - Invention
Robert Noyce credited Kurt Lehovec of
Robert C. Sprague (inventor)|Sprague
Electric for the principle of p-n junction
isolation|p-njunction isolation caused by
the action of a biased p-njunction (the
diode) as a key concept behind theIC.Kurt
Lehovec's patent on the isolation p-n
junction: granted on 10 April 1962, filed 22
April 1959. Robert Noyce credits Lehovec
in his article – Microelectronics, Scientific
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Semiconductor chip - Invention
Fairchild Semiconductor was also
home of the first silicon gate IC
technology with self-aligned gates,
which stands as the basis of all
modern CMOS computer chips. The
technology was developed by Italian
physicist Federico Faggin in 1968, who
later joined Intel in order to develop
the very first Central Processing Unit
(CPU) on one chip (Intel 4004), for
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Semiconductor chip - Generations
Over time, millions, and today
billions,Peter Clarke, Intel enters
billion-transistor processor era,
[http://www.eetimes.com/news/latest/sh
owArticle.jhtml?articleID=172301051 EE
Times, 14 October 2005] of transistors
could be placed on one chip, and a
good design required thorough
planning
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Semiconductor chip - SSI, MSI and LSI
1
The first integrated circuits contained
only a few transistors. Called 'smallscale integration' ('SSI'), digital
circuits containing transistors
numbering in the tens provided a few
logic gates for example, while early
linear ICs such as the Plessey SL201
or the Philips TAA320 had as few as
two transistors. The term Large Scale
Integration was first used by IBM
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Semiconductor chip - SSI, MSI and LSI
SSI circuits were crucial to early
aerospace projects, and aerospace
projects helped inspire development of
the technology
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Semiconductor chip - SSI, MSI and LSI
The next step in the development of
integrated circuits, taken in the late 1960s,
introduced devices which contained
hundreds of transistors on each chip,
called 'medium-scale integration' ('MSI').
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Semiconductor chip - SSI, MSI and LSI
They were attractive economically
because while they cost little more to
produce than SSI devices, they allowed
more complex systems to be produced
using smaller circuit boards, less assembly
work (because of fewer separate
components), and a number of other
advantages.
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Semiconductor chip - SSI, MSI and LSI
1
Further development, driven by the same
economic factors, led to 'large-scale
integration' ('LSI') in the mid-1970s, with
tens of thousands of transistors per chip.
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Semiconductor chip - SSI, MSI and LSI
1
Integrated circuits such as 1K-bit RAMs,
calculator chips, and the first
microprocessors, that began to be
manufactured in moderate quantities in the
early 1970s, had under 4000 transistors.
True LSI circuits, approaching 10,000
transistors, began to be produced around
1974, for computer main memories and
second-generation microprocessors.
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Semiconductor chip - VLSI
The final step in the development
process, starting in the 1980s and
continuing through the present, was
very large-scale integration (VLSI).
The development started with
hundreds of thousands of transistors
in the early 1980s, and continues
beyond several billion transistors as of
2009.
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Semiconductor chip - VLSI
1
Manufacturers moved to smaller design
rules and cleaner fabrication facilities, so
that they could make chips with more
transistors and maintain adequate yield
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Semiconductor chip - VLSI
1
Microprocessor chips passed the million
transistor mark in 1989 and the billion
transistor mark in 2005.Peter Clarke, EE
Times: Intel enters billion-transistor
processor era, 14 November 2005 The
trend continues largely unabated, with
chips introduced in 2007 containing tens of
billions of memory transistors.Antone
Gonsalves, EE Times, Samsung begins
production of 16-Gb flash, 30 April 2007
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Semiconductor chip - ULSI, WSI, SOC and 3D-IC
1
To reflect further growth of the complexity,
the term ULSI that stands for ultra-largescale integration was proposed for chips of
complexity of more than 1 million
transistors.
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Semiconductor chip - ULSI, WSI, SOC and 3D-IC
1
Wafer-scale integration (WSI) is a system
of building very-large integrated circuits
that uses an entire silicon wafer to
produce a single super-chip. Through a
combination of large size and reduced
packaging, WSI could lead to dramatically
reduced costs for some systems, notably
massively parallel supercomputers. The
name is taken from the term Very-LargeScale Integration, the current state of the
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Semiconductor chip - ULSI, WSI, SOC and 3D-IC
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A system-on-a-chip (SoC or SOC) is an
integrated circuit in which all the
components needed for a computer or
other system are included on a single
chip
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Semiconductor chip - ULSI, WSI, SOC and 3D-IC
1
A three-dimensional integrated circuit (3DIC) has two or more layers of active
electronic components that are integrated
both vertically and horizontally into a
single circuit. Communication between
layers uses on-die signaling, so power
consumption is much lower than in
equivalent separate circuits. Judicious use
of short vertical wires can substantially
reduce overall wire length for faster
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Semiconductor chip - Advances in integrated circuits
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Digital Random access memory|memory
chips and application-specific integrated
circuits (ASIC)s are examples of other
families of integrated circuits that are
important to the modern information
society
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Semiconductor chip - Advances in integrated circuits
ICs have consistently migrated to
smaller feature sizes over the years,
allowing more circuitry to be packed
on each chip
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Semiconductor chip - Advances in integrated circuits
1
In current research projects, integrated
circuits are also developed for sensoric
applications in implant (medicine)|medical
implants or other
bioelectronics|bioelectronic devices
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Semiconductor chip - Classification
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Integrated circuits can be classified into
analog circuit|analog, digital circuit|digital
and mixed-signal integrated circuit|mixed
signal (both analog and digital on the
same chip).
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Semiconductor chip - Classification
1
Digital integrated circuits can contain
anywhere from one to millions of logic
gates, flip-flop (electronics)|flip-flops,
multiplexers, and other circuits in a few
square millimeters. The small size of
these circuits allows high speed, low
power dissipation, and reduced
manufacturing cost compared with
board-level integration. These digital
ICs, typically microprocessors, digital
signal processors|DSPs, and micro
controllers, work using binary
mathematics to process one and zero
signals.
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Semiconductor chip - Classification
Analog ICs, such as sensors, power
network design (IC)|power management
circuits, and operational amplifiers, work
by processing continuous signals. They
perform functions like
Amplifier|amplification, active filtering,
demodulation, and Frequency
mixer|mixing. Analog ICs ease the burden
on circuit designers by having expertly
designed analog circuits available instead
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Semiconductor chip - Classification
ICs can also combine analog and
digital circuits on a single chip to
create functions such as Analog-todigital converter|A/D converters and
digital-to-analog converter|D/A
converters. Such mixed-signal circuits
offer smaller size and lower cost, but
must carefully account for signal
interference.
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Semiconductor chip - Classification
1
often further sub-categorize the huge variety of
integrated circuits now available:
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Semiconductor chip - Classification
1
* Digital ICs are further sub-categorized
as logic ICs, semiconductor
memory|memory chips, interface ICs
(logic level|level shifters,
serializer/deserializer, etc.), Power
Management ICs, and programmable
devices.
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Semiconductor chip - Classification
* Analog ICs are
further subcategorized as linear
ICs and RF ICs.
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Semiconductor chip - Classification
* mixed-signal integrated circuits are
further sub-categorized as data acquisition
ICs (including A/D converters, D/A
converter, digital potentiometers) and
clock/timing ICs.
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Semiconductor chip - Fabrication
1
The semiconductors of the periodic table
of the chemical elements were identified
as the most likely materials for a solidstate (electronics)|solid-state vacuum tube
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Semiconductor chip - Fabrication
1
Semiconductor ICs are fabricated in a layer
process which includes these key process
steps:
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Semiconductor chip - Fabrication
1
The main process steps
are supplemented by
doping and cleaning.
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Semiconductor chip - Fabrication
Monocrystalline silicon|Mono-crystal
silicon wafer (electronics)|wafers (or for
special applications, silicon on sapphire or
gallium arsenide wafers) are used as the
substrate. Photolithography is used to
mark different areas of the substrate to be
Doping (Semiconductors)|doped or to
have polysilicon, insulators or metal
(typically aluminium) tracks deposited on
them.
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Semiconductor chip - Fabrication
1
* Integrated circuits are composed of
many overlapping layers, each defined
by photolithography, and normally
shown in different colors
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Semiconductor chip - Fabrication
1
* In a self-aligned CMOS process, a
transistor is formed wherever the gate
layer (polysilicon or metal) crosses a
diffusion layer.
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Semiconductor chip - Fabrication
1
* capacitor|Capacitive structures, in form
very much like the parallel conducting
plates of a traditional electrical capacitor,
are formed according to the area of the
plates, with insulating material between
the plates. Capacitors of a wide range of
sizes are common on ICs.
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Semiconductor chip - Fabrication
1
* Meandering stripes of varying lengths
are sometimes used to form on-chip
resistors, though most logic circuits do not
need any resistors. The ratio of the length
of the resistive structure to its width,
combined with its sheet resistivity,
determines the resistance.
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Semiconductor chip - Fabrication
1
* More rarely, inductor|inductive structures
can be built as tiny on-chip coils, or
simulated by gyrators.
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Semiconductor chip - Fabrication
1
Since a CMOS device only draws current
on the transition between boolean algebra
(logic)|logic State (computer
science)|states, CMOS devices consume
much less current than bipolar
transistor|bipolar devices.
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Semiconductor chip - Fabrication
1
A random access memory is the most
regular type of integrated circuit; the
highest density devices are thus
memories; but even a microprocessor
will have memory on the chip
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Semiconductor chip - Fabrication
As of 2005, a Semiconductor
fabrication plant|fabrication facility
(commonly known as a semiconductor
fab) costs over US$1 billion to
construct.For example, Intel Fab 28
cost $3.5 billion, while its neighboring
Fab 18 cost $1.5 billion
http://www.theinquirer.net/default.as
px?article=29958 The cost of a
fabrication facility rises over time
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Semiconductor chip - Fabrication
1
* The wafers are up to 300mm in
diameter (wider than a common
dinner plate).
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Semiconductor chip - Fabrication
1
* Use of 32 nanometer or smaller chip
manufacturing process. Intel, IBM,
NEC, and AMD are using ~32
nanometers for their central processing
unit|CPU chips. IBM and AMD
introduced immersion lithography for
their 45nm processes
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Semiconductor chip - Fabrication
1
* Copper interconnects where copper wiring
replaces aluminium for interconnects.
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Semiconductor chip - Fabrication
1
* Low-K dielectric
insulators.
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Semiconductor chip - Fabrication
1
* Strained silicon in a process used by IBM
known as strained silicon directly on insulator
(SSDOI)
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Semiconductor chip - Fabrication
* Multigate devices such as tri-gate
transistors being manufactured by Intel
from 2011 in their 22nm process.
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Semiconductor chip - Packaging
1
In the 1980s pin counts of VLSI circuits
exceeded the practical limit for DIP
packaging, leading to pin grid array (PGA)
and leadless chip carrier (LCC) packages
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Semiconductor chip - Packaging
1
In the late 1990s, PQFP|plastic quad flat
pack (PQFP) and thin small-outline
package (TSOP) packages became the
most common for high pin count devices,
though PGA packages are still often used
for high-end microprocessors. Intel and
AMD are currently transitioning from PGA
packages on high-end microprocessors to
land grid array (LGA) packages.
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Semiconductor chip - Packaging
1
Flip-chip Ball Grid Array packages, which
allow for much higher pin count than other
package types, were developed in the
1990s
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Semiconductor chip - Packaging
Traces out of the die, through the
package, and into the printed circuit
board have very different electrical
properties, compared to on-chip
signals. They require special design
techniques and need much more
electric power than signals confined to
the chip itself.
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Semiconductor chip - Packaging
When multiple dies are put in one
package, it is called SiP, for System In
Package. When multiple dies are
combined on a small substrate, often
ceramic, it's called an MCM, or
Multi-Chip Module. The boundary
between a big MCM and a small
printed circuit board is sometimes
fuzzy.
