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100 Itanium® 10 Xeon® 1 180 130 90 65 Technology Node (nm) Effective SRAM Cell Size (µm2) On-Die L3 Cache Size (MB) Large-Scale SRAM Variability Characterization Chip in 45nm CMOS 10 ITRS Reported 1 0.1 300 30 Technology Node (nm) High end microprocessors continue to require larger on-die cache memory > 6σ of statistics needed to capture the variability of large cache memories Problem: Getting statistics across large designs is $$ and difficult Solution: Customized instrumentation on-chip Large-Scale SRAM Variability Characterization Chip in 45nm CMOS Conventional Metrics – RSNM, IW, etc. 2.2mm×2.2mm SRAM macros All-internal-node access 360 CUTs per chip Limited silicon data Cannot correlate to cell bit fails in functional SRAM Large-Scale SRAM Variability Characterization Chip in 45nm CMOS 4×64Kb SRAM Array Switch Ctrl 4-Terminal Switch Network 6-bit DAC SENSE FORCE Large-Scale SRAM Metrics – SRRV, WWTV, etc. 2.2mm×2.2mm Functional SRAM arrays Direct bit-line access 768Kb per chip Silicon data measured for each SRAM cell Characterized under natural operating environment Correlate to cell bit fails in functional SRAM Large-Scale SRAM Variability Characterization Chip in 45nm CMOS The large-scale read/write margin measurements showed excellent correlation, near failure, to SRAM DC RSNM and IW measurements µ/σ yield estimates has been shown to be highly dependent on the read stability or writeability metric used and is therefore unsuitable for estimating yield Large-scale characterization of SRAM read stability and writeability is critical for SRAM failure modeling and can be used to complement BIST and nano-probing Acknowledgement: NSF, C2S2, IBM Faculty Partnership Award, STMicroelectronics