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TPD2E1B06 www.ti.com.cn ZHCSBF3A – AUGUST 2013 双通道高速静电放电 (ESD) 保护器件 查询样品: TPD2E1B06 特性 应用范围 1 • • • • • • • • 为低压输入输出 (IO) 接口提供系统级的静电放电 (ESD) 保护 IEC 61000-4-2 4 级接触 ESD 额定值 IO 电容值 1pF( (典型值) 直流 (DC) 击穿电压 7V( (最小值) 超低泄漏电流 10nA( (最大值) 低 ESD 钳位电压 车用温度范围:–40°C 至 125°C 小型易于走线的 DRL 封装 • • • • 游戏机 电子书 便携式媒体播放器 数码摄像机 说明 TPD2E1B06 是一款双通道超低电容 ESD 保护器件。 它提供 ±10KV IEC 接触 ESD 保护。 其 1pF 线路电容 值使得这款器件适合于广泛应用。 典型应用接口为 USB 2.0,低压差分信令 (LVDS) 和 I2C。 有两个针对 TPD2E1B06 的常见布局布线方法并且都在应用信息部 分中突出显示。 IOA1 1 6 NC IOB1 2 5 IOA2 NC 3 4 IOB2 DRL 1.6 mm x 1.2 mm x 0.55mm (0.5-mm pitch) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated English Data Sheet: SLVSC77 TPD2E1B06 ZHCSBF3A – AUGUST 2013 www.ti.com.cn This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. FUNCTIONAL BLOCK DIAGRAM IOA1 IOB1 IOA2 IOB2 Figure 1. CIRCUIT SCHEMATIC DIAGRAM TERMINAL FUNCTIONS PIN NAME NO. PIN TYPE DESCRIPTION IOA1 1 I/O IOA2 5 I/O IOB1 2 I/O IOB2 4 I/O 3, 6 NC NC USAGE ESD protected channel Please refer to the Application Information Section. No connect Can be left floating, grounded, or connected to VCC ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VALUE UNIT Operating temperature range –40 to 125 °C Storage temperature –65 to 155 °C IEC 61000-4-2 contact ESD (1) ±10 kV IPP Peak pulse current (tp = 8/20μs) (1) 2.5 A PPP Peak pulse power (tp = 8/20μs) (1) 35 W (1) Using Routing Option 1 or 2 as shown in Figure 2 or Figure 3. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) TPD2E1B06 THERMAL METRIC (1) DRL UNIT (6) PINS θJA Junction-to-ambient thermal resistance 349.7 θJCtop Junction-to-case (top) thermal resistance 120.5 θJB Junction-to-board thermal resistance 171.4 ψJT Junction-to-top characterization parameter 10.8 ψJB Junction-to-board characterization parameter 169.4 (1) 2 ºC/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2013, Texas Instruments Incorporated TPD2E1B06 www.ti.com.cn ZHCSBF3A – AUGUST 2013 ELECTRICAL CHARACTERISTICS over operating free-air temperature range. (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX VRWM Reverse stand-off voltage VCLAMP Clamp voltage with ESD strike IPP = 1 A, TLP, I/O to GND (1) (2) 11 V IPP = 5 A, TLP, I/O to GND (1) (2) 15 V Clamp voltage with ESD strike (1) (2) VCLAMP IPP = 1 A, TLP, GND to I/O 11 V IPP = 5 A, TLP, GND to I/O (1) (2) RDYN Dynamic resistance CL1 Pin 2 and 5 capacitance Pin 1 and 4 = GND, f = 1MHz, VBIAS = +2.5V (2) (3) CL2 Pin 1 and 4 capacitance Pin 2 and 5 = GND, f = 1MHz, VBIAS = +2.5V (2) (4) VBR Break-down voltage IIO = 1 mA ILEAK Leakage current VBIAS = +2.5 V (1) (2) (3) (4) 5.5 UNIT V 15 V 0.9 Ω 0.85 pF 1.05 7 1 pF 9.5 V 10 nA Transmission line pulse with rise time 10ns and pulse width 100ns. TA = 25°C Using Routing Option 1, Figure 2. Using Routing Option 2, Figure 3. Copyright © 2013, Texas Instruments Incorporated 3 TPD2E1B06 ZHCSBF3A – AUGUST 2013 www.ti.com.cn APPLICATION