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Semiconductor chip - Other developments
This allows a single chip to be
programmed to implement different LSItype functions such as logic gates, adder
(electronics)|adders and processor
register|registers
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Semiconductor chip - Other developments
The techniques perfected by the
integrated circuits industry over the
last three decades have been used to
create very small mechanical devices
driven by electricity using a
technology known as
microelectromechanical systems.
These devices are used in a variety of
commercial and military
applications. Example commercial
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Semiconductor chip - Other developments
In the past, radios could not be
fabricated in the same low-cost
processes as microprocessors. But
since 1998, a large number of radio
chips have been developed using
CMOS processes. Examples include
Intel's DECT cordless phone, or
Atheros's 802.11 card.
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Semiconductor chip - Other developments
1
Chip revolution poses problems for programmers,
New Scientist (Vol 193, Number 2594)
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Semiconductor chip - Other developments
1
Since the early 2000s, the integration
of optical functionality into silicon
chips has been actively pursued in
both academic research and in
industry resulting in the successful
commercialization of silicon based
integrated optical transceivers
combining optical devices
(modulators, detectors, routing) with
CMOS based electronics.
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Semiconductor chip - Silicon labelling and graffiti
To allow identification during production
most silicon chips will have a serial
number in one corner. It is also common to
add the manufacturer's logo. Ever since
ICs were created, some chip designers
have used the silicon surface area for
surreptitious, non-functional images or
words. These are sometimes referred to
as chip art, silicon art, silicon graffiti or
silicon doodling.
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Semiconductor chip - ICs and IC families
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* 7400 series Transistortransistor logic|TTL logic
building blocks
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Semiconductor chip - ICs and IC families
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* 4000 series, the CMOS counterpart to the
7400 series (see also: HCMOS|74HC00 series)
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Semiconductor chip - ICs and IC families
* Intel 4004, the world's first
microprocessor, which led to the
famous Intel 8080|8080 CPU and then
the IBM PC's Intel 8088|8088, 80286,
Intel i486|486 etc.
1
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Semiconductor chip - ICs and IC families
* The MOS Technology 6502 and Zilog
Z80 microprocessors, used in many home
computers of the early 1980s
1
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Semiconductor chip - ICs and IC families
1
* The Motorola 6800 series of computerrelated chips, leading to the 68000 and
88000 series (used in some Apple
computers and in the 1980s Commodore
Amiga series).
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Semiconductor chip - ICs and IC families
1
* The List of LM-series integrated circuits|LM-series
of analog integrated circuits.
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System-on-chip
1
A 'system on a chip' or 'system on chip'
('SoC' or 'SOC') is an integrated circuit
('IC') that integrates all components of a
computer or other Electronics|electronic
system into a single chip. It may contain
Digital signal|digital, Analog signal|analog,
Mixed-signal integrated circuits|mixedsignal, and often radio-frequency
functions—all on a single chip substrate
(electronics)|substrate. A typical
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System-on-chip
Many interesting systems are too
complex to fit on just one chip built
with a process optimized for just one of
the system's tasks.
1
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System-on-chip
1
When it is not feasible to construct a SoC
for a particular application, an alternative
is a system in package (SiP) comprising a
number of chips in a single Chip
carrier|package. In large volumes, SoC is
believed to be more cost-effective than SiP
since it increases the yield of the
fabrication and because its packaging is
simpler.
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System-on-chip
1
Another option, as seen for example in higher
end cell phones and on the BeagleBoard, is
package on package stacking during board
assembly. The SoC chip includes processors
and numerous digital peripherals, and comes
in a Ball grid array|ball grid package with
lower and upper connections. The lower balls
connect to the board and various peripherals,
with the upper balls in a ring holding the
memory buses used to access NAND flash
and DDR2 RAM. Memory packages could
come from multiple vendors.
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System-on-chip - Structure
1
* A microcontroller, microprocessor or
digital signal processor|DSP core(s).
Some SoCs—called multiprocessor
system on chip (MPSoC)—include more
than one processor core.
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System-on-chip - Structure
1
* Memory blocks including a selection of
Read-only memory|ROM, Random access
memory|RAM, EEPROM and flash
memory.
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System-on-chip - Structure
* Timing sources
including oscillators
and phase-locked
loops.
1
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System-on-chip - Structure
1
* Peripherals including counter-timers, real-time
timers and power-on reset generators.
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System-on-chip - Structure
* External Electrical
connector|interfaces including industry
standards such as Universal Serial
Bus|USB, FireWire, Ethernet, USART,
Serial Peripheral Interface Bus|SPI.
1
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System-on-chip - Structure
1
* Analog signal|Analog interfaces including
Analog to digital converter|ADCs and
Digital to analog converter|DACs.
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System-on-chip - Structure
* Voltage regulators and
power management circuits.
1
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System-on-chip - Structure
1
These blocks are connected by either a
proprietary or industry-standard
Computer bus|bus such as the
Advanced Microcontroller Bus
Architecture|AMBA bus from ARM
Holdings. Direct Memory Access|DMA
controllers route data directly between
external Electrical connector|interfaces
and memory, bypassing the processor
core and thereby increasing the data
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System-on-chip - Design flow
A SoC consists of both the Computer
hardware|hardware described above, and
the Computer software|software
controlling the microcontroller,
microprocessor or digital signal
processing|DSP cores, peripherals and
interfaces. The Design flow (EDA)|design
flow for a SoC aims to develop this
hardware and software in parallel.
1
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System-on-chip - Design flow
1
Most SoCs are developed from prequalified Semiconductor intellectual
property core|hardware blocks for the
hardware elements described above,
together with the Device
driver|software drivers that control
their operation
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System-on-chip - Design flow
1
With the growing complexity of chips,
hardware verification languages like
SystemVerilog, SystemC, e (verification
language)|e, and OpenVera are being
used
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System-on-chip - Design flow
Traditionally, engineers have
employed simulation acceleration,
Emulator|emulation and/or an FPGA
prototype to verify and debug both
hardware and software for SoC
designs prior to tapeout
1
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System-on-chip - Design flow
FPGA prototypes, in contrast, use
FPGAs directly to enable engineers to
validate and test at, or close to, a
system’s full operating frequency with
real-world stimulus. Tools such as
Certus are used to insert probes in the
FPGA RTL that make signals available
for observation. This is used to debug
hardware, firmware and software
interactions across multiple FPGA with
1
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System-on-chip - Design flow
After debug the hardware of the SoC
follows the place and route|place-androute phase of the design of an integrated
circuit or Application-specific integrated
circuit|ASIC before it is fabricated.
1
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System-on-chip - Fabrication
1
SoCs can be fabricated by several
technology|technologies, including:
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System-on-chip - Fabrication
1
SoC designs usually consume less
power and have a lower cost and
higher reliability than the multi-chip
systems that they replace. And with
fewer packages in the system,
assembly costs are reduced as well.
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System-on-chip - Fabrication
1
However, like most VLSI designs, the total
cost is higher for one large chip than for
the same functionality distributed over
several smaller chips, because of
Semiconductor device fabrication#Device
test|lower yields and higher Non-recurring
engineering|NRE costs.
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Bluetooth SMART - Chip
1
Bluetooth LE integrated circuit implementations
were announced by a number of manufacturers
(Broadcom,[http://www.broadcom.com/press/r
elease.php?id=s443734 Broadcom press release,
Feb 2010] Texas
Instruments,[http://newscenter.ti.com/index.ph
p?s=32851item=123734 TI press release Oct
2009] CSR
plc|CSR[http://www.csr.com/news/pr/release/
16/en CSR press release Dec 2009] and Nordic
Semiconductor[http://www.nordicsemi.com/en
g/News/Press-Releases/Product-RelatedNews/Nordic-Semiconductor-ships-samplesand-development-kits-for-its-Blue-Bluetooth-lowenergy-single-mode-solution-to-lead-customers
Nordic press release Nov 2009]), starting in late
2009
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Microchip Technology
'Microchip Technology' is an
USA|American manufacturer of
microcontroller, memory and analog
semiconductors. Its products include
microcontrollers (PIC
microcontroller|PICmicro, PIC24#PIC24
and dsPIC 16-bit
microcontrollers|dsPIC / PIC24, PIC32),
Serial EEPROM devices, Serial Static
random access memory|SRAM devices,
1
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Microchip Technology
1
Some of the interface devices include USB,
ZigBee/MiWi, Controller Area Network, and
Ethernet.
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Microchip Technology
Corporate headquarters is located at
Chandler, Arizona with wafer fabs in
Tempe, Arizona and Gresham, Oregon.
Sales for the fiscal year ended March 31,
2013 were $1,581,623,000.
1
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Microchip Technology
1
Among its chief competitors are Analog
Devices, Atmel, Freescale (spin-off from
Motorola), Infineon, Maxim Integrated
Products, NXP Semiconductors (spin-off
from Philips), Renesas Electronics
Corporation|Renesas Electronics,
STMicroelectronics, and Texas
Instruments.
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Microchip Technology - History
1
The company was founded in 1987 when
General Instrument spun off its
microelectronics division as a wholly
owned subsidiary. Microchip Technology
became an independent company in 1989
when it was acquired by a group of
venture capitalists, and went public in
1993.
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Microchip Technology - History
In April 2009, Microchip Technology
announced the nanoWatt XLP
Microcontrollers (With World’s Lowest
Sleep Current).Quick, Darren.
[http://www.gizmag.com/nanowatt-xlpmicrocontrollers/11575/ nanoWatt XLP
Microcontrollers claim world’s lowest sleep
current] gizmag April 30, 2009 Microchip
Technology had sold more than 6 billion
microcontrollers as of 2009.
1
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Microchip Technology - History
In April 2010, Microchip acquired
Silicon Storage Technology (SST), and
sold several SST flash memory assets
to Greenliant Systems in May that year.
1
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Microchip Technology - History
In September 2011, Microchip
Technology shipped the 10 billionth
PIC
microcontroller.[http://www.microch
ip.com/pagehandler/en-us/pressrelease/microchip-technologydelivers-10-billionth-pic-mic.html
Microchip Technology Delivers 10
Billionth PIC® Microcontroller]
1
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Microchip Technology - History
1
In August 2012, Microchip acquired
Standard Microsystems Corporation
(SMSC).
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Microchip Technology - HI-TECH Software
Founded in 1984, the company is best
known for its HI-TECH C PRO compilers
with whole-program compilation
technology, or Omniscient Code
Generation
(OCG).[http://electronicdesign.com/Articles
/Index.cfm?AD=1AD=1ArticleID=15352
Whole Program C Compiler Optimizes
Across Modules] HI-TECH Software was
bought by Microchip on 20 February
1
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Microchip Technology - Supported manufacturers and architectures
HI-TECH Software has also provided
compilers for the following manufacturers
and architectures, but none of them are
advertised since the Microchip acquisition:
1
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Microchip Technology - Supported manufacturers and architectures
1
* Z80 for CP/M The Internet Archive's
Wayback Machine saved a copy of the
compiler, available
[http://web.archive.org/web/2007022105
3727/http://www.htsoft.com/products/C
PM.php here] and a installing turorial is
available
[http://techtinkering.com/2008/10/22/ins
talling-the-hi-tech-z80-c-compiler-forcpm/ here]. and Z80 cross compiler.
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ATI Technologies - Computer graphics chipsets
1
* 'ATI Wonder series|Graphics Solution /
Small Wonder' – Series of 8-bit Industry
Standard Architecture|ISA cards with
Monochrome Display Adapter|MDA,
Hercules Graphics Card|Hercules, Color
Graphics Adapter|CGA and Plantronics
Colorplus|Plantronics Color+ compatibility.
