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Tuning Carbon Nanotube Band Gaps with Strain Presented by: J.R. Edwards Zhuang Wu Pierre Emelie Michael Logue Carbon Nanotubes Long, thin cylinder of carbon---graphite sheet rolled into a tube Unique because different nanotubes can exhibit either metallic or semiconductor properties Metallic or Semiconductor If n1-n2=3q then metallic else semiconductor Orientation of the lattice along the tube is determined by both the diameter and chirality as indicated by the wrapping indices. Band Diagrams Cone like dispersion at k point Energy gap observed at slices away from k point Effect of Strain on Band Gap Experimental Device Fabrication AFM Atomic Force Microscope Contact Mode Non-Contact Mode Scan sample with tip in close contact with the sample Measure deflection of cantilever Feedback loop moves sample to maintain constant deflection Scan sample with tip just above the sample Apply small oscillations to tip Measure change in amplitude, phase, or frequency of cantilever in response to Van der Waals forces Feedback loop Tapping Mode Scan sample with oscillating tip intermittently contacting the sample Measure change in amplitude due to energy loss from contact with surface features Feedback loop Experimental Setup Tapping Mode Scan to create image of the nanotube structure Contact (+) Mode Scan to apply strain Tip operates as gate The L0 length of the tube is Ltube is the distance between the two gold contacts People first measure the force on the tip in a open circuit Force on the tip Strain force pointing upwards The range is long Adhesion force Pointing downwards Short range Adhesion force is Van der Waals force Force vs. z A:NT with d=5.3±0.5nm, L0=1.0±0.1μm B:NT with d=2.3±0.5nm, L0=1.5±0.1μm Slack: for A, slack=11nm, YA=2 μm; for B, slack=22nm YA=2.9 μm Slack Slack =Ltube-L0 where the Ltube is the original length of the tube From the distance between pushing and pulling onsets, ±zonset, the ‘‘slack’’ of a suspended NT can be determined. Nearly all NTs measured were slack, with typically 5–10 nm of slack for a 1 μm tube. We see a 0-force range, which represents the slack state. Positive force (strain) keeps going up as -z becomes larger and larger. Adhesion force gets larger in certain range, but when z goes out of the range, adhesion force suddenly disappears. σ(z) represents how much the length of the tube has changed. In constant YA, Y is the effective Young’s modulus, and A is an effective cross-section area. Here, the bending modulus of the NT has been ignored. Difference due to different d’s •The magnitude of YA values goes linearly with d •This results in the difference in force magnitude. • The magnitude of YA values and linearity with diameter d suggest that a single shell is carrying the mechanical load MWNT Electromechanical Response of Nanotubes 1st experiment: Constant-tip-voltage experiment • Conductance G is measured with Gold contacts • Strain is applied by moving the tip on the z-axis • Vtip is held at 0V The change in conductance will only be due to strain Electromechanical Response of Nanotubes 1st experiment: Constant-tip-voltage experiment 2nd • d=6.5nm and L0=1.9μm 1st • G is related to strain in agreement with previous results • Other NTs showed different behavior Another experiment is needed to understand the origin of this behavior Pushing Slack Pulling G is lowered G=0 G is lowered G=0 Electromechanical Response of Nanotubes 2nd experiment: G-Vtip • The tip is used as a gate • Vtip is swept ~3 times a second over a range of a few volts • Strain is slowly increased • G vs. Vtip is observed for different strains for two p-type NTs Electromechanical Response of Nanotubes 2nd experiment: G-Vtip Semiconducting NT Evac Evac 5.1 eV EC EV ~4.5 eV EC 5.1 eV EV ~0.7 eV/d (nm) EF EF Au Vtip=0 Au Au G increases G>0 As Vtip becomes negative, there is an accumulation of holes and G increases Valence band is partially filled and electrons are thermally activated from the valence band to the conduction band Evac Evac 5.1 eV Au Vtip<0 EC EV p 5.1 eV EF n p EC EV EF Au Vtip=V1>0 Au G is minimum As Vtip is increased, G decreases because the holes are depleted until reaching its minimum value Au Tunneling Au Vtip>V1 G increases As Vtip is increased above V1, a p-n-p junction forms in the middle of the tube and G increases due to tunneling current Electromechanical Response of Nanotubes 2nd experiment: G-Vtip Metallic NT Evac ~4.5 eV 5.1 eV EF Au Au G is constant and is not affected by Vtip G Semiconducting NT G Metallic NT G0 0 V1 Vtip Vtip Electromechanical Response of Nanotubes 2nd experiment: G-Vtip Metallic behavior at zero strain d=3 ±0.5nm and L0=1.4 ±0.1μm • An asymmetric dip centered at V1 develops as the NT is strained • V1≈1 V Semiconducting d=4 ±0.5nm and L =1.1 ±0.1μm 0 behavior at zero strain • Increase of G with strain • Reduction of the asymmetry of the dip Electromechanical Response of Nanotubes Interpretation dE gap sign (2 p 