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Section E3
Unique Interconnection Methods
Joseph Fjelstad
Richard Otte
Jack Fisher
Overview
• Focus on alternative methods of
interconnecting electrical components,
sub assemblies and assemblies over
distances up to 1 meter.
• The rate of change is accelerating
Evolution of Interconnections
Performance\Density
?
Stacked chips & packages
Embedded passives
Higher performance materials
Area Array & CSP packages
Smaller passives
HDI/build-up Multilayers
ICs in SMT packages
Smaller PTHs
Multilayer PCBs
ICs in DIP packages
PTH technology
Two metal layer PCBs
Discrete transistors
Single sided PCB
Vacuum tubes
Discrete wire interconnections
~1940
2009
Interconnection Technology
Gatekeeper of Performance
• For years interconnection technology was
undervalued
• Interconnection, not the IC, is more frequently
the limiting factor in chip/system performance
• Improved interconnections methodologies and
design approaches are required to overcome
the limitations and meet future needs
• The Interconnection Technology Roadmap
attempts to look beyond the horizon
Substrate Technology Evolution
Source Fujitsu
Road Mapping Chip Packaging
The Fusion of Silicon and Package
Scope
• Unique Interconnection Methods Include
– Printing
• Screen printing
• Offset
• Ink jet
– Solderless
• Occam/Solderless
• Electroplating
– Optical
• Waveguides
• Fiber
Jumping the Interconnect Gap
Traditional Interconnection Technology
Log
Performance
Improved Approach
Performance Potential
S
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Future
Current Status
• Much interest in Europe, especially the UK, in
using printing, particularly methods used with
paper.
• Optical interconnect is being explored for
>10Gb/s data rates in distances both within
1 meter and future on-chip.
– Some specialty backplane uses
– Products for off-chip at 100Gb/s+ data rates are
available. Provide power and size reduction.
– On-chip is 10years out
• Ink jet printing now used for some specialty
applications.
• Some early interest in the Occam process.
Optical Technology Roadmap
Partitioning Circuit Design
High speed data copper
or optical channel
between chips and
connectors
Simple PCB for power
ground and low speed
Prospective Two Surface Interconnection
3D Interconnection Possibilities
Topographic Potential
Basic
Occam
Concept
Occam - Direct Write
Rapid prototyping potential is compelling
Patents Pending
Needs Assessment
• Methods that are lower in cost, increase
density, transmit more data and reduce
power.
• Methods to interconnect components
electronic, optical,
– biological?, fluidic?, chemical?, etc.
• Printing and Occam require complete
system solutions that are low risk and
cost effective.
Challenges
• Finding customers for the newer
methods.
• Providing the Resources to Develop &
Demonstrate New Methods
• Finding Applications where the Cost of
the New Method is Less than the
Established Method
• Finding ways to implement the new
methods that are less costly than the
established methods.
• Thermal challenge looms large
Potential Solution Sponsors
• Adoption by a major Corporation with
the Needed Resources
• Government sponsorship
• Visionary Angel Investors
• A “Boot Strap” approach
Potential Paradigm Shifts
• Development of a Compelling Need or Vision
– Major reliability improvements from eliminating solder
– Major marketing advantage by “Going Green” using
the new methods
• Major Cost Reduction Is Demonstrated
• Totally New Applications Become Viable Due to
the New Technology
– For example, Printing on paper to make disposable
products and displays
Thermal Management:
Electronics' Rodney Dangerfield?
• Speeds are increasing and power increases with frequency and
cooler systems can operate faster
• More function in smaller space to meet speed and functional density
demands
• There is an inverse relationship between long term reliability and
thermal excursions and thermal extremes endured
• CTE mismatches create stress and strain on physical elements of
construction and must be addressed
• Challenge is amplified by lead-free solder
• Proactive thermal management helps preempt potential electrical
and mechanical problems and boost system performance
Summary
• New Assembly Methods are Evolving
– Printing Components Offers the Hope of
Extremely Low Cost and Rapid prototyping
– Optical methods replacing copper to reduce power
and size 80% when Data Rates exceed 10Gb/s
• Any New Method needs:
–
–
–
–
A Compelling Vision
A Champion
A Funding Source
An Initial Application and/or Customer
• Change is inevitable
Changing Dynamic?