Later versions added Enhanced Graphics
Adapter|EGA support.
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ATI Technologies - Computer graphics chipsets
* 'ATI Mach|Mach Series' –
Introduced ATI's first 2D computer
graphics|2D graphical user
interface|GUI Windows Accelerator.
As the series evolved, GUI
acceleration improved dramatically
and early video acceleration
appeared.
1
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ATI Technologies - Computer graphics chipsets
1
The various chips were very popular with
Original equipment manufacturer|OEMs of
the time
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ATI Technologies - Computer graphics chipsets
** 'ATI Rage#Mobility|Rage Mobility' –
Designed for use in low-power
environments, such as notebooks. These
chips were functionally similar to their
desktop counterparts, but had additions
such as advanced power management,
Liquid crystal display|LCD interfaces, and
Multi monitor|dual monitor functionality.
1
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ATI Technologies - Computer graphics chipsets
* 'Radeon Series' – ATI launched the
Radeon line in 2000 as their consumer 3D
accelerator add-in cards, its flagship
product line and the direct competitor to
Nvidia's GeForce
1
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ATI Technologies - Computer graphics chipsets
** 'Radeon|Mobility Radeon' – A
series of power-optimized versions of
Radeon graphics chips for use in
laptops. They introduced innovations
such as modularized RAM chips, DVD
(MPEG2) acceleration, notebook GPU
card sockets, and ATI
PowerPlay|PowerPlay power
management technology. AMD
recently announced DirectX 111
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ATI Technologies - Computer graphics chipsets
1
It allowed, by using a secondary video
card and a dual PCI-E motherboard
based on an ATI Crossfire-compatible
chipset, the ability to combine the
power of the two, three or four video
cards to increase performance
through a variety of different
rendering options
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ATI Technologies - Computer graphics chipsets
1
* 'FireGL/FirePro' – Launched in 2001,
following ATI's acquisition of FireGL
Graphics from Diamond Multimedia.
Workstation CAD/CAM video card, based
on the Radeon series.
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ATI Technologies - Computer graphics chipsets
*'FireMV' – For workstations,
featuring multi-view, for multiple
displays with 2D acceleration only,
usually based on low-end products of
the Radeon series (now integrated into
FirePro series).
1
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ATI Technologies - Computer graphics chipsets
1
Although AMD strongly considered making
the functional part of the ATI drivers open
source, before the merger with AMD, ATI
had no plans to release their graphics
drivers as free software:
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ATI Technologies - Personal computer platforms and chipsets
*'Radeon R100|IGP 3x0, Radeon
R100|Mobility Radeon 7000 IGP' –
ATI's first chipsets. Included a
DirectX 7-level 3D graphics processor.
1
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ATI Technologies - Personal computer platforms and chipsets
*'Radeon R200|9100 IGP' – 2nd
generation system chipset. IXP250
southbridge. It was notable for being ATI's
first complete motherboard chipset,
including an ATI-built southbridge. It
included an updated DirectX 8.1 class
graphics processor Gavrichenkov, Ilya.
[http://www.xbitlabs.com/articles/chipsets/d
isplay/ati-igp9100.html ATI RADEON 9100
IGP Integrated Chipset Review], X-bit
1
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ATI Technologies - Personal computer platforms and chipsets
*'Xpress 200|Xpress 200/200P' – PCI
Express-based Athlon 64 and Pentium
4 chipset. Supports SATA as well as
integrated graphics with DirectX 9.0
support, the first integrated graphics
chipset to do so Wasson, Scott.
[http://techreport.com/reviews/2004q4/r
adeon-xpress200/index.x?pg=1 ATI's
Radeon Xpress 200 chipset], Tech
Report, November 8, 2004.
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ATI Technologies - Personal computer platforms and chipsets
1
*'Xpress 3200' – similar to Xpress 200,
but designed for optimal ATI
CrossFire|CrossFire performance.
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ATI Technologies - Personal computer platforms and chipsets
The deal with Intel ended with the
purchase of ATI by AMD in 2006, with
Intel announcing Silicon Integrated
Systems|SiS IGP chipset (D201GLY
chipset, codenamed Little Valley) for
entry-level desktop platform,
replacing the Grand County series
chipsets.
1
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ATI Technologies - Handheld chipsets
1
* 'Imageon' – System-on-a-chip (SoC)
design introduced in 2002 to bring
integrated 2D computer graphics|2D
and 3D computer graphics|3D
graphics to handhelds devices,
cellphones and Tablet
computer|Tablet PCs. The Imageon
2298 included DVD quality recording
and playback, TV output, and
supported up to a 12-megapixel
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ATI Technologies - Handheld chipsets
1
* 'Imageon|Imageon TV' – Announced
in February 2006, allowing handhelds
devices to receive digital broadcast
TV (DVB-H) signals and enables
watching TV programs on these
devices, the chipset includes tuner,
demodulator, decoder, and a full
software stack, operates alongside the
Imageon chip.
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ATI Technologies - Handheld chipsets
1
Besides full products, ATI also supplied
3D and 2D graphics components to
other vendors, specifically the
Qualcomm[http://brew.qualcomm.com/
bnry_brew/pdf/brew_2007/Tech303_Ligon.pdf page 10 and 15]
MSM7000 series SoC chips of handheld
and upcoming Freescale i
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ATI Technologies - Handheld chipsets
1
After the AMD acquisition, the Imageon
and Xilleon were sold off to Qualcomm
and Broadcom, respectively.
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Neurochip
A 'neurochip' is a chip (integrated
circuit/microprocessor) that is designed for
the interaction with neuronal cells.
1
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Neurochip - Formation
1
The University of Calgary, Faculty of
Medicine scientists who proved it is
possible to cultivate a network of
brain cells that reconnect on a silicon
chip—or the brain on a microchip—
have developed new technology that
monitors brain cell activity at a
resolution never achieved before.
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Neurochip - Formation
1
Developed with the National Research
Council Canada (NRC), the new
silicon chips are also simpler to use,
which will help future understanding
of how brain cells work under normal
conditions and permit drug
discoveries for a variety of
neurodegenerative diseases, such as
Alzheimer’s and Parkinson’s.
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Neurochip - Formation
Naweed Syed's lab
cultivated brain cells on a
microchip.
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Neurochip - Formation
The new technology from the lab of
Naweed Syed, in collaboration with the
NRC, is published online this month in the
journal, Biomedical Devices.
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Neurochip - Formation
“This technical breakthrough means we
can track subtle changes in brain activity
at the level of ion channels and synaptic
potentials, which are also the most
suitable target sites for drug development
in neurodegenerative diseases and
neuropsychological disorders,” says Syed,
professor and head of the Department of
Cell Biology and Anatomy, member of the
Hotchkiss Brain Institute and advisor to the
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Neurochip - Formation
Now, larger networks of cells can be
placed on a chip and observed in minute
detail, allowing the analysis of several
brain cells networking and performing
automatic, large-scale drug screening for
various brain dysfunctions.
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Neurochip - Formation
1
This new technology has the potential to
help scientists in a variety of fields and on
a variety of research projects. Gerald
Zamponi, professor and head of the
Department of Physiology and
Pharmacology, and member of the
Hotchkiss Brain Institute, says, “This
technology can likely be scaled up such
that it will become a novel tool for medium
throughput drug screening, in addition to
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Neurochip - Formation
In previous studies, researchers
developed a neurochip that could directly
stimulate and record brain cell activity.
Now, Orly Yadid-Pecht and Naweed Syed
have successfully developed a novel labon-a-chip technology that, through an
ultra-sensitive component built directly on
the microchip, also enables direct imaging
of activity in brain
cells.[http://www.ucalgary.ca/news/utoday/
1
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Neurochip - Applications
1
Present applications are neuron research.
Future applications (still in the
experimental phase) are retinal implants or
brain implants.
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Biochip
In molecular biology, 'biochips' are
essentially miniaturized laboratories that
can perform hundreds or
1
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Biochip
1
thousands of simultaneous biochemical
reactions. Biochips enable researchers to
quickly screen large numbers of biological
analytes for a variety of purposes, from
disease diagnosis to detection of
bioterrorism agents.
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Biochip - History
1
The development started with early work
on the underlying sensor technology. One
of the first portable, chemistry-based
sensors was the glass electrode|glass pH
electrode, invented in 1922 by Hughes
(Hughes, 1922). Measurement of pH was
accomplished by
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Biochip - History
1
using exchange sites to
create permselective
membranes was used
to develop
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Biochip - History
other Ion selective electrode|ion sensors in
subsequent years. For example, a K+ sensor was
1
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Biochip - History
produced by
incorporating
valinomycin into a
thin membrane
(Schultz, 1996).
1
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Biochip - History
Over thirty years
elapsed before the
first true biosensor
(i.e. a
1
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Biochip - History
sensor utilizing biological
molecules) emerged. In 1956,
Leland Clark
1
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Biochip - History
published a paper on an Clark
electrode|oxygen sensing electrode (Clark,
1956_41).
1
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Biochip - History
This device became the
basis for a glucose
sensor developed in 1962
by Clark
1
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Biochip - History
and colleague Lyons
which utilized glucose
oxidase molecules
embedded in a
1
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Biochip - History
dialysis membrane
(Clark, 1962). The
enzyme functioned in the
1
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Biochip - History
presence of glucose to decrease the
amount of oxygen available to the oxygen
electrode, thereby relating oxygen levels
to glucose concentration. This and
1
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Biochip - History
1
similar biosensors
became known as
enzyme electrodes,
and are still in use
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Biochip - History
1
In 1953, James D. Watson|Watson and
Francis Crick|Crick announced their
discovery of the now familiar
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Biochip - History
1
double helix structure of
DNA molecules and set
the stage for genetics
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Biochip - History
1
research that continues
to the present day
(Nelson, 2000). The
development
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Biochip - History
of sequencing
techniques in 1977 by
Walter Gilbert|Gilbert
(Maxam, 1977) and
1
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Biochip - History
directly read the
genetic codes that
provide instructions
for
1
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Biochip - History
1
protein biosynthesis|protein synthesis.
This research showed how hybridisation
(molecular biology)|hybridization of
complementary single
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Biochip - History
oligonucleotide strands
could be used as a basis for
DNA sensing. Two
1
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Biochip - History
additional
developments
enabled the
technology used in
modern DNA-based
1
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Biochip - History
1
biosensors. First, in 1983 Kary
Mullis invented the
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Biochip - History
1
(PCR) technique (Nelson, 2000), a
method for amplifying DNA
concentrations.
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Biochip - History
1
This discovery made possible
the detection of extremely small
quantities of
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Biochip - History
DNA molecules with
fluorescent tags instead
of
1
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Biochip - History
radiolabels (Smith,
1986), thus enabling
hybridization
experiments to
1
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Biochip - History
1
The rapid technological advances of the
biochemistry and semiconductor fields
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Biochip - History
1
Figure 1 shows the
make up of a typical
biochip platform.
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Biochip - History
The actual sensing
component (or chip) is just
one piece of a complete
1
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Biochip - History
1
analysis system. Transducer|Transduction must be
done to translate the actual sensing
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Biochip - History
event (DNA binding,
redox|oxidation/reductio
n, etc.) into a format
1
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Biochip - History
1
understandable by a computer
(voltage, light intensity, mass,
etc.),
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Biochip - History
which then enables
additional analysis and
processing to produce
a final,
1
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Biochip - History
human-readable
output. The multiple
technologies needed to
make a successful
1
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Biochip - History
1
require a true multidisciplinary approach, making the
barrier to entry steep.
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Biochip - History
1
One of the first commercial
biochips was introduced by
Affymetrix. Their
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Biochip - History
1
GeneChip products contain
thousands of individual DNA
sensors for use in
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Biochip - History
1
sensing defects, or single
nucleotide polymorphisms
(SNPs), in genes such as
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Biochip - History
1
cancer) (Cheng, 2001). The chips
are produced using
microlithography
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Biochip - History
1
techniques traditionally
used to fabricate
integrated circuits (see
below).