INFORMATION There are 2 channels of back-to-back diodes in TPD2E1B06DRL. The device should be routed in one of the two ways shown below. Routing option 1 is recommended because TPD2E1B06 is designed to maximize signal integrity in this configuration while still comply with IEC 61000-4-2 level 4 contact ESD rating. GND Line 1 1 6 2 5 3 4 Line 2 GND Figure 2. Routing Option 1 Line 1 GND 1 6 2 5 3 4 GND Line 2 Figure 3. Routing Option 2 4 Copyright © 2013, Texas Instruments Incorporated TPD2E1B06 www.ti.com.cn ZHCSBF3A – AUGUST 2013 REVISION HISTORY Changes from Original (July 2013) to Revision A • Page 将文档从预览改为生产数据。 ............................................................................................................................................... 1 Copyright © 2013, Texas Instruments Incorporated 5 PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) TPD2E1B06DRLR ACTIVE Package Type Package Pins Package Drawing Qty SOT-OTHER DRL 6 4000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Op Temp (°C) Device Marking (4/5) (DUH ~ DUL) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPD2E1B06DRLR Package Package Pins Type Drawing SPQ SOTOTHER 4000 DRL 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 9.5 Pack Materials-Page 1 1.78 B0 (mm) K0 (mm) P1 (mm) 1.78 0.69 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 3-Mar-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD2E1B06DRLR SOT-OTHER DRL 6 4000 184.0 184.0 19.0 Pack Materials-Page 2 IMPORTANT NOTICE 有关 TI 设计信息和资源的重要通知 德州仪器 (TI) 公司提供的技术、应用或其他设计建议、服务或信息,包括但不限于与评估模块有关的参考设计和材料(总称“TI 资源”),旨在 帮助设计人员开发整合了 TI 产品的 应用; 如果您(个人,或如果是代表贵公司,则为贵公司)以任何方式下载、访问或使用了任何特定的 TI 资源,即表示贵方同意仅为该等目标,按照本通知的条款进行使用。 TI 所提供的 TI 资源,并未扩大或以其他方式修改 TI 对 TI 产品的公开适用的质保及质保免责声明;也未导致 TI 承担任何额外的义务或责任。 TI 有权对其 TI 资源进行纠正、增强、改进和其他修改。 您理解并同意,在设计应用时应自行实施独立的分析、评价和 判断, 且应全权负责并确保 应用的安全性, 以及您的 应用 (包括应用中使用 的所有 TI 产品))应符合所有适用的法律法规及其他相关要求。你就您的 应用声明,您具备制订和实施下列保障措施所需的一切必要专业知 识,能够 (1) 预见故障的危险后果,(2) 监视故障及其后果,以及 (3) 降低可能导致危险的故障几率并采取适当措施。您同意,在使用或分发包 含 TI 产品的任何 应用前, 您将彻底测试该等 应用 和该等应用所用 TI 产品的 功能。除特定 TI 资源的公开文档中明确列出的测试外,TI 未进 行任何其他测试。 您只有在为开发包含该等 TI 资源所列 TI 产品的 应用时, 才被授权使用、复制和修改任何相关单项 TI 资源。但并未依据禁止反言原则或其他 法理授予您任何TI知识产权的任何其他明示或默示的许可,也未授予您 TI 或第三方的任何技术或知识产权的许可,该等产权包括但不限于任 何专利权、版权、屏蔽作品权或与使用TI产品或服务的任何整合、机器制作、流程相关的其他知识产权。涉及或参考了第三方产品或服务的信 息不构成使用此类产品或服务的许可或与其相关的保证或认可。使用 TI 资源可能需要您向第三方获得对该等第三方专利或其他知识产权的许 可。 TI 资源系“按原样”提供。TI 兹免除对 TI 资源及其使用作出所有其他明确或默认的保证或陈述,包括但不限于对准确性或完整性、产权保证、 无屡发故障保证,以及适销性、适合特定用途和不侵犯任何第三方知识产权的任何默认保证。 TI 不负责任何申索,包括但不限于因组合产品所致或与之有关的申索,也不为您辩护或赔偿,即使该等产品组合已列于 TI 资源或其他地方。 对因 TI 资源或其使用引起或与之有关的任何实际的、直接的、特殊的、附带的、间接的、惩罚性的、偶发的、从属或惩戒性损害赔偿,不管 TI 是否获悉可能会产生上述损害赔偿,TI 概不负责。 您同意向 TI 及其代表全额赔偿因您不遵守本通知条款和条件而引起的任何损害、费用、损失和/或责任。 本通知适用于 TI 资源。另有其他条款适用于某些类型的材料、TI 产品和服务的使用和采购。这些条款包括但不限于适用于 TI 的半导体产品 (http://www.ti.com/sc/docs/stdterms.htm)、评估模块和样品 (http://www.ti.com/sc/docs/sampterms.htm) 的标准条款。 邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122 Copyright © 2017 德州仪器半导体技术(上海)有限公司