Download TPD2E1B06 - Texas Instruments

TPD2E1B06
www.ti.com.cn
ZHCSBF3A – AUGUST 2013
双通道高速静电放电 (ESD) 保护器件
查询样品: TPD2E1B06
特性
应用范围
1
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为低压输入输出 (IO) 接口提供系统级的静电放电
(ESD) 保护
IEC 61000-4-2 4 级接触 ESD 额定值
IO 电容值 1pF（
（典型值）
直流 (DC) 击穿电压 7V（
（最小值）
超低泄漏电流 10nA（
（最大值）
低 ESD 钳位电压
车用温度范围：–40°C 至 125°C
小型易于走线的 DRL 封装
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游戏机
电子书
便携式媒体播放器
数码摄像机
说明
TPD2E1B06 是一款双通道超低电容 ESD 保护器件。
它提供 ±10KV IEC 接触 ESD 保护。 其 1pF 线路电容
值使得这款器件适合于广泛应用。 典型应用接口为
USB 2.0，低压差分信令 (LVDS) 和 I2C。 有两个针对
TPD2E1B06 的常见布局布线方法并且都在应用信息部
分中突出显示。
IOA1
1
6
NC
IOB1
2
5
IOA2
NC
3
4
IOB2
DRL
1.6 mm x 1.2 mm x 0.55mm
(0.5-mm pitch)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
English Data Sheet: SLVSC77
TPD2E1B06
ZHCSBF3A – AUGUST 2013
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FUNCTIONAL BLOCK DIAGRAM
IOA1 IOB1
IOA2 IOB2
Figure 1. CIRCUIT SCHEMATIC DIAGRAM
TERMINAL FUNCTIONS
PIN
NAME
NO.
PIN TYPE DESCRIPTION
IOA1
1
I/O
IOA2
5
I/O
IOB1
2
I/O
IOB2
4
I/O
3, 6
NC
NC
USAGE
ESD protected channel
Please refer to the Application Information Section.
No connect
Can be left floating, grounded, or connected to VCC
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
Operating temperature range
–40 to 125
°C
Storage temperature
–65 to 155
°C
IEC 61000-4-2 contact ESD (1)
±10
kV
IPP
Peak pulse current (tp = 8/20μs) (1)
2.5
A
PPP
Peak pulse power (tp = 8/20μs) (1)
35
W
(1)
Using Routing Option 1 or 2 as shown in Figure 2 or Figure 3.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
TPD2E1B06
THERMAL METRIC (1)
DRL
UNIT
(6) PINS
θJA
Junction-to-ambient thermal resistance
349.7
θJCtop
Junction-to-case (top) thermal resistance
120.5
θJB
Junction-to-board thermal resistance
171.4
ψJT
Junction-to-top characterization parameter
10.8
ψJB
Junction-to-board characterization parameter
169.4
(1)
2
ºC/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013, Texas Instruments Incorporated
TPD2E1B06
www.ti.com.cn
ZHCSBF3A – AUGUST 2013
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range. (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VRWM
Reverse stand-off voltage
VCLAMP
Clamp voltage with ESD
strike
IPP = 1 A, TLP, I/O to GND (1) (2)
11
V
IPP = 5 A, TLP, I/O to GND (1) (2)
15
V
Clamp voltage with ESD
strike
(1) (2)
VCLAMP
IPP = 1 A, TLP, GND to I/O
11
V
IPP = 5 A, TLP, GND to I/O
(1) (2)
RDYN
Dynamic resistance
CL1
Pin 2 and 5 capacitance
Pin 1 and 4 = GND, f = 1MHz, VBIAS = +2.5V (2) (3)
CL2
Pin 1 and 4 capacitance
Pin 2 and 5 = GND, f = 1MHz, VBIAS = +2.5V
(2) (4)
VBR
Break-down voltage
IIO = 1 mA
ILEAK
Leakage current
VBIAS = +2.5 V
(1)
(2)
(3)
(4)
5.5
UNIT
V
15
V
0.9
Ω
0.85
pF
1.05
7
1
pF
9.5
V
10
nA
Transmission line pulse with rise time 10ns and pulse width 100ns.
TA = 25°C
Using Routing Option 1, Figure 2.
Using Routing Option 2, Figure 3.
Copyright © 2013, Texas Instruments Incorporated
3
TPD2E1B06
ZHCSBF3A – AUGUST 2013
www.ti.com.cn
APPLICATION INFORMATION
There are 2 channels of back-to-back diodes in TPD2E1B06DRL. The device should be routed in one of the two
ways shown below. Routing option 1 is recommended because TPD2E1B06 is designed to maximize signal
integrity in this configuration while still comply with IEC 61000-4-2 level 4 contact ESD rating.
GND
Line 1
1
6
2
5
3
4
Line 2
GND
Figure 2. Routing Option 1
Line 1
GND
1
6
2
5
3
4
GND
Line 2
Figure 3. Routing Option 2
4
Copyright © 2013, Texas Instruments Incorporated
TPD2E1B06
www.ti.com.cn
ZHCSBF3A – AUGUST 2013
REVISION HISTORY
Changes from Original (July 2013) to Revision A
•
Page
将文档从预览改为生产数据。 ............................................................................................................................................... 1
Copyright © 2013, Texas Instruments Incorporated
5
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
TPD2E1B06DRLR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
SOT-OTHER
DRL
6
4000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
(DUH ~ DUL)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Mar-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPD2E1B06DRLR
Package Package Pins
Type Drawing
SPQ
SOTOTHER
4000
DRL
6
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
9.5
Pack Materials-Page 1
1.78
B0
(mm)
K0
(mm)
P1
(mm)
1.78
0.69
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Mar-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD2E1B06DRLR
SOT-OTHER
DRL
6
4000
184.0
184.0
19.0
Pack Materials-Page 2
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