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Biochip - History
1
being commercialized. Numerous
advancements continue to be
made in sensing
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Biochip - History
1
Cancer diagnosis through DNA typing is just one
market opportunity. A variety
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Biochip - History
of industries currently
desire the ability to
simultaneously screen for
a
1
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Biochip - History
1
wide range of chemical and
biological agents, with
purposes ranging from
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Biochip - History
1
testing public water
systems for disease
agents to screening
airline cargo
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Biochip - History
for explosives. Pharmaceutical
companies wish to combinatorially
screen drug
1
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Biochip - History
1
Numerous transduction methods can be
employed including surface plasmon
resonance, fluorescence, and
chemiluminescence. The particular
sensing and
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Biochip - History
1
transduction techniques chosen depend on factors
such as price, sensitivity, and reusability.
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Biochip - Microarray fabrication
1
The microarray mdash; the dense, twodimensional grid of biosensors mdash; is
the critical component of a biochip
platform. Typically, the sensors are
deposited on a flat substrate, which may
either be passive (e.g. silicon or glass) or
active, the latter
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Biochip - Microarray fabrication
consisting of integrated electronics or
microtechnology|micromechanical devices
that perform or assist signal transduction.
Surface chemistry is used to covalent
bond|covalently bind the sensor molecules
to the substrate medium. The fabrication
of microarrays is non-trivial and is a major
economic and technological hurdle that
may
1
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Biochip - Microarray fabrication
Various means exist to achieve the
placement, but typically robotic
micro-pipetting (Schena, 1995) or
micro-printing (MacBeath, 1999)
systems are used to place tiny spots of
sensor material on the chip surface
1
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Biochip - Microarray fabrication
1
process results in high
manufacturing costs.
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Biochip - Microarray fabrication
1
Fodor and colleagues
developed a unique
fabrication process
(later used by
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Biochip - Microarray fabrication
1
Affymetrix) in which a
series of
microlithography steps
is used to
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Biochip - Microarray fabrication
1
Combinatorial chemistry|combinatorially synthesize
hundreds of thousands of unique, single-stranded
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Biochip - Microarray fabrication
1
DNA sensors on a substrate
one nucleotide at a
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Biochip - Microarray fabrication
time (Fodor, 1991; Pease, 1994). One
lithography step is needed per base type; thus,
a total
1
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Biochip - Microarray fabrication
1
of four steps is required
per nucleotide level.
Although this technique
is
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Biochip - Microarray fabrication
1
very powerful in that many
sensors can be created
simultaneously, it is
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Biochip - Microarray fabrication
1
currently only feasible for creating short DNA
strands (15ndash;25 nucleotides).
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Biochip - Microarray fabrication
Reliability and cost
factors limit the number
of photolithography
steps that
1
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Biochip - Microarray fabrication
1
can be done. Furthermore, lightdirected combinatorial synthesis
techniques
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Biochip - Microarray fabrication
1
are not currently possible
for proteins or other
sensing molecules.
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Biochip - Microarray fabrication
1
approach is used chiefly to map
or encode the coordinate of each
sensor
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Biochip - Microarray fabrication
1
to its function. Sensors in these arrays typically
use a universal signalling
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Biochip - Microarray fabrication
1
technique (e.g. fluorescence), thus
making coordinates their only
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Biochip - Microarray fabrication
1
identifying feature. These
arrays must be made
using a serial process
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Biochip - Microarray fabrication
(i.e. requiring
multiple, sequential
steps) to ensure that
each sensor
1
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Biochip - Microarray fabrication
1
positions on the chip, is an alternative to
the serial method. The tedious and
expensive positioning process is
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Biochip - Microarray fabrication
not required,
enabling the use of
parallelized selfassembly techniques.
In
1
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Biochip - Microarray fabrication
1
this approach, large
batches of identical
sensors can be
produced; sensors
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Biochip - Microarray fabrication
1
non-coordinate based encoding scheme must be
used to identify each sensor. As
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Biochip - Microarray fabrication
the figure shows,
such a design was
first demonstrated
(and later
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Biochip - Microarray fabrication
1
commercialized by Illumina) using functionalized
beads placed randomly in the
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Biochip - Microarray fabrication
encoded with a
fluorescent signature.
However, this encoding
scheme is
1
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Biochip - Microarray fabrication
1
limited in the number of
unique dye combinations
that can be used and
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Biochip - Protein biochip array and other microarray technologies
The difference from conventional
immunoassays is that the capture
ligands are covalently attached to the
surface of the biochip in an ordered
array rather than in solution.
1
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Biochip - Protein biochip array and other microarray technologies
1
In sandwich assays an enzymelabelled antibody is used; in
competitive assays an enzymelabelled antigen is used
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Biochip - Protein biochip array and other microarray technologies
1
Details about other array technologies can be
found in the following page: Antibody
microarray
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Chipless RFID
Because of the absence of ICs the
major challenges in design of chipless
RFID is the encoding and
transmission of data.
1
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Chipless RFID - Time domain Reflectometry vs Frequency Signature devices
1
Chipless RFID tag may use either time domain
reflectometry or frequency signature
techniques
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Chipless RFID - Siemens Self generating ceramic mixtures
1
In 2001, Roke Manor Research centre
announced materials that emit
characteristic radiation when moved,
these may be exploited for storage of
few bits encoded in the presence or
absence of certain chemicals.
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Chipless RFID - Somark Innovations biocompatible RFID ink
Somark employed a
dielectric barcode that may
be read using microwave
1
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Chipless RFID - CrossID nanometric ink
1
This system uses materials exhibiting
varying magnetism. They resonate at
different frequencies when exited by
radiation. The reader analyzes the
spectrum of the reflected signal to make
out which materials are present. There
are 70 different materials were found
each material's presence or absence
may be used to encode one bit thus
enabling encoding up to 270 unique
binary strings. They work on frequency
between three and ten gigahertz.
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Chipless RFID - Tapemark's Chipless ID
In 2004 Tapemark announced a
chipless RFID that will have only a
passive antenna with diameter as
small as 5 micron. The antenna
consist of small fibers called nanoresonant structures. Spatial difference
in structure may be used to encode
data. The interrogator sends out a
coherent pulse and reads back an
interference patterns which it decodes
1
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Chipless RFID - Sagentia's Programmable Magnetic Resonance
1
They are Acoustomagnetic devices
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Chipless RFID - Flying-Null's magnetic data tagging
1
The Flying Null technology uses a series
of passive magnetic structure much like
the lines used in conventional bar codes
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Chipless RFID - Surface acoustic wave based RFIDs
1
It consist of a piezoelectric crystal
like lithium niobate on which
transducers are made by singlemetal-layer photo-lithographic
technology
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Chipless RFID - Surface acoustic wave based RFIDs
1
RFID Technology, Cristina Turcu (Ed.), ISBN 978-3902613-54-7, InTech, Available from:
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Chipless RFID - Surface acoustic wave based RFIDs
1
http://www.intechopen.com/books/develop
ment_and_implementation_of_rfid_technol
ogy/surface_acoustic_wa
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Chipless RFID - Capacitively-tuned split microstrip resonators
1
They employ a grid of dipole antennas that
are tuned to different frequencies. The
interrogator generates a frequency sweep
signal and scans for dips in the signal. It
may be used to encode as many bits as
there are dipole antenna. The frequency
swept will be determined by the length of
the antennas used. The coupling between
the dipoles posses a challenge.
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Prosthetic Neuronal Memory Silicon Chips
1
Berger hopes to eventually use these
chips as electronic implants for
humans whose brains that suffer from
diseases such as Alzheimer's that
disrupt neuronal networks.
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Prosthetic Neuronal Memory Silicon Chips - Theordore Berger's Education,
Impact as a Researcher, and Inspiration for the chip
1
While Berger's aspirations of memory
implant sounded unrealistic to his
colleagues for a long time, Berger has
continued to maintain a high level of
determination, and has referred to many
other successes in neuroprosthetics that
once seemed unattainable
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Prosthetic Neuronal Memory Silicon Chips - Theordore Berger's Education,
Impact as a Researcher, and Inspiration for the chip
Berger has spent 35 years of his life
trying to develop a keen understanding
of how neurons behave in the
hippocampus.The hippocampus is a
major component of the brain that
belongs in the limbic system and
consolidates information from shortterm memory to long-term memory and
spatial navigation
1
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Prosthetic Neuronal Memory Silicon Chips - The Technology and Medical
Application of this Chip
To begin making a brain prosthesis,
Berger and his collaborator Valsilis
Marmarelis, a biomedical engineer at
USC, worked with the hippocampus slices
of rats. Since they knew that neuronal
signals travel from one side of the
hippocampus to the other, the researchers
sent random pulses into the hippocampus,
recorded the signals at specific locales to
see how they were changed, and then
1
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Prosthetic Neuronal Memory Silicon Chips - The Technology and Medical Application of
this Chip
1
Next, they had to determine whether a
chip could be used as a prosthesis, or
implant, for a damaged region in the
hippocampus. To do this, they had to
figure out whether they could avoid a
central component of the pathway in the
brain slices. They put electrodes in the
region, which carried electrical pulses to
an external chip. The chip then executed
the transformations that are normally
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Prosthetic Neuronal Memory Silicon Chips - Trials of the chip on rats and
monkeys
This artificial hippocampus played a
significant role in the developmental stage
of the chip, as it went on to show that if a
prosthetic device and its associated
electrodes were implanted in the animals
with a normally functioning hippocampus,
the device could potentially enhance the
memory capability of normal rats.()
1
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Prosthetic Neuronal Memory Silicon Chips - Trials of the chip on rats and monkeys
Last year, scientists conducted an
experiment on monkeys where they
placed electrodes in the monkeys’
brains to obtain the code formed in the
prefrontal cortex that they believe
allowed animals to remember an
image that had been shown to them
earlier. They then drugged the
monkeys with cocaine, which impairs
that part of the brain. The researchers
1
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Prosthetic Neuronal Memory Silicon Chips - Goals for the Future
1
Ultimately, Berger hopes to restore the
ability to create long-term memories by
implanting chips such as these into the
brain.()
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Malay Archipelago
The 'Malay Archipelago' refers to the
archipelago between mainland Southeast
Asia|Southeastern Asia and Australia
(continent)|Australia. The name was
derived from a nineteenth century concept
of a Malay race.
1
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Malay Archipelago
1
The island of New Guinea or islands of
Papua New Guinea are not always
included in definitions of the Malay
Archipelago.[http://www.worldworx.tv/r
egional-information/asia/maritimesoutheast-asia/index.htm Maritime
Southeast Asia]
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Malay Archipelago - Etymology and terminology
1
The term was derived from the concept of
a Malay race, which referred to the people
who inhabited what is now Brunei, East
Timor, Indonesia (excluding West Papua
(region)|western New Guinea), Malaysia,
qthe Philippines, and Singapore
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Malay Archipelago - Etymology and terminology
The 19th century naturalist Alfred
Russel Wallace|Alfred Wallace used
the term Malay Archipelago as the
title of The Malay Archipelago|his
influential book documenting his
studies in the region. Wallace also
referred to the area as the Indian
Archipelago and the Indo-Australian
Archipelago.; He included within the
region the Solomon Islands and the
1
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Malay Archipelago - Etymology and terminology
This line will separate the Malayan
and all the Asiatic races, from the
Papuans and all that inhabit the
Pacific; and though along the line of
junction intermigration and
commixture have taken place, yet the
division is on the whole almost as well
defined and strongly contrasted, as is
the corresponding zoological division
of the Archipelago, into an Indo-
1
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Malay Archipelago - Etymology and terminology
The area is called Nusantara in the Indonesian
language.; The area is also referred to as the
Indonesian archipelago.Friedhelm Göltenboth
(2006) Ecology of insular Southeast Asia: the
Indonesian Archipelago Elsevier, ISBN 0-44452739-7, ISBN 978-0-444-527394[http://books.google.com/books?id=ikSQw_8gboCpg=PA227dq=maritime+southeast+asiaei=q
9olS730OZOkkATG58nOCwcd=1#v=onepageq=mal
ay%20archipelagof=false Modern Quaternary
Research in Southeast Asia, Volume 1] The term
Maritime Southeast Asia is largely synonymous,
covering both the islands in Southeast Asia and
nearby island-like communities, such as those
found on the Malay Peninsula.
