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TIME DOMAIN MODELING OF PIN CONTROL AND LIMITER DIODES Robert H. Caverly and Michael J. Quinn Department of Electrical and Computer Engineering Villanova University Villanova, PA 19085 ABSTRACT A time domain model for the microwave and RF PIN switching diode is presented. The model is suitable for use in such time domain simulators as SPICE and simulates the important I-region charge storage phenomenon and its effect on the PIN diode behavior in active circuits such as switches, attenuators and power limiters. For a SPST switch, the variation in PIN diode impedance is shown to affect the insertion loss in the switch. For microwave power limiters, spike leakage variation versus frequency for different RF voltages is also presented, showing the reduction in power limiting with increasing frequency for a given PIN diode. 1. INTRODUCTION PIN diodes are used in a wide variety of commercial and defense applications which include antenna switching and attenuator applications. Microwave and RF design engineers frequently use time domain simulators such as SPICE or one of its derivatives for computer aided design of microwave circuits and systems using these devices. In spite of the widespread use of PIN diodes in microwave and RF circuits and systems, there has been slow progress toward developing a time domain model that adequately simulates the PIN diode. One time domain model that has already been advanced is strictly a current controlled resistance with package parasitics [1]. This model does not include such important effects as I-region charge storage, which is the dominant mechanism in governing such PIN diode behavior as the impedance-frequency characteristic, or its transient response in passive or quasi-active microwave power limiter circuits. This paper presents a model for the PIN diode that allows time domain simulation using circuit simulators such as SPICE. The model includes both junction effects (making it suitable for dc bias simulation) as well as low and high frequency I-region charge storage and transient phenomenon. The model will allow design engineers to use SPICE or other time domain CAD tools to perform simulation of PIN diodes and ancillary circuitry such as switch drivers. The model is easily embedded in more complex circuits for use in full system simulation since it uses standard SPICE and PIN diode electrical parameters. Verification of the new model is made by comparing analytic and experimental results. 2. THEORETICAL DISCUSSION The PIN diode is characterized by a lightly doped intrinsic (or I-) region sandwiched between heavily doped p-type and n-type regions. The electrical structure arising from this physical structure is of two PN-type junctions on either end of a highly resistive region (I-region) subject to conductivity modulation by an applied dc forward current. For time domain simulation, the PI and IN junctions can be characterized by the usual PN junction diode circuit elements. Modeling the Iregion is more problematic since this region exhibits charge storage phenomenon due to conductivity modulation which is manifested in the charge-current (or Q-I) relationship. Several circuit simulation models exist (APLAC and HP LIBRA, for example) that have a PIN diode element in their libraries, but none of these CAD tools include I-region charge storage effects. It is the I-region charge storage effect that governs such PIN diode behavior as the impedance-frequency characteristic, insertion loss and limiter behavior. The I-region charge storage phenomenon in PIN diodes is described by the ambipolar carrier transport equation: 0-7803-5135-5/99/$10.00 (c) 1999 IEEE ∂ 2 n( x , t ) n( x , t ) 1 ∂n( x , t ) (1) = + dx 2 Daτ Da dt This mathematical representation of the I-region charge storage effect has been successfully combined with the PN junction portions of the PIN diode and implemented as an analytical model [2-5]. Implementation of Equation 1 in the time domain model is performed by applying boundary value conditions and deriving the stored charge-current relationship in the Iregion in the s-domain [6]. The resulting SPICE implementation uses standard simulation parameters and includes such effects as unequal carrier mobilities (for silicon and gallium arsenide PIN diode simulations) as well as unequal junction characteristics. The parameters in the time domain model are common to other models [1-5]. In addition to the standard PN junction simulation parameters (reverse saturation current and the diode ideality factor), the model requires knowledge of the Iregion width and ambipolar carrier lifetime. Limiting resistance values Rmin (minimum high current resistance) and Rmax (zero bias resistance) are easily added [1]. Extrinsic parameters such as junction and package capacitances and bond wire inductances can be included in the model. 