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American International University- Bangladesh Faculty of Engineering (EEE) Lab exp-09: of MOSFET :Study of Switching Characteristics and Switching Loss Course teacher: MOHAMMAD ISMAIL HOSSAIN Course Title: Electronic Devices Lab Course code: 00717 Section: Q Semester: Spring (2015-2016) Date of submission: 04-04-2016 Group No: 01 NO NAME ID 1 HASAN MEHRAB 15-28369-1 2 ISLAM RAKIBUL 15-29297-1 3 SARKER APURBO KUMAR 15-28261-1 4 LISAN SAKHWAT HOSSAIN 15-28256-1 5 ALAM, CHOUDHURY ASBHA 15-28518-1 6 MAJUMDAR ANIK KUMAR 15-28306-1 Title:Study of Switching Characteristics and Switching Loss of MOSFET abstract: The most common transistor types are the Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) and the Bipolar Junction Transistors (BJT). BJTs based circuits dominated the electronics market in the 1960's and 1970's. Nowadays most electronic circuits, particularly integrated circuits (ICs), are made of MOSFETs. The BJTs are mainly used for specific applications like analog circuits (e.g. amplifiers), high-speed circuits or power electronics. There are two main differences between BJTs and FETs. The first is that FETs are chargecontrolled devices while BJTs are current or voltage controlled devices. The second difference is that the input impedance of the FETs is very high while that of BJT is relatively low. As for the FET transistors, there are two main types: the junction field-effect transistor (JFET) and the metal oxide semiconductor field effect transistor (MOSFET). The power dissipation of a JFET is high in comparison to MOSFETs. Therefore, JFETs are less important if it comes to the realization of ICs, where transistors are densely packed. The power dissipation of a JFET based circuit would be simply too high. The combination of ntype and p-type MOSFETs allow for the realization of the Complementary Metal Oxide Semiconductor (CMOS) technology, which is nowadays the most important technology in electronics. All microprocessors and memory products are based on CMOS technology. The very low power dissipation of CMOS circuits allows for the integration of millions of transistors on a single chip. In this experiment, we will concentrate on the MOSFET transistor. We will investigate its characteristics and study its behavior when used as a switch. The objective of this experiment is to study the MOSFET as 1. Switching characteristics and 2. Switching loss Theory and Methodology: MOSFETs Structure and Physical Operation The MOSFETs are the most widely used FETs. Strictly speaking, MOSFET devices belong to the group of Insulated Gate Field Effect Transistor (IGFETs). As the name implies, the gate is insulated from the channel by an insulator. In most of the cases, the insulator is formed by a silicon dioxide (SiO2), which leads to the term MOSFET. MOSET like all other IGFETs has three terminals, which are called Gate (G), Source (S), and Drain (D). In certain cases, the transistors have a fourth terminal, which is called the bulk or the body terminal. In PMOS, the body terminal is held at the most positive voltage in the circuit and in NMOS, it is held at the most negative voltage in the circuit. There are four types of MOSFETs: enhancement n-type MOSFET, enhancement p-type MOSFET, depletion n-type MOSFET, and depletion p-type MOSFET. The type depends whether the channel between the drain and source is an induced channel or the channel is physically implemented and whether the current owing in the channel is an electron current or a hole current. The cross section of an enhancement NMOS transistor is shown in figure below. If we put the drain and source on ground potential and apply a positive voltage to the gate, the free holes (positive charges) are repelled from the Schematic cross section of an enhancement type NMOS transistor Symbols for Enhancement NMOS Transistor Symbols for Enhancement PMOS Transistor region of the substrate under the gate (channel region) due to the positive voltage applied to the gate. The holes are pushed away downwards into the substrate leaving behind a depletion region. At the same time, the positive gate voltage attracts electrons into the channel region. When the concentration of electrons near the surface of the substrate under the gate is higher than the concentration of holes, an n region is created, connecting the source and the drain regions. The induced n-region thus forms the channel for current flow from drain to