1
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Malay Archipelago - Geography
The land and sea area of the
archipelago exceeds 2 million km2. The
over 25,000 islands of the archipelago
comprise many smaller
archipelagoes.[http://web.archive.org/w
eb/20071022221129/http://www.gov.ph/a
boutphil/general.asp Philippines :
General Information]. Government of
the Philippines. Retrieved 2009-11-06; ;
1
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Malay Archipelago - Geography
1
The major groupings are:
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Malay Archipelago - Geography
*New Guinea and
surrounding islands
(when included)
1
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Malay Archipelago - Geography
1
The six largest islands are New Guinea, Borneo,
Sumatra, Sulawesi, Java, and Luzon.
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Malay Archipelago - Geography
1
Geologically the archipelago is one of the
most active volcano|volcanic regions in the
world. Tectonic uplifts have produced large
mountains, including the highest in Mount
Kinabalu in Sabah, Malaysia, with a height
of 4,095.2m and Puncak Jaya on Papua,
Indonesia at . Other high mountains in the
archipelago include Puncak Mandala,
Indonesia at and Puncak Trikora,
Indonesia, at .
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Malay Archipelago - Geography
1
The climate throughout the archipelago, owing
to its position on the equator, is tropical.
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Malay Archipelago - Biogeography
Wallace used the term Malay
Archipelago as the title of The Malay
Archipelago|his influential book
documenting his studies in the region
1
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Malay Archipelago - Demography
Over 350 million people live in the
region, with the most populated island
being Java (island)|Java. The people
living there are predominantly from
Austronesian peoples|Austronesian
subgroupings and correspondingly
speak western Malayo-Polynesian
languages. The main religions in this
region are Islam, Christianity,
Buddhism, Hinduism, and traditional
1
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Malay Archipelago - Demography
1
Culturally, the region is often seen as part
of Farther India or Greater India—the
Coedes Indianized states of Southeast
Asia refers to it as Island Southeast
Asia.Coedes, G. (1968) The Indianized
states of Southeast Asia Edited by Walter
F. Vella. Translated by Susan Brown
Cowing.Canberra : Australian National
University Press. Introduction... The
geographic area here called Farther India
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Phoneme - Neutralization and archiphonemes
1
An 'archiphoneme' is an object sometimes used to
represent an underspecified phoneme.
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Phoneme - Neutralization and archiphonemes
A description using the approach of
underspecification would not attempt
to assign to a specific phoneme in
some or all of these cases, although it
might be assigned to an
archiphoneme, written something like
|A|, which reflects the two
neutralized phonemes in this position.
1
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Phoneme - Neutralization and archiphonemes
1
Instead they may analyze these phones as
belonging to a single archiphoneme,
written something like |N|, and state the
underlying representations of limp, lint, link
to be .
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Phoneme - Neutralization and archiphonemes
This latter type of analysis is often
associated with Nikolai Trubetzkoy of the
Prague school. Archiphonemes are often
notated with a capital letter within pipes,
as with the examples |A| and |N| given
above. Other ways the second of these
might be notated include , , or |n*|.
1
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Phoneme - Neutralization and archiphonemes
1
As in the previous examples, some
theorists would prefer not to make
such a determination, and simply
assign the flap in both cases to a
single archiphoneme, written (for
example) |D|.
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Phoneme - Neutralization and archiphonemes
1
For a special kind of neutralization
proposed in generative
linguistics|generative phonology, see
absolute neutralization.
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Multi-Chip Module
A 'multi-chip module (MCM)' is a
specialized electronic package where
multiple integrated circuits (ICs),
semiconductor dies or other discrete
components are packaged onto a
unifying substrate, facilitating their
use as a single component (as though
a larger IC). The MCM itself will often
be referred to as a chip in designs,
thus illustrating its integrated nature.
1
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Multi-Chip Module - Overview
Multi-Chip Modules come in a variety of
forms depending on the complexity and
development philosophies of their
designers. These can range from using
pre-packaged ICs on a small printed circuit
board (PCB) meant to mimic the package
footprint of an existing chip package to
fully custom chip packages integrating
many chip dies on a High Density
Interconnection (HDI) substrate.
1
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Multi-Chip Module - Overview
1
Multi-Chip Module packaging is an
important facet of modern electronic
miniaturization and micro-electronic
systems. MCMs are classified
according to the technology used to
create the HDI (High Density
Interconnection) substrate.
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Multi-Chip Module - Overview
1
* MCM-L - laminated MCM. The substrate is a multilayer laminated PCB (Printed circuit board).
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Multi-Chip Module - Overview
1
* MCM-D - deposited MCM. The modules
are deposited on the base substrate using
thin film technology.
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Multi-Chip Module - Overview
1
* MCM-C - ceramic substrate MCMs, such as Low
temperature co-fired ceramic|LTCC.
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Multi-Chip Module - Chip stack MCMs
1
Since area is more often at a premium
in miniature electronics designs, the
chip-stack is an attractive option in
many applications such as cell phones
and personal digital assistants (PDAs)
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Multi-Chip Module - Examples of MCM technologies
1
*IBM 3081 mainframe's thermal
conduction module (1980s)
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Multi-Chip Module - Examples of MCM technologies
*Intel Pentium Pro, Pentium D Presler
[http://www.theinquirer.org/?article=25746],
Xeon Dempsey and Clovertown, Core 2
Quad (Kentsfield and Yorkfield) and
Clarkdale (microprocessor)|Clarkdale
1
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Multi-Chip Module - Examples of MCM technologies
1
*Xenos (graphics chip)|Xenos, a Graphics
processing unit|GPU designed by ATI
Technologies for the Xbox 360, with
eDRAM
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Multi-Chip Module - Examples of MCM technologies
*Nintendo's Wii U has its CPU, GPU, and
onboard VRAM (integrated into the GPU) on one
MCM.
1
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Microfluidics - DNA chips (microarrays)
1
plastic or silicon substrate on which pieces of
DNA (probes) are affixed in a microscopic
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Microfluidics - DNA chips (microarrays)
1
array. Similar to a DNA
microarray, a protein
array is a miniature
array
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Microfluidics - DNA chips (microarrays)
1
where a multitude of
different capture
agents, most
frequently
monoclonal
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Microfluidics - DNA chips (microarrays)
1
antibodies, are deposited
on a chip surface; they
are used to determine the
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Microfluidics - DNA chips (microarrays)
presence and/or
amount of proteins in
biological samples,
e.g., blood. A
1
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Microfluidics - DNA chips (microarrays)
reconfigurable nor scalable after
manufacture. Digital microfluidics has
been described as a means for carrying
out Digital PCR.
1
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RFID chip
1
'Radio-frequency identification' ('RFID') is
the wireless non-contact use of radiofrequency electromagnetic fields to
transfer data, for the purposes of
automatically identifying and tracking tags
attached to objects
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RFID chip
1
RFID tags are used in many industries.
An RFID tag attached to an automobile
during production can be used to track
its progress through the assembly line.
Pharmaceuticals can be tracked
through warehouses. Microchip implant
(animal)|Livestock and pets may have
tags injected, allowing positive
identification of the animal. On offshore oil and gas platforms, RFID tags
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RFID chip
Since RFID tags can be attached to
clothing, possessions, or even
Microchip implant (human)|implanted
within people, the possibility of reading
personally-linked information without
consent has raised privacy concerns.
1
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Infineon - Chip Card Security (CCS)
1
[http://www.computerwoche.de/security
/2359712/ Infineon chips for the new
identity cards in Computerwoche]
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GeForce 6 Series - GeForce 6100 and 6150 series chip specifications
1
Both the 6100 and 6150 support Shader
Model 3.0 and DirectX 9.0c. The 6150
also features support for HighDefinition video playback, PureVideo
Processing, DVI, and video-out while
the 6100 supports PureVideo
Processing only. Maximum supported
resolution is 1920 x 1440 pixels
(@75Hz) for RGB display and 1600 x
1200 pixels (@65Hz) for DVI-D display
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Bark - Bark chip extraction
;Wood Adhesives from Bark-Derived
Phenols:http://www1.eere.energy.gov/b
iomass/fy04/wood_adhesives.pdf Wood
Bark has lignin content and when it is
pyrolyzed (subjected to high
temperatures in the absence of oxygen),
it yields a liquid bio-oil product rich in
natural phenol derivatives. The phenol
derivatives are isolated and recovered
for application as a replacement for
fossil-based phenols in phenolformaldehyde (PF) resins used in
Oriented Strand Board (OSB) and
plywood.
1
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CPU cache - Multi-core chips
1
For example, an eight-core chip with
three levels may include an L1 cache
for each core, an L3 cache shared by
all cores, with the L2 cache
intermediate, e.g., one for each pair of
cores.
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Analytical chemistry - Lab-on-a-chip
Devices that integrate (multiple)
laboratory functions on a single chip
of only millimeters to a few square
centimeters in size and that are
capable of handling extremely small
fluid volumes down to less than
picoliters.
1
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X86 virtualization - Chipset
1
Memory and I/O virtualization is performed
by the chipset. Typically these features
must be enabled by the BIOS, which must
be able to support them and also be set to
use them.
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Intel Corporation - Server chips
In July 2011, Intel announced that its
server chips, the Xeon series, will use new
sensors that can improve data center
cooling efficiency.James Niccolai, IDG
News.
[http://www.pcworld.com/businesscenter/ar
ticle/235282/intel_adds_sensors_to_aid_d
ata_center_cooling.html Intel Adds
Sensors to Aid Data Center Cooling]. PC
World. July 8, 2011. Retrieved July 8,
2011.
1
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Challenging the Chip
1
'Challenging the Chip' is a 2006 book on
labor rights and environmental justice in
the global electronics industry edited by
Ted Smith (environmentalist)|Ted Smith,
David A
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Challenging the Chip
1
This 357-page book was put together by
scores of people around the world (who)
have been involved over the course of
several years in the conceptualization,
development, editing and production (of it).
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Challenging the Chip - New wave of technology
1
It is embodied in the tiny chips (and
the computers they power) that are
radically and rapidly transforming
our world -- and, like the automobile,
not always for the better.
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Challenging the Chip - New wave of technology
1
He also contends that the story of the
dark side of the chip needs to be told
and retold across the global village
before it is too late to do anything
about it.
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Challenging the Chip - New wave of technology
1
The book narrates the story of how the
high-tech industry grew in the Valley
of Heart's Delight (before the place got
renamed to Silicon Valley) and how
Santa Clara Valley fruit-processing
workers such as Alida Hernandez got
reinvented into clean room workers.
This deplorable pattern is still being
replicated around the world.
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Challenging the Chip - Stories of electronic workers suffering toxic exposures
The book contains stories about
Electronics|electronic workers suffering
toxic exposures and fighting over it. From
the Southwestern US and the Maquiladora
region on the Mexico–United States
border, to Malaysia, Taiwan, Thailand,
China, and India.