3. APPLICATIONS AND RESULTS 3.1 SPST Switch Application Simulations using a commercial version of PSPICE were performed to compare the model described with previously published analytical results [2-5]. Figure 1 shows the resistive and reactive impedance components of a PIN diode using the proposed model plotted with the analytical results for a gallium arsenide device with a 3 µm I-region width and 5.6 nanoseconds carrier lifetime at 1 mA dc forward current [2]. Plotted with the simulated results are experimental data (circles) taken on a PIN diode with the same characteristics. The agreement between the PSPICE and analytical results and the experimental data is very good, validating the model for use in simulating the PIN diode impedance-frequency characteristic. Impedance (Ohms) Resistive Component Reactive Component Frequency (Hz) Figure 1. Comparison of SPICE and analytical models with experimental data (circles) for a gallium arsenide PIN diode. The impedance-frequency characteristic will influence the insertion loss of a microwave and RF circuit that uses this PIN diode as the control element. Figure 2 shows simulated resistance for a PIN diode (W=25 microns, τ=100 nS) biased at 10 mA as a function of frequency, indicating that the resistance monotonically decreases up to 1000 MHz. Note that the diode resistance varies from approximately 5 Ohms down to 3.25 Ohms over the frequency range of the switch. Figure 3 shows that the insertion loss of a SPST switch using the above device varies from approximately 0.4 dB at 10 MHz to 0.25 dB at 1000 MHz. Note that the insertion loss curve tracks with the resistance curve, indicating the change in insertion loss with frequency is primarily caused by the diode and not the dc biasing network (which was included in the simulation structure). 0-7803-5135-5/99/$10.00 (c) 1999 IEEE 5 Load Voltage (V) Spike Leakage Turn off 0 Flat Leakage -5 Time (nS) Figure 2. Simulated resistance of the PIN diode using the time domain model described in the paper. Figure 4. Full waveform of two anti-parallel silicon PIN diodes in a fully passive microwave limiter. The 10 volt RF pulse begins at 50 nS and ends at 150 nS. Figure 5 summarizes the results of a number of simulations for the 2 diode limiter, showing the input/output power curve, indicating the increase in flat leakage with increasing input power. Figure 3. Insertion Loss (dB) as a function of frequency for the SPST switch shown in Figure 2A. 3.2 Limiter Application PIN diodes are often used in applications that limit the level of microwave voltage on sensitive receiver components [7]. A major difficulty in limiter modeling is describing spike and flat leakage during the turn-on and turn-off transients. The model described here was applied to a 2 diode passive PIN diode limiter (Iregion thickness of 5 microns, carrier lifetime of 10 nS) with the diodes separated by 0.1λ transmission lines. Figure 4 shows the response of this circuit to a 10 volt 1.0 GHz microwave pulse. The spike leakage is prominently shown in Figure 4, with the simulation showing spike leakage lasting for approximately 10 nanoseconds. Figure 5. Input/output power curves for a 2 diode antiparallel PIN diode limiter (same diode characteristics as Figure 4). Figure 6 shows limiter diode spike leakage under three different microwave pulsed voltage conditions as a function of frequency. The spike leakage increases with frequency for a given microwave voltage applied to the circuit. This increase in spike leakage is due to the short RF cycle of the higher frequency signals not providing sufficient time for carriers to transit the I-region and set up the high conductance Iregion. 0-7803-5135-5/99/$10.00 (c) 1999 IEEE 6. A. Strollo, “A New SPICE Model of Power P-I-N Diode based on Asymptotic Waveform Evaluation”, IEEE Trans. Power Electronics, vol. 12(1), pp. 1220, Jan. 1997. 7. A. Ward,; R. Tan, and R. Kaul, “Spike leakage of thin Si PIN limiters”, IEEE Trans. Microwave Theory and Tech., vol. 42(10), pp. 1879-1885, 1994. 7. APPENDIX SPICE Subcircuit Template Figure 6. Spike leakage (load voltage) for 5.0, 10.0 and 20.0 volt RF pulses as a function of frequency. The simulations were performed with the same circuit and PIN diodes as used for Figure 4. 4. CONCLUSIONS A method has been presented for time domain modeling of the PIN diode. Using this model, microwave and RF engineers designing with PIN diodes can readily use time domain circuit simulators such as SPICE to study PIN diode effects in circuits and systems more easily. The new model has been validated using both analytical models and experimental measurements. 5. ACKNOWLEDGMENT This material is based upon work supported by the National Science Foundation under Grant No. CCR-9805718. 6. REFERENCES 1. J. Walston, “Spice Circuit yields recipe for PIN diode”, Microwaves and RF, pp. 78-89, Nov. 1992 2. R. Caverly and G. Hiller, "The Small Signal ac Impedance of Gallium Arsenide and Silicon PIN Diodes," Solid-State Electronics, vol. 33(10), Oct., 1990. 3. R. Caverly and G. Hiller, "The Frequency Dependent Impedance of p-i-n Diodes”, IEEE Trans. Microwave Theory and Tech., vol. 37(4), pp. 787790, April, 1989. 4. Lebedev, I.V.; Drozdovskaya, L.M.; Drozdovskij, N.V.; Shnitkov, A.S., “Determination of the active component of pin-diode impedance”, Radiotekhnika i Elektronika, vol. 41(3), pp. 370-373, Mar., 1996. 5. R. Varshney, D. Roulston, and S. Chamberlain, “Some properties concerning the a.c. impedance of PI-N and P-N-N+ diodes”, Solid-State Electronics, vol. 17, p. 699, 1974. .subckt pin 9 20 params: is=1e-10, + n=1, ikf=3, phi=.7, + rlim=1.8m, repi=800k, cj=0.5pf, + tau=.116u, w=10u, + lbond=0.5nh, cpack=0.25pf * b=3 for silicon; b=15 for GaAs + b=3 .param to={w*w/.001935/4} .param v1={w*w/tau/0.1} .param alf={to/tau} .param npi={2*n/(1+b)} .param nin={2*b*n/(1+b)} cpack 9 20 {cpack} lbond 9 10 {lbond} cjunc 10 20 {cj} repi 10 12 {repi} rlim 10 11 {rlim} grmod 11 12 value={2*(v(11,12)*v(2,3)/v1)} gpin 12 20 value={i(vs2)} rpin 10 20 1e12 ej 30 0 value={v(12,20)} vs1 30 31 0 * two different junction models needed for * Dember contribution dpi 31 32 dj1 din 32 0 dj2 .model dj1 d (is={is},ikf={ikf},n={npi}) .model dj2 d (is={is},ikf={ikf},n={nin}) e1 1 0 value={i(vs1)} vs2 1 2 0 * 6th order approximation for base region rp1 2 3 1 cp1 2 3 {tau} rs1 3 0 {alf/3} rp2 3 4 5 cp2 3 4 {tau/5} rs3 4 0 {alf/7} rp4 4 5 9 cp4 4 5 {tau/9} rs5 5 0 {alf/11} .ends 0-7803-5135-5/99/$10.00 (c) 1999 IEEE