Download Lead-free (Pb

Survey
yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Document related concepts
no text concepts found
Transcript
Eco-Info & Lead-free (Pb-free):
Lead-free (Pb-free) Logo
July 21, 2007 - TI Implements Label Changes for Lead-free (Pb-free) IC packages to include chasing arrow symbol
Lead-free (Pb-free) Logo
TI to Implement Label Changes for Lead-free (Pb-free) IC packages
TI is committed to supplying Lead-free (Pb-free) semiconductor components that are compatible with the higher temperature
requirements of lead-free soldering processes. TI defines "Lead-free (Pb-free) " or "Pb-Free" to mean semiconductor products
that are compatible with the current RoHS requirements for all six substances, including the requirements that lead not exceed
0.1% by weight in homogeneous materials. RoHS, also known as "Restriction on the Use of Hazardous Substances in Electrical
and Electronic Equipment," refers to legislation 2002/95/EC enacted by the European Union on January 27, 2003.
RoHS status is based on TI's current understanding of the European Union's RoHS Directive 2002/95/EC, and TI's knowledge of
the materials that go into its products.
Examples of TI's Pb-Free finishes include nickel-palladium-gold (NiPdAu) for leadframe-based packages and tin-silver-copper
(SnAgCu) balls for array packages. Many TI packages are already qualified with Pb-Free finishes/balls and high-temperature
material sets.
In addition to the conversion of integrated circuit (IC) packages to Pb-Free/high-temperature material sets, many TI packages
will also transition to "Green" mold compounds. TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br)
and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
Pb-Free Product Package Labels: After July 21, 2007, TI began shipping Pb-Free capable IC components using packing labels
on shipping boxes and bags that continue to align with JESD97 "Marking, Symbols and Labels for Identification of Lead (Pb) Free
Assemblies, Components and Devices" released in May 2004. There are no changes to the Pb-free symbol currently used on
products containing no RoHS materials above the maximum concentration values. TI labels will continue to reflect these
markings for applicable devices (See Figures 1 - 4 below).
TI originally implemented the use of the Pb-free logo on packaging labels in 2003 for devices that utilize both a Pb-Free finish and
a material set rated for use in lead-free reflow processes (see the details of TI's previous labeling, Pb-free Label through May
2004, Pb-free Label June 2004 through June 2007).
TI is rating our surface mount packages for use in reflow operations with a peak temperature as defined by the joint IPC / JEDEC
standard (J-STD-020).
Pb-Free Finish Category: The JEDEC JESD97 and IPC-1066 standards were combined to make the joint IPC / JEDEC J-STD-609
and includes Pb-Free finish categories with an option to identify the component finish on the packing label and in the device
marking (see figure 5 below). The JEDEC Pb-Free finish categories that describe the Lead-free (Pb-free) terminal finish/material
of components and/or the solder paste/solder used in board assembly are:

e0 - contains intentionally added lead (Pb)

e1 - SnAgCu (shall not be included in category e2)

e2 - Sn alloys with no Bi or Zn excluding SnAgCu

e3 - Sn

e4 - Preplated (e.g., Ag, Au, NiPd, NiPdAu)

e5 - SnZn, SnZnx (no Bi)

e6 - contains Bi

e7 - low temperature solder (</= 150C) containing Indium (no Bi)

e8, e9 symbols are unassigned at this time
TI will print the Pb-Free finish category (e1, for example) on the packing label of applicable device/package combinations
beginning June 1, 2004.
Green Conversions: Beginning June 1, 2004, TI will change the "e" in the Pb-free finish category to a "G" when a TI
device/package combination converts to a "Green" mold compound. For example, a TI device built with NiPdAu finish will have
a Pb-free finish category of "e4" until a green mold compound is implemented. When implemented, the Pb-Free finish category
will be changed to "G4". (Replacement of the "e" with a "G" in the Pb-Free finish category is not part of the J-STD-609 standard
at this time, but will be implemented for TI products.) "G3" category is "E3" matte tin (Sn) Pb-free finish with "Green" mold
compound.
RoHS symbolization: Beginning July 21, 2007, TI will add the chasing arrow symbol to its labels. Products containing no RoHS
materials above MCVs will have the chasing arrow with an "e" in the middle. Product that contains RoHS materials above MCVs,
even if that use is exempted in the EU, will use the chasing arrow symbol with the Environmentally Friendly Use Period of 50 years
in the middle. This would apply to products which require an EU RoHS exemption, like TI flip-chips, or product that contains one
of the RoHS materials above the MCV allowed.