1
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Challenging the Chip - Stories of electronic workers suffering toxic exposures
1
The book argues that far too (words)
have been addressed to the downside
of the (electronics industry's)
revolution. Its co-editors, in a signed
article titled The Quest for
Sustainability and Justice in a HighTech World, say: Although most
consumers are eager to enjoy their
latest electronic games, few relate the
declining prices of these and other
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Challenging the Chip - Stories of electronic workers suffering toxic exposures
1
Other issues focused on by the co-editors
include environmental degradation,
occupational health hazards, and the
widespread ignorance of the health and
ecological footprints of the global
electronics industry.
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Challenging the Chip - Stories of electronic workers suffering toxic exposures
1
There are problems of contamination by
hi-tech manufacturing (of workers, air, land
and water) from all around -- Silicon Valley
in the United States, Silicon Glen in
Scotland, Silicon Island in Thailand, and
Silicon Paddy in China. It contrasts the
reality between the CEOs and upper
management drawing multimillion dollar
salaries and 'golden parachutes' as
against the reality of the production
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Challenging the Chip - Unsung heroines and heroes
While acknowledging the work of the hitech revolution pioneers, the book's editors
also points to the accomplishments of the
unsung heroines and heroes of this
revolution's other side
1
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Challenging the Chip - Globalisation of electronics, labor rights, product endof-life
Its editors say the book has two
geographical frames of reference—the
vicinity of San Jose, California (or,
Silicon Valley), and parts of the world
increasingly integrated into global
networks of electronics production,
consumption, and disposal. The
volume looks at three broad,
integrative themes: the globalization
of electronics manufacturing; labor
1
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Challenging the Chip - Globalisation of electronics, labor rights, product endof-life
1
In terms of global electronics, the book
focuses on Silicon Valley (where the
United States electronics industry's roots
lie, and which has a three-decade history
of community and worker dialog and
struggle). It also looks at electronics
manufacturing in China, India, Thailand,
and Central and Eastern Europe.
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Challenging the Chip - Globalisation of electronics, labor rights, product endof-life
In terms of labor rights and
environmental justice, the book looks
at the stories of workers and
environmentalists taking up such
issues -- work hazards, antiunion
hostility, and environmental health
perils—in countries that range from
the United States, to Mexico, Scotland,
and Thailand, among others.
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Challenging the Chip - Globalisation of electronics, labor rights, product endof-life
E-waste issues get looked at in the
context of trading or dumping from
the North to South. But as nations like
India and China increasingly
modernize, their own industries and
consumers are contributing to the
problems as well, says the editors.
1
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Challenging the Chip - Failed to keep pace with social and environmental advances
They argue that while the electronics
industry leaders have produced enormous
technical innovation over the years, they
have failed to keep sufficient pace with the
socially and environmentally oriented
advances that are available to them
1
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Challenging the Chip - Downside not addressed
1
Says an introduction to its contents: Of the
millions of words written over the past
several decades about the electronics
industry's incredible transformation of our
world, far too few have been addressed
(to) the downside of this revolution. Many
are surprised to learn that environmental
degradation and occupational health
hazards are as much a part of high-tech
manufacturing as miniaturization and other
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Challenging the Chip - Third World women's labor, pollute surroundings
The editors also comment: Although
most consumers are eager to enjoy
their latest computers, televisions,
cellular phones, iPods, and electronic
games, few relate the declining prices
of these and other electronic
technologies to the labor of Third World
women, who are paid pennies a day.
Fewer still realize that the amazingly
powerful microprocessors and
1
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Challenging the Chip - Comments on the book
Sandra Steingraber calls this book
essential reading for anyone who owns
a cell phone or a computer and says
our digital possessions connect us not
only to global information but also to
global contamination and injustice
1
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Challenging the Chip - Regions covered
1
Chapters of the book cover Made in
China electronics workers, Thailand's
electronic sector's corporate social
responsibility, electronic workers in
India, workers in and around Central
and Eastern Europe's semiconductor
plants (Russia, Belarus, Slovakia,
Czech Republic, Poland and
Romania), Silicon Valley's Toxics'
Coalition and workers' struggles,
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Universal Mobile Telecommunications System - TD-CDMA (UTRA-TDD 3.84 Mcps High
Chip Rate)
1
UMTS-TDD's air interfaces that use
the TD-CDMA channel access
technique are standardized as 'UTRATDD HCR', which uses increments of
5MHz of spectrum, each slice divided
into 10ms frames containing fifteen
time slots (1500 per second)
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Universal Mobile Telecommunications System - TD-SCDMA (UTRA-TDD 1.28 Mcps low
chip rate)
'TD-SCDMA' uses the Time division
multiple access|TDMA channel access
method combined with an adaptive
synchronous CDMA component on
1.6MHz slices of spectrum, allowing
deployment in even tighter frequency
bands than TD-CDMA
1
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Windshield - Repair of stone-chip and crack damage
According to the US National
Windshield Repair Association many
types of stone damage can be
successfully repaired. Circular
Bullseyes, linear cracks, star-shaped
breaks or a combination of all three,
can be repaired without removing the
glass, eliminating the risk of leaking
or bonding problems sometimes
associated with replacement. Repair
1
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Windshield - Repair of stone-chip and crack damage
In cracked windshield repair, air is
removed from the damaged area on the
windshield with a specified vacuum
injection pump. Then using the injection
pump, clear adhesive resin is injected to
replace the air in the windshield crack. The
resin is then cured with an ultraviolet light.
When done properly, the damaged area’s
strength is restored, as is 90–95% of the
clarity. Auto glass chip repair usually take
about 15–20 minutes.
1
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Samsung Electro-Mechanics - MLCC (multilayer chip capacitor)
1
The multilayer chip capacitor (MLCC)
is a commonly used part in electronic
products. For example, a smart phone
has more than 400 MLCCs, while a
tablet PC contains about
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Samsung Electro-Mechanics - MLCC (multilayer chip capacitor)
1
500, a laptop computer contains least
800 and an LCD TV uses over 1,300.
These devices serve as a kind of dam
to adjust electrical current to the
specification of the product in
question.
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Samsung Electro-Mechanics - MLCC (multilayer chip capacitor)
1
The global trend toward smaller and lighter
electronics products is driving demand for
MLCCs of smaller sizes with higher
capacities.
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Advanced Multimedia Supplements - Chipsets and engines
1
There are also implementations targeted mainly for
mobile device manufacturers.
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List of Smartphones using GLONASS Navigation - Any latest generation
Qualcomm gpsONE(tm) Chipset based device
1
* Devices using latest Qualcomm chipsets
have GLONASS as part of the gpsOne(tm)
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List of Smartphones using GLONASS Navigation - Any latest generation Qualcomm
gpsONE(tm) Chipset based device
* Qualcomm Blog article on
GLONASS support being added
1
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IEEE P1905 - Chipsets
Qualcomm
[http://qca.qualcomm.com/tag/nvoy
/] indicated its 2014 AV2 chip releases
would include nVoy support
1
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Texas Instruments - First speech synthesis chip
1
[http://www.eetimes.com/electronics
-news/4102385/TI-will-exit-dedicatedspeech-synthesis-chips-transferproducts-to-Sensory]
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Exynos (system on chip)
'Exynos' is a series of ARM
architecture|ARM-based System on a
chip|System-on-Chips (SoCs)
developed and manufactured by
Samsung Electronics and is a
continuation of Samsung's earlier S3C,
S5L and S5P line of SoCs.
1
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Exynos (system on chip) - History
In 2010 Samsung launched the
S5PC110 (now Exynos 3 Single) in its
Samsung Galaxy S mobile phone,
which featured a licensed ARM
Cortex-A8 Central processing
unit|CPU.
1
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Exynos (system on chip) - History
1
In early 2011, Samsung first launched the
Exynos 4210 SoC in its Samsung Galaxy
S II mobile smartphone. The driver code
for the Exynos 4210 was made available
in the Linux kernel and support was added
in version 3.2 in November 2011.
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Exynos (system on chip) - History
On 29 September 2011, Samsung
introduced Exynos 4212 as a successor
to the 4210; it features a higher clock
frequency and 50 percent higher 3D
graphics performance over the
previous processor generation. Built
with a 32nm|32nm High-k
dielectric|High-K Metal Gate (HKMG)
low-power process; it promises a 30
percent lower power-level over the
1
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Exynos (system on chip) - History
On 30 November 2011, Samsung
released information about their
upcoming SoC with a Multi-core
processor|dual-core ARM Cortex-A15
MPCore|ARM Cortex-A15 CPU, which
was initially named Exynos 5250 and
was later renamed to Exynos 5 Dual
1
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Exynos (system on chip) - History
1
On 26 April 2012, Samsung released the
Exynos 4 Quad, which powers the
Samsung Galaxy S III and Samsung
Galaxy Note II. The Exynos 4 Quad SoC
uses 20% less power than the SoC in
Samsung Galaxy SII. Samsung also
changed the name of several SoCs,
Exynos 3110 to Exynos 3 Single, Exynos
4210 and 4212 to Exynos 4 Dual 45nm,
and Exynos 4 Dual 32nm and Exynos
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Snapdragon (system on chip)
'Snapdragon' is a family of mobile
system on chip|systems on a chip
(SoC) by Qualcomm. Qualcomm
considers Snapdragon a platform for
use in smartphones, tablets, and
smartbook devices.
1
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Snapdragon (system on chip)
1
The original Snapdragon CPU, dubbed
Scorpion (CPU)|Scorpion, is
Qualcomm's own design. It has many
features similar to those of the ARM
architecture|ARM ARM CortexA8|Cortex-A8 core and it is based on
the ARMv7 instruction set, but
theoretically has much higher
performance for multimedia-related
SIMD operations. The successor to
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Snapdragon (system on chip)
Majority Snapdragon processors
contain the circuitry to decode highdefinition video (HD) resolution at
720p or 1080p depending on the
Snapdragon chipset. Adreno, the
company's proprietary GPU
technology, integrated into
Snapdragon chipsets (and certain
other Qualcomm chipsets) is
Qualcomm's own design, using assets
1
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Snapdragon (system on chip)
1
It also has the advantage of benefiting
from advances in the manufacturing
process, for example 28
nanometer|28nm in most S4 SoCs,
thus providing modems and other
dedicated circuitry with lower power
characteristics than external chips
manufactured with older processes.
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Snapdragon (system on chip) - History
1
* In 4th Quarter of 2008, the first chipsets
in the Snapdragon family, the QSD8650
and the QSD8250, were made available.
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Snapdragon (system on chip) - History
* On 1 June 2010, Qualcomm announced
sampling of the MSM8x60 series of Snapdragon
SoCs.
1
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Snapdragon (system on chip) - History
1
* On 17 November 2010, Qualcomm
announces the roadmap for Next-Gen
Snapdragon SoC development,
including the MSM8960, citing future
improvements in CPU and GPU
performance and lower power
consumption.
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Snapdragon (system on chip) - History
* On 5 January 2011, a version of
Microsoft Windows 7 compiled for ARM
was shown running on the Snapdragon
SoC at the 2011 Consumer Electronics
Show.
1
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Snapdragon (system on chip) - History
* On 3 August 2011, Qualcomm
announced a plan to use simple names
(S1, S2, S3 and S4) for Snapdragon
processors so that the public can
better understand the products. The
higher the number, the newer
generation of SoC it is.
1
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Snapdragon (system on chip) - History
* On 7 January 2013, Qualcomm
announced new names and tiers for
the 2013 line of Snapdragon SoC's,
Snapdragon 200, 400, 600 and 800. The
model tiers can easiest be described
as equivalent to the Play (200), Plus
(400), Pro (600) and Prime (800) tiers of
the S4 generation of SoCs.
1
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Snapdragon (system on chip) - Snapdragon 410
The Snapdragon 410 system on a chip
was announced on the 9 December 2013,
it is Qualcomm's first 64-bit mobile system
on a chip. It also has Multimode 4G LTE,
Bluetooth, Wi-Fi, NFC, GPS, GLONASS
and BeiDou capabilities, and contains the
Adreno 306 GPU. It is capable of
supporting a 1080p screen and a 13
Megapixel camera.
