Download Power Triple Lock PCB Headers

108-32090
Design
Objective
23 APR 15 Rev O2
The product described in this document has not been fully tested to ensure conformance to the requirements outlined below. Therefore, TE Connectivity (TE)
makes no representation or warranty, express or implied, that the product will comply with these requirements. Further, TE may change these requirements
based on the results of additional testing and evaluation. Contact TE Engineering for further details.
Power Triple Lock PCB Headers
1.
SCOPE
1.1.
Content
This specification covers performance, tests and quality requirements for the TE Connectivity (TE) PTL
Printed Circuit Board Header Assemblies. The PTL PCB Header Assembly is a wire-to-board connection
consisting contacts seated in a housing that mates to PTL Plug housings with contacts on 6.0 mm
centers. A complete connector consists a Header assembly, a PTL High Temp plug loaded with High
Temp contacts crimped to wires, an optional TPA device on plug and an optional CPA device.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Table 1 shall be used. All
inspections shall be performed using the applicable inspection plan and product drawing.
2.
APPLICABLE DOCUMENTS AND FORMS
The following documents and forms constitute a part of this specification to the extent specified herein.
Unless otherwise indicated, the latest edition of the document applies.
2.1.
2.2.
TE Connectivity Documents
A. 102-950:
Quality Specification (Qualification of Separable Interface Connectors)
B.
114-32136: Application Specification (Power Triple Lock PCB Headers)
C.
501-TBD:
D.
114-106118: Application Specification (Power Triple Lock (PTL) Connector System)
Qualification Test Report (Power Triple Lock PCB Headers)
Industry Document
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
2.3.
Reference Document
109-197: Test Specification (Tyco Electronics Test Specifications vs. EIA and IEC Test Methods)
3.
REQUIREMENTS
3.1.
Design and Construction
Product shall be of the design, materials, construction and physical dimensions specified on the
applicable product drawing.
3.2.
Ratings
A.
Voltage: 600 volts AC
B.
Current: See Table 3 for applicable current carrying capability. Maximum rated current that can be
carried by this product is limited by maximum operating temperature of the housings (150°C) and
temperature rise of the contacts (30°C). Variables to be considered for each application are: wire
size, connector size, contact material, ambient temperature, and printed circuit board design.
C.
Temperature: -55 to 150°C (High Temperature version)
-55 to 105°C (Standard Temperature version)
PRELIMINARY
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All Rights Reserved
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108-32090
3.3.
Performance and Test Description
Where applicable the Headers will be mated with the appropriate PLT High Temp plug housings
containing High Temp contacts crimped to #12 AWG stranded wire.
3.4.
Test Requirements and Procedures Summary
Unless otherwise specified, all tests shall be performed at ambient environmental conditions.
Test Description
Requirements
Procedures
Initial examination of product.
Meets requirements of product
EIA-364-18.
drawing and Application Specification Visual and dimensional (C of C)
114-32136
inspection per product drawing.
Final examination of product.
Meets visual requirements.
EIA-364-18.
Visual examination.
ELECTRICAL
Low Level Contact Resistance
(LLCR).
3.5 milliohms maximum initial.
10 milliohms maximum final.
EIA-364-23.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage. See Figure 3.
Insulation resistance.
1000 megohms minimum initial.
100 megohms minimum final.
EIA-364-21.
500 volts DC, 2 minute hold.
Test between adjacent contacts.
Dielectric Withstanding voltage.
One minute hold with no breakdown
or flashover.
5 milliamperes maximum leakage
current.
EIA-364-20, Condition I.
3Kv DWV AC at sea level.
Test between adjacent contacts.
Temperature rise vs. current.
30°C maximum temperature rise.
EIA-364-70, Method 1.
Stabilize at a single current level until
3 readings at 5 minute intervals are
within 1°C. See Figure 4.
MECHANICAL
Sinusoidal vibration.
No discontinuities > 1 microsecond
shall occur.
See Note 1.
EIA-364-28, Test Condition I.
Subject mated specimens to 10 to 55
to 10Hz traversed in 1 minute with 1.5
mm maximum total excursion. Two
hours in each of 3 mutually
perpendicular planes.
Mechanical shock.