source. The channel is only a few nanometers wide. Nevertheless, the entire current transport occurs in this thin channel between drain and source. A common application of MOSFETs is switches in analog and digital circuits. Switches in analog circuits can be used for example in data acquisition systems, where they serve as analog multiplexors, which allow the selection of one of several data inputs. A simple example of a switching circuit based on an n-type enhancement transistor and a resistor is shown below. The voltage applied to the gate controls the conductance of the channel. A zero or low value of VGS, the conductance is very low so that is the transistor acts like an open circuit and no current flows through the load resistor RL. When V GS exceeds the threshold, the channel conductance becomes higher and the transistor acts like a closed switch. The channel resistance is not getting zero but the resistance is getting small so that the output voltage Vout is getting small. Fig.(a) below shows an NMOS switching FET and its models for Vin = 0 (Fig. (b)) and Vin = +5V (Fig. (c)). In each case, the FET is modeled as a mechanical switch. Fig: NMOS transistor switch As for PMOS, a negative value of VGS has to be applied to turn the transistor on. The operation can be described using the curves shown in figure below. When the input voltage, VGS, of the transistor shown is zero, the MOSFET conducts virtually no current, and the output voltage, Vout, is equal to VDD. When VGS is equal to 5V , the MOSFET Q-point moves from point A to point B along the load line, with VDS = 0.5V . Thus, the circuit acts as an inverter. The inverter forms the basis of all MOS logic gates. Fig: MOSFET switching characteristics Pre-Lab Homework: Apparatus: 1) Trainer Board : 2) MOSFET : 3) Resistors 4) DC Power Supply 5) 6) 7) 8) Power Supply Cable Multimeter Signal Generator Oscilloscope 1pc IRF540 [ ] 1pc : 1KΩ [ ] : [2 pcs] Precautions: Have your instructor check all your connections after you are done setting up the circuit and make sure that you apply only enough voltage to turn on the MOSFET, otherwise it may get damaged. Experimental Procedure: Problem 1: Study of Switching Characteristics of MOSFET Circuit Diagram: RD = 1K IRF540 VD = 20V V GS Experimental Procedures: 1. 2. 3. 4. 5. Set VGS to zero and recorded the VDS, VL and ID. Increased the gate voltage VGS gradually and recorded the readings. reading was talking until ID = 20mA (or the saturation current of the MOSFET). Note the condition of VDS and ID of steps 1 and 3. Repeated the experiment for VDD = 15 Volts. Problem 2: Study of Switching Losses of MOSFET: Circuit Diagram: Experimental Procedure: 1. Construct the circuit as shown in the above figure. 2. With square/sinusoidal wave gate signal observe the VDS and ID simultaneously. 3. Drawn both the wave shapes. Data Table: 1 VDD = 15V VDD = 20V VGS 0 0.5 VDS 15.00 15.02 VL 0 0 ID 0 0 1 15.02 0.1 mv 0 1.5 2 2.5 15.02 14.03 15.05 0.2 mv 0.2mv 8.2mv 0 0.03 mA 0.43mA VGS 0 0.5 VDS 20.03 20.03 VL 0 0 ID 0 0 1 19.99 0 0 1.5 2 2.5 20.01 20.03 20.04 0 0 0 0 0.06 mA 1.83 mA Question and Answers: 1.Plot VGS Vs VDS and VGS Vs ID. 25 20 15 10 Series1 5 0 0 -5 1 2 3 4 5 6 200 180 160 140 120 100 Series1 80 60 40 20 0 -20 0 1 2 3 4 5 6 2. What is the gate voltage that turns on the MOSFET? snA: ta bloThd ohA al ng Tl v hT3 V. 3. From the curve of ID and VDS plot PD = VDS * ID, Power loss during ON time of the switch. 450 400 350 300 250 Series1 200 150 100 50 0 0 0.5 1 1.5 2 2.5 3 3.5 4. What will happen if frequency of the gate signal is increased to a very high level? snA: ta dh n bloThd g ia hA A oa a hA Ta aa e nio nia hA A. Discussion and Conclusion: All the apparatus were checked before the start of the experiment. The oscilloscope was calibrated before the start of the experiment. Care should be taken to avoid short connections. Short connections can produce heat (due to high current flow) which can be harmful for the components and damage the component. ta A rm a e nT ohA m aalae g Tlstudy about Ta Awitching iharacteristics and Awitching ooss of MOSFET .ta ghTh hng Ta molT g i ab A lvTh n g aale Ta rm a e nT malb g TahT MOSFET bloThd A malb g g hng Ta mlo a olAA nia hA A haT a gl A nlT hiT bhT nT o h i aTh n dhT ialAA nd Ta dhT bloThd . Reference(s): 1. American International University–Bangladesh (AIUB) Electronic Devices Lab Manual. 2. A.S. Sedra, K.C.fahm Smith, Microelectronic Circuits, Oxford University Press (1998) .