1
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Snapdragon (system on chip) - Snapdragon 602A
The Snapdragon
602A[http://www.qualcomm.com/media/rel
eases/2014/01/06/qualcomm-introducessnapdragon-automotive-solutionsconnected-car Qualcomm News and
Events] processor was announced on the
6th of January 2014, it is Qualcomm's
solution to car industry.
1
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Snapdragon (system on chip) - Snapdragon 802
1
It's a New Ultra HD Processor for TVs
and Set-TopBoxes.[http://www.qualcomm.com/m
edia/releases/2014/01/06/qualcommannounces-new-ultra-hd-processortvs-and-set-top-boxes Qualcomm
News and Events]
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Snapdragon (system on chip) - Snapdragon 805
1
* Krait 450 quad-core CPU
running at up to 2.5GHz
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Snapdragon (system on chip) - Snapdragon 805
1
* 4K UHD video
upscale play
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Snapdragon (system on chip) - Snapdragon 805
1
* Dual camera image signal
processor
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Snapdragon (system on chip) - Similar platforms
1
* OMAP by Texas
Instruments
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Snapdragon (system on chip) - Similar platforms
1
* I.MX#i.MX6x
series|i.MX by
Freescale
Semiconductor
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Celeron 743 - Clarkdale (microprocessor)|Clarkdale (Multi-chip package|MCP,
32 nm)
* Based on Westmere
(Microarchitecture)|Westmere
microarchitecture
1
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Celeron 743 - Clarkdale (microprocessor)|Clarkdale (Multi-chip package|MCP,
32 nm)
* All models support: MMX
(instruction set)|MMX, Streaming
SIMD Extensions|SSE, SSE2, SSE3,
SSSE3, Enhanced Intel SpeedStep
Technology (EIST), Intel 64, XD bit (an
NX bit implementation), Intel VT-x,
Smart Cache.
1
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Celeron 743 - Clarkdale (microprocessor)|Clarkdale (Multi-chip package|MCP, 32 nm)
* Contains 45 nm
Ironlake graphics
processing unit|GPU.
1
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Celeron 743 - Arrandale (microprocessor)|Arrandale (Multi-chip package|MCP, 32 nm)
1
* P4505 and U3405 support
memory ECC RAM and PCIe
bifurcation.
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Apple (system on chip) - Apple A5
1
The chip in the Apple TV has one core
disabled.[http://www.appleinsider.co
m/articles/12/03/18/single_core_a5_
cpu_in_new_1080p_apple_tv_doubles_
ram_to_512mb.html Single-core A5
CPU in new 1080p Apple TV doubles
RAM to 512MB] The markings of the
square package indicates that it's
named APL2498, and in software, the
chip is called S5L8942
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Apple (system on chip) - Apple A6
The A6 is said to use a 1.3GHz custom
Apple-designed ARM architecture|ARMv7
based Multi-core processor|dual-core
CPU, called Swift, rather than a licensed
CPU from ARM like in previous designs,
and an integrated 266MHz triple-core
PowerVR SGX 543MP3 citation
|url=http://www.anandtech.com/show/6323
/apple-a6-die-revealed-3core-gpu100mm2 |title=Apple A6 Die Revealed: 3core GPU, graphics processing unit
(GPU)
1
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Allwinner Technology - Chipset Specs
The Allwinner SoC family includes Aseries, which is intended for Android OS,
and F-series, which is intended for the
company's self-developed Melis operating
system.
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Allwinner Technology - Chipset Specs
1
The A-Series; A10, A20 and A31 SoC's
has a proprietary inhouse designed
multimedia co-processing DSP|DSP
(Digital Signal Processing) processor
technology for hardware accelerated
video, image, and audio decoding,
called CedarX (with subprocssing
called CedarV for video decoding and
CedarA for audio decoding), able to
decode 2160p 2D and 1080p 3D video
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MediaTek - Closed nature of System on a chip|system-on-chip solutions
1
A petition was launched on February,
2013, to ask MediaTek to provide
support for Android (operating
system)#Open-source
community|AOSP and custom
ROMs.iPetition/aosp-support-formediatek-devices
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Rockchip
Due to their evolution from the
MP3/MP4 player market most Rockchip
ICs feature advanced media decoding
logic but lack integrated cellular radio
basebands.
1
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Rockchip
Rockchip is an ARM Holdings|ARM
licensee and uses the ARM architecture
for the majority of its projects.
1
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Rockchip - RK27xx series
1
Rockchip was first known for their RK 27xx
series that was very efficient at MP3/MP4
decoding and was integrated in many lowcost PMP products.
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Rockchip - RK2806[http://www.rock-chips.com/product.php?id68width830height500 ]
1
* Up to 1280×720
h.263 and h.264
software video
acceleration.
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Rockchip - RK2808A[http://www.rockchips.com/product.php?id77width830height500 ]
1
This chip is the core of many Android
(Operating System)|Android and
Windows Mobile mobile internet
devices.
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Rockchip - RK2816[http://www.rockchips.com/product.php?id69width830height500 ]
The RK2816 is targeted at Portable
media player|PMP devices, and Mobile
Internet device|MIDs. It has the same
specifications as the RK2806 but also
includes HDMI output, Android
os|Android support, and up to 720p
Hardware video acceleration.
1
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Rockchip - RK2818[http://www.rock-chips.com/product.php?id76width830height500 ]
1
* Up to 720p hardware
video acceleration for
h.264
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Rockchip - RK291x series
1
The Rockchip RK291x is a family of
System-on-a-chip|SoCs based on the
ARM Cortex-A8 CPU core. They were
presented for the first time at
Consumer Electronic Show|CES 2011.
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Rockchip - RK291x series
1
The RK2918 is compatible with Android
(operating system)|Android Froyo (2.2),
Gingerbread(2.3), HoneyComb (3.x) and
Ice Cream Sandwich
(4.0).[http://armdevices.net/2011/01/07/roc
kchip-presents-rk2818-and-rk29xx-seriesprocessors-at-ces-2011/] on
ARMdevices.net (Unofficial support for
Ubuntu and other Linux flavours exists.)
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Rockchip - RK291x series
1
* Cortex-A8 processor, clocked at up to 1.2GHz
(due to stability reasons often limited to 1GHz)
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Rockchip - RK291x series
1
* NEON ARM NEON|SIMD
support
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK291x series
* Vivante GC800 GPU
supporting Open GL ES
2.0 and Open VG 1.1
support
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK291x series
1
* VPU (Video Processing Unit) supporting
1080p image and video decoding for
h.264, Xvid, H263, AVS, MPEG4, RV, and
WMV
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK291x series
1
* USB 1.1 Host, USB 2.0 Host and
USB 2.0 Device Interface
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK291x series
1
The RK2906 is basically a RK2918 but
the costdown version
([http://innovel.com.tw/en/products/
seven-inch-series/I701s/ with HDMI
output]).
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK292x series
1
The Rockchip RK2928 contains a single
core ARM Cortex A9 running at speeds of
1GHz or 1.2GHz, It replaces the Vivante
GC800 GPU of the older RK291x series
with an ARM architecture|ARM Mali
(GPU)|Mali-400 GPU.
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Rockchip - RK30xx series
1
The Rockchip RK30xx series use a
dual core ARM Cortex-A9 CPU
core.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK30xx series
1
In terms of performance, the RK3066
is between the Samsung Exynos 4210
and the Samsung Exynos
4212.[http://pdadb.net/index.php?m=
cpuid=a3066c=rockchip_rk3066
Rockchip RK3066 RISC Application
Processor]http://www.cnxsoftware.com/2012/11/04/rockchiprk3066-rk30xx-processordocumentation-source-code-andhttps://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK30xx series
* Dual-core Cortex-A9 processor
(ARMv7 architecture) clocked up to
1.6GHz
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK30xx series
* Quad core Mali (GPU)|Mali 400,
clocked at 250MHz supporting Open GL
ES 2.0, Open VG 1.1 support, 9
GFLOPS
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK30xx series
1
* VPU (Video Processing Unit) Multi-Media
Processor supporting 1080p image and video
decoding
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Rockchip - RK31xx series
1
Rockchip has announced the RK31xx
series for 2nd quarter of 2013. The
RK3188 is based on ARM's Cortex A9
design and features a quad core CPU
clocked at 1.8-2.0GHz frequency on a
28nm process. In April 2013, Rockchip
showed the RK3168, a very low power
dual core Cortex A9 based CPU, also
manufactured using the 28nm process.
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Rockchip - RK32xx series
Rockchip has announced the RK32xx
series for the second quarter of 2014. It
will feature an ARM Cortex-A12 CPU and
ARM Mali-T624 GPU.
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Core i5-2467M - Clarkdale (microprocessor)|Clarkdale (Multi-chip
package|MCP, 32 nm dual-core)
1
* All models support: MMX (instruction
set)|MMX, Streaming SIMD
Extensions|SSE, SSE2, SSE3, SSSE3,
SSE4.1, SSE4.2, Enhanced Intel
SpeedStep Technology (EIST), Intel 64,
XD bit (an NX bit implementation),
Trusted Execution Technology|TXT,
Intel VT-x, Intel VT-d, Hyper-Threading,
Turbo Boost, AES instruction set|AESNI, Smart Cache.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Core i5-2467M - Clarkdale (microprocessor)|Clarkdale (Multi-chip
package|MCP, 32 nm dual-core)
1
* Core i5-655K, Core i5-661 does not
support Intel TXT and Intel VTd.[http://ark.intel.com/Compare.asp
x?ids=43546,48750,43550,43553, Core
i5-655K, Core i5-661 does not support
Intel TXT and Intel VT-d]
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Core i5-2467M - Clarkdale (microprocessor)|Clarkdale (Multi-chip
package|MCP, 32 nm dual-core)
* Core i5-655K
features an unlocked
multiplier.
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Core i5-2467M - Clarkdale (microprocessor)|Clarkdale (Multi-chip
package|MCP, 32 nm dual-core)
1
* Front-side bus|FSB has been
replaced with Direct Media
Interface|DMI.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Core i5-2467M - Haswell-H (Multi-chip package|MCP, quad-core, 22 nm)
1
* All models support: MMX (instruction
set)|MMX, Streaming SIMD
Extensions|SSE, SSE2, SSE3, SSSE3,
SSE4.1, SSE4.2, Advanced Vector
Extensions|AVX, Advanced Vector
Extensions 2|AVX2, FMA3, Enhanced
Intel SpeedStep Technology (EIST),
Intel 64, XD bit (an NX bit
implementation), Intel VT-x, Intel VT-d,
Turbo Boost, AES instruction set|AEShttps://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Core i5-2467M - Haswell-H (Multi-chip package|MCP, quad-core, 22 nm)
1
* Core i5-4570R and Core i5-4670R also
contain Crystalwell: 128 MiB eDRAM built
at (22 nm) acting as CPU cache#Multilevel caches|L4 cache
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Core i5-2467M - Arrandale (microprocessor)|Arrandale (Multi-chip
package|MCP, 32 nm)
1
* i5-5xx series (i5-520M, i5-520E, i5-540M,
i5-560M, i5-580M, i5-520UM, i5-540UM,
i5-560UM) supports AES-NI, Trusted
Execution Technology|TXT and Intel VT-d.