No discontinuities > 1 microsecond
Shall occur.
See Note 1.
EIA-364-27, Method A.
Subject mated specimens to 50 G's
half-sine shock pulses of 11
milliseconds duration. Three shocks
in each direction applied along 3
mutually perpendicular planes, 18
total shocks.
Durability.
See Note 1.
EIA-364-9.
Mate and unmate specimens for 50
cycles at a maximum rate of 500
cycles per hour.
Figure 1 (cont)
Rev O2
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108-32090
Test Description
Requirements
Procedures
Mating force.
6.67 N maximum per contact.
EIA-364-13.
Measure force necessary to mate
specimens with companion headers
with locking latch disengage at a
maximum rate of 12.7 mm per minute.
Contact retention.
20.0N (4.5 lbf) minimum
EIA-364-29. Method C.
Apply axial load at a rate of 12.7
mm/min.
Resistance to soldering heat.
See Note 1 and 2.
EIA-364-56, Procedure 3, Condition
Letter G for 5 second and 10 second
exposure durations.
Connector locking strength.
89N minimum without CPA
133.5 minimum with CPA
EIA-364-98.
Measure connector locking strength
at a maximum rate of 25.4 mm per
minute.
ENVIRONMENTAL
Test Description
Requirements
Procedures
Thermal shock.
See Note 1.
EIA-364-32, Test Condition I. Subject
mated specimens to 25 cycles
between -55 and 85°C with 30 minute
dwells at temperature extremes and 1
minute transition between
temperatures.
Humidity/temperature cycling.
Dielectric withstanding voltage (final)
2.5 Kv AC 1 minute. Insulation
resistance (final) 100 M ohms Min.
10 mohms maximum (final)
EIA-364-31, Method III.
Subject specimens to 10 cycles (10
days) between 25 and 65°C at 80 to
100% RH.
Temperature life.
LLCR 10 mohms maximum (final)
EIA-364-17, Method A. Subject mated
specimens to 105°C for 500 hours.
Salt spray.
LLCR 10 mohms maximum (final)
EIA-364-26 B. condition B.
Subject mated specimens to 5% salt
concentration for 48 hours.
Figure 1 (end)
NOTE 1
Product shall meet visual requirements, show no physical damage, and meet requirements of
additional tests as specified in the Product Qualification and Requalification Test Sequence
shown in Figure 2.
NOTE 2
Some distortion of the Header is permissible provided that it continues to function and can be
mated with the applicable Plug.
Rev O2
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108-32090
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
1
2
3
4
5
6
7
1
1
1
Test Sequence (b)
Initial examination of product
LLCR
1
1
1
3,7
2,6
2,4
insulation resistance
2,6
Withstanding voltage
3,7
Temperature rise vs. current
1
3,8
Sinusoidal vibration
5
Mechanical shock
6
Durability
4
Mating force
2
7(c)
Contact retention
2
Resistance to soldering heat
2
Connector locking strength
2
Thermal shock
4
Humidity/temperature
cycling
4(d)
Temperature life
5
5
Salt spray
3
Final examination of product
8
9
8
3
3
5
3
Figure 2
NOTE
Rev O2
(a)
Specimens shall be prepared in accordance with applicable instruction sheets and shall be
selected at random from current production. Test groups 1, 2, 3, 6 and 7 shall each
consist of a minimum of 5 specimens with a minimum of 30 data points. Test groups 4, 5
and 8 shall each consist of a minimum of 5 specimens.
(b)
Numbers indicate sequence in which the tests shall be performed.
(c)
Discontinuities shall not be measured. Energize at 18°C level for 100% loadings per
Quality Specification 102-950.
(d)
Precondition specimens with 10 durability cycles.
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Figure 3
LCR Measurement Points
(Subtract Wire Bulk)
Number of Positions
Max Current (A)
1
20
2
20
3
20
4
19
5
18
Table 3 – Current Rating (Initial) – Vertical Header
NOTE
These currents are expected to produce an initial 30ᵒC maximum temperature rise at the
contacts when the header assembly is soldered into a PC board and mated with a PTL High
Temperature Plug housing (see section 3.4). It is expected that the traces in the PC board will
be of adequate size so that they do not contribute to the overall temperature.
Rev O2
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