1)3t0 (1 ) cos 3 d t0 2.7eV 0.2 is the NT chiral angle p 1,0,1 with n1 n2 3q p Metallic and half of semiconduc ting NTs : p 0,1 Half of semiconduc ting NTs : p 1 dE gap d 0 dE gap d 0 Electromechanical Response of Nanotubes Interpretation Constant-tip-voltage experiment • Strain causes G to decrease dEgap/dσ>0 because there are less thermally activated carriers • Strain causes G to increase dEgap/dσ<0 because there are more thermally activated carriers NTs show different electromechanical response Metallic Semiconducting p=+1 Semiconducting p=1 dEgap/dσ>0 dEgap/dσ>0 dEgap/dσ>0 Strain causes G to decrease Strain causes G to decrease Strain causes G to increase Electromechanical Response of Nanotubes Interpretation G-Vtip • Increasing the strain causes to go from a metallic to a semiconducting behavior A bandgap is created in this initially metallic NT • The different curves show that the bandgap is increased since G decreases • Increasing the strain causes to increase G in this semiconducting NT The bandgap is decreased • Size of the conductance dip depends on the bandgap which changes with strain Electromechanical Response of Nanotubes Conclusion • The 1st experiment shows how the strain has an influence on G and therefore on the bandgap • This influence depends on the NT • The 2nd experiment shows we can create a bandgap in a metallic NT • It also shows how we can change the bandgap in a semiconducting NT Strain can be used to continuously tune the bandgap of a NT • In the next part, we will see how we can use this phenomenon to characterize NTs and other possible applications Conductance relation to bandgap For both the semiconducting and metallic nanotube (NT), there is a dip in the conductance at a tip voltage of about 1V. The dip is much greater and sharper for metallic NT’s. This dip is due to a charge carrier depletion in the NT’s middle section as the NT transitions from ptype to n-type. The resistance of the NT’s are modeled by the equation Rtot=RS + h/(|t|28e2)[1 + exp(Egap/kT)], where Egap=E0gap + (dEgap/dσ)σ This resistance equation is neglecting tunneling and is for low bias voltage. Conductance relation to bandgap As you can see, as Vtip increases EC dips toward EF at the middle. EC = EF at about 1V and at Vtip > 1V, EF is above EC in the middle. A p-n-p junction in the middle of the tube. The transport due to tunneling increases as ζ decreases Analysis of data The equations for Rtot and Egap give physical meaning to the fitting parameters, R0, R1, and β, used in the equation for the maximum resistance as a function of strain. The most important parameter is β, where dEgap/dσ =βkT. From the measured β values, values for dEgap/dσ where found for the tubes in figure 4a and 4b. The chiral angle was then estimated for the tubes using this data and the equation: dEgap/dσ= sign(2p +1)3t0(1 + ν)cosφ Analysis of data Additional device insight can be gained from the fitting parameter R1, where R1= h/(|t|28e2)exp(E0gap/kT). For the metallic tube (E0gap=0), the transmission probability |t|2=.25. Thus the transport of thermally activated electrons across the junction is not ballistic, but still highly transmissive. This is expected long mean free paths in NT’s. For the semiconducting tube, using |t|2=.25 as an estimate, E0gap is inferred to be 160meV. This value corresponds to a diameter of 4.7nm (using Egap=2t0r0/d). The diameter of 4.7nm is in reasonable agreement with the value of 4 +/- .5 nm measured by AFM. This agreement supports the validity of the resistance equation. Future Research Accurate quantatative comparison with theory requires an independent determination of the chiral angles of each NT. Variable temperature studies are needed to definitively separate out the tunneling and thermal activation contributions, which is not possible with current AFM A possible way to do this would be through advances in high resolution TEM A WKB model was used to estimate the effect of tunneling current. It was found that the tunnel current was smaller than the thermal current for ε<10meV/nm, where ε is the steepness of the barrier Looking at effect of higher strains: requires new methods of device fabrication and different AFM techniques At higher strains problems such as the NT slipping up the side of the AFM tip or sliding across the oxide surface occur Potential Applications NT heterojunctions for things such as 1-D super-lattice of quantum wells using a periodically strained NT New nano-electromechanical devices: pressure gauges, strain gauges (expected to be much more sensitive than doped Si strain gauges) Transducers, amplifiers, and logic devices Summary It has been shown that metallic NTs can be made semiconducting with applied mechanical strain, and that the bandgap of semiconducting NTs can be modified by strain. The change in bandgap causes a measurable change in the conductance of the NT’s. This research is consistent with previous research linking change in bangap with strain and with chirality.