http://ark.intel.com/ProductCollection.aspx
?familyId=43483
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Core i5-2467M - Arrandale (microprocessor)|Arrandale (Multi-chip package|MCP, 32 nm)
1
* Core i5-520E has support for ECC
memory and PCI express port
bifurcation.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
game engines at the time, in addition to the extremely high price of the
components involved. The use of FB-DIMMs due to the workstation chipset has
also been pointed at as a major limiting factor for
Skulltrail.[http://www.xbitlabs.com/articles/cpu/display/intel-skulltrail_12.html
Kinky Luxury: Intel Skulltrail Platform
Review][http://www.hothardware.com/Articles/Intel_Skulltrail_Unleashed_Core_
2_Extreme_QX9775_x_2/?page13 Intel Skulltrail Unleashed: Core 2 Extreme
QX9775 ×
1
2][http://enthusiast.hardocp.com/article.html?artMTQ1OCw5LCxoZW50aHVza
WFzdA
Intel Skulltrail Preview] although this
limitation can be mitigated by
purchasing specially designed
Kingston HyperX FB-DIMMS that have
a lower latency than generic FBDIMMshttp://www.legitreviews.com/
article/724/1/
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
game engines at the time, in addition to the extremely high price of the
components involved. The use of FB-DIMMs due to the workstation chipset has
also been pointed at as a major limiting factor for
Skulltrail.[http://www.xbitlabs.com/articles/cpu/display/intel-skulltrail_12.html
Kinky Luxury: Intel Skulltrail Platform
Review][http://www.hothardware.com/Articles/Intel_Skulltrail_Unleashed_Core_
2_Extreme_QX9775_x_2/?page13 Intel Skulltrail Unleashed: Core 2 Extreme
QX9775 ×
1
2][http://enthusiast.hardocp.com/article.html?artMTQ1OCw5LCxoZW50aHVza
WFzdA
The base Skulltrail platform consists of an
Intel D5400XS mainboard which cost
upwards of US$600 when it hit the market
as a standalone part
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
game engines at the time, in addition to the extremely high price of the
components involved. The use of FB-DIMMs due to the workstation chipset has
also been pointed at as a major limiting factor for
Skulltrail.[http://www.xbitlabs.com/articles/cpu/display/intel-skulltrail_12.html
Kinky Luxury: Intel Skulltrail Platform
Review][http://www.hothardware.com/Articles/Intel_Skulltrail_Unleashed_Core_
2_Extreme_QX9775_x_2/?page13 Intel Skulltrail Unleashed: Core 2 Extreme
QX9775 ×
1
2][http://enthusiast.hardocp.com/article.html?artMTQ1OCw5LCxoZW50aHVza
WFzdA
Intel's Skulltrail D5400XS
motherboard is made with two nForce
chips. The Skulltrail D5400XS
motherboard is now just one of the
motherboards available, along with
motherboards with Intel X58|X58 and
Intel P55|P55 chipsets, that runs both
nVidia|nVidia's Scalable Link
Interface|SLI and ATI
Technologies|ATI's ATI
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
List of single-board computers - Snapdragon (system on chip)|Qualcomm
Snapdragon
*
[http://www.inforcecomputing.com/prod
uct/moreinfo/ifc6410.html IFC6410] –
Snapdragon S4 Pro APQ8064 (from
Inforce Computing)
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
List of single-board computers - Samsung Exynos (system on chip)|Exynos
1
* Origen Board[http://www.origenboard.org
OrigenBoard.org] – Exynos 4 Dual, Quad
development board, Official Samsung
reference board for Linaro
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
List of single-board computers - Samsung Exynos (system on chip)|Exynos
*
[http://www.hardkernel.com/renewal
_2011/products/prdt_info.php
Hardkernel ODROID] - Exynos 4 and 5
Boards
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM11 - Chips
* Cavium ECONA CNS3000 series
[http://www.cavium.com/ECONA_CN
S3XXX.html ECONA CNS3XXX ARM
Based SoC Processors] at
Cavium.com
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM11 - Chips
* CSR plc|CSR
Quatro 4230, Quatro
4500 series, Quatro
5300 series
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM11 - Chips
1
* Freescale Semiconductor i.MX3x series, such
as i.MX31, I.MX#i.MX35_family|i.MX35
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM11 - Chips
1
* Texas Instruments OMAP|OMAP2 series,
with a Texas Instruments
TMS320|TMS320 C55x or C64x digital
signal processor|DSP as a second core
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Serial Digital Video Out - Intel chipsets supporting SDVO
1
Intel documents SDVO as existing
within the chipsets integrating an
Intel GMA|Intel Graphics Media
Accelerator (GMA 900 through 3000
families).
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Chip select
1
'Chip select' ('CS') or 'slave select'
('SS') is the name of a control line in
digital electronics used to select one
chip out of several connected to the
same computer bus usually utilizing
the three-state logic.
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Chip select
1
One bus that uses the chip/slave select is the Serial
Peripheral Interface Bus.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Chip select
When an engineer needs to connect
several devices to the same set of input
wires (e.g., a computer bus), but retain
the ability to send and receive data or
commands to each device independently
of the others on the bus, he can use a chip
select. The chip select is a command pin
on many integrated circuits which
connects the I/O pins on the device to the
internal circuitry of that device.
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Chip select
1
Because the other chips have their
chip select pins in the inactive state,
their outputs are high impedance,
allowing the single selected chip to
drive its outputs.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Chip select
In short, the chip select is an accessenable switch. ON means the device
responds to changes on its input pins
(such as data or address information for a
RAM device) and drives any output pins
(possibly not at the same time), while OFF
tells the device to ignore the outside world
for both inputs and outputs.
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Realtek - Chipsets for HD multimedia players and recorders
The increasing popularity of HD
media players in 2009 led to the entry
of Realtek into that market. The first
series, the '1xx3' modelsFor Realtek
chipsets the last number in the
chipset name indicates the chipset
generation. So all chips ending in '3'
are 1xx3 (2009) generation and all
ending in '5' are 1xx5 (2011)
generation.
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Realtek - Chipsets for HD multimedia players and recorders
1
sold at a lower price than similar quality
chipsets of Realtek's competitors. (The
main competitors were the Sigma Media
Players.)
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Realtek - Chipsets for HD multimedia players and recorders
1
Realtek produced three major versions of
Realtek 1xx3 and several minor variations.
The three major 1xx3 chipset versions
(1073, 1183, and 1283) all featured the
same chip in terms of format support and
performance, the only difference being the
added ability to record AV sources in the
1283. HD Audio support in the 1xx3
improved through the chipset's life with
several revisions. The DD and CC
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Realtek - Chipsets for HD multimedia players and recorders
1
The 1073 players all built on a common
SDK (firmware+OS) provided by
Realtek. This meant that they were all
essentially similar in performance and
interface. It also meant that producing
these players was very easy for
manufacturers, all they had to do was
create the hardware and Realtek
provided the software.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Realtek - Chipsets for HD multimedia players and recorders
1
Key players from the Realtek 1073 era
were the original Xtreamer, the Asus
O!PlayHD, ACRyan PlayOn and the
Mede8er MED500X Manufacturers
released hundreds of Realtek 1073
players.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Realtek - Chipsets for HD multimedia players and recorders
As with the later version of the 1xx8
chipset full 7.1 HD-audio downmix and
passthrough are supported in the 1xx5.
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Realtek - Chipsets for HD multimedia players and recorders
1
Realtek released the next generation of its
chipsets, the '1xx6' series 1186, in early
October 2011. This runs at 750Mhz, has
HDMI 1.4, is capable of 3D including 3D
ISO, and is able to dual-boot into Android.
Key 1186 players include the Mede8er
X3D Series (MED1000X3D, MED800X3D,
MED600X3D), Xtreamer Prodigy 3D and
HiMedia 900B.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
List of important publications in computer science - The case for a single-chip
multiprocessor
1
* Kunle Olukotun, Basem Nayfeh, Lance
Hammond, Kenneth G. Wilson|Ken Wilson,
Kunyung Chang
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
List of important publications in computer science - The case for a single-chip
multiprocessor
*
[http://citeseerx.ist.psu.edu/viewdoc
/download?doi=10.1.1.136.951rep=rep
1type=pdf Online version(PDF)]
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
List of important publications in computer science - The case for a single-chip
multiprocessor
1
Description: This paper argues that the
approach taken to improving the
performance of processors by adding
multiple instruction issue and out-of-order
execution cannot continue to provide
speedups indefinitely. It lays out the case
for making single chip processors that
contain multiple cores. With the
mainstream introduction of multicore
processors by List of Intel
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Chiphopper
The IBM Systems Application
Advantage for Linux, also known as
the Chiphopper offering, is designed
to help you in porting, testing, and
supporting your existing Linux® x86
applications on other IBM Systems
and middleware platforms. It can help
you maximize your Linux market
opportunity while minimizing your
expense.
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
Chiphopper
1
The Chiphopper offering helps developers
whose applications run on x86 Linux
systems by providing Programming
tool|tools to scrub their C (programming
language)|C/C++ code for Software
portability|portability prior to porting to
Power Architecture and System z
systems. Source Computer
hardware|hardware platforms for 32- and
64-bit applications are x86, EM64T, and
AMD systems running Linux Standard
Base (LSB) 3.x certified Linux
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POWER4 - Multi-chip configuration
The POWER4 also came in a
configuration using a multi-chip module
(MCM) containing four POWER4 dies in a
single package, with up to 128 MB of
shared L3 ECC cache per MCM.
1
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ARM Cortex-A15 MPCore - Chips
1
First implementation came from Samsung
in 2012 with the Exynos 5 Dual, which
shipped in October 2012 with the
Samsung Chromebook Series 3 (ARM
version), followed in November by the
Nexus 10|Google Nexus 10.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
1
Implementations of
other manufacturers
are expected to hit
market in 2013.
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
1
Press announcements of
forthcoming
implementations:
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
*Broadcom SoC[
http://www.thinq.co.uk/2011/2/17/broadc
om-announces-plans-arms-cortex-a15soc/ Broadcom announces plans for
ARM's Cortex-A15 SoC | thinq]
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
*HiSilicon K3V3[
http://www.tomshardware.com/news
/Huawei-HiSilicon-K3V3-ChipsetSmartphones,20327.html Huawei
Announces HiSilicon K3V3 Chipset For
Smartphones] on Tom's Hardware
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
1
*Nvidia Tegra#Upcoming releases|Tegra 4
(Wayne)[
http://pressroom.nvidia.com/easyir/custom
rel.do?easyirid=A0D622CE9F579F09versi
on=livereleasejsp=release_157xhtml=true
prid=705184 NVIDIA Announces Project
Denver to Build Custom CPU Cores
Based on ARM Architecture, Targeting
Personal Computers to Supercomputers NVIDIA Newsroom]
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
*Samsung Exynos 5 Dual[
http://www.samsung.com/global/business/
semiconductor/newsView.do?news_id=12
67 Samsung Announces Industry First
ARM Cortex-A15 Processor Samples for
Tablet Computers]
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
*ST-Ericsson NovaThor|Nova A9600
(dual-core @ 2.5GHz over 20k DMIPS)[
http://www.stericsson.com/press_releases/
NovaThor.jsp Changing the game: STEricsson Unveils NovaThor™ Family of
Smartphone Platforms Combining its Most
Advanced Application Processors with the
Latest Generation of Modems]
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
*Texas Instruments OMAP#OMAP
5|OMAP 5 SoCs[
http://www.ti.com/ww/en/omap/omap5/om
ap5platform.html?DCMP=OMAP5HQS=Other
+PR+wbu_omap5_pr_v OMAP™
Applications Processors - OMAP™
5
Platform]
1
https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
ARM Cortex-A15 MPCore - Chips
Other licensees, such as LG,[
http://www.arm.com/about/newsroom/
lg-electronics-licenses-arm-processortechnology-to-drive-platform-strategyin-home-and-mobile-markets.php LG
Electronics Licenses ARM Processor
Technology to Drive - ARM][
http://www.itproportal.com/2011/04/26
/why-lg-getting-arm-cortex-a15-licensebig-deal/ Why LG Getting ARM Cortex
A15 License Is A Big Deal |
ITProPortal.com] are expected to
produce an A15 based design at some
point.
1
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