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Future Component Characterization for EMI Analysis - INCASES Engineering GmbH O. Rethmeier Copyright INCASES Engineering GmbH W. Rissiek Motivation Modern designs use components that are characterized through increasing package density increasing package dimension increasing clock rates faster transition times high power consumption Increasing signal integrity problems High thermal radiation Strong electromagnetic fields in the neighborhood of the IC Package can be as effective as antennas Copyright INCASES Engineering GmbH Radiation Effects Differential Mode Current Loops (e.g. Signal Loops / Bypass Loops) EDM IDM A E A m2 DM Common Mode Differential mode - Common mode coupling (Potential the Supply ICM IDM Shift but in often ECM System) EDM Radiation through cables and packages Copyright INCASES Engineering GmbH Requirements EMI Analysis and SI Analysis requires a complete clear consistant provision of all data and parameters of the design (including component characterization). Copyright INCASES Engineering GmbH Component Characterization Mechanical characterization highly complex internal structure often no geometrical information available Electrical characterisation e.g. IBIS Thermal characterization Copyright INCASES Engineering GmbH Complexity of Design In general, a numerical EMI analysis of the complete design is not possible – memory – computation time Partitioning of the problem uses a prior knowledge of an expert approach (more ‘classification’ data) simplified assumptions (less detailed simulation models) Copyright INCASES Engineering GmbH Essential Component Characteristics for EMI-Analysis (I) Geometrical parameter Package type (e.g. QFP, BGA, PGA,...) Package dimensions (length, width, height,...) Pin pitch of the component Copyright INCASES Engineering GmbH Essential Component Characteristics for EMI-Analysis (II) Electrical Parameter Technology Supply-voltages Analog, mixed analog / digital Noise margin Input- / output behavior Band width of signal pins Max. / min. voltage res. currents Transfer time Frequency Copyright INCASES Engineering GmbH Details on Electrical Parameter Buffer Specific Quantities: Voltages and Currents Parameter Symbol Unit Buffer Voltage positive power supply Vcc V negative power supply Vss/GND V min. voltage low-level VOLmin V max. voltage low-level VLmax V min. voltage high-level VHmin V max. voltage high-level VOHmax V Threshold voltage VIt V Ref.-voltage low/high Def. td VmDR V Ref.-voltage high/low Def. td VmDF V max. current low-level max. current high-level Copyright INCASES Engineering GmbH IOLmax IOHmax I/O I/O O I/O I/O O I I/O I/O Currents A O A O Application Source Analysis/Evaluationdatasheet Analysis/Evaluationdatasheet Analysis datasheet Analysis/Evaluationdatasheet Analysis/Evaluationdatasheet Analysis datasheet Evaluation datasheet Evaluation datasheet Evaluation datasheet Analysis Analysis datasheet datasheet Details on Electrical Parameter Buffer Specific Quantities: Time and Clock Frequencies Parameter Symbol Unit Buffer max. Fall time low/high max. Fall time high/low typical Fall time low/high typical Fall time high/low special delay time low/high of an output load circuit special delay time high/low of an output load circuit t TIRmax tTIFmax tTOR tTOF Times s I s I s O s O Application Source Evaluation Evaluation Analysis Analysis datasheet datasheet model model tOmDR s O Evaluation model tOmDF s O Evaluation model Analysis Analysis Analysis datasheet datasheet Spec Clock Frequencies min. work frequency max. work frequency typical work frequency Copyright INCASES Engineering GmbH fWmin fWmax fWtyp Hz Hz Hz I/O I/O I/O Details on Electrical Parameter Buffer Specific Quantities: Voltages Copyright INCASES Engineering GmbH Details on Electrical Parameter Buffer Specific Quantities: Resistance, Capacitance Parameter Symbol Unit Buffer Application Source I O O Analysis Analysis Analysis model model model Capacitance F I F O Analysis Analysis model model Resistance Input resistance Output resistance low/high Output resistance high/low Input capacitance Output capacitance Copyright INCASES Engineering GmbH Ri ROLH ROHL CI CO W W W Details on Electrical Parameter Derived Quantities Derived Quantities Explanation Buffer specific Characteristics Band width fOB of a signal at output (fPmin/typ/max, tTOR/F) fIB of a buffer at input (tTIR/Fmax) (static) Noise margin high-level SH = VOHmin - VIH min low-level SL = VILmax - VOLmax VILmax, VIHtop - VHmin Classification of radiated / internal noise characteristics from driver parameter into low, medium, high Classification of sensitivity from the receiver parameter into low, medium, high Classification using all parameter into low, medium, high Noise potential Sensitivity Activity Copyright INCASES Engineering GmbH Details on Electrical Parameter Derived Quantities Derived Quantities Explanation Component specific Characteristics Noise potential parameter Sensitivity parameter Activity parameter Classification of the component using all into low, medium, high Classification of the component using all into low, medium, high Classification of the component using all into low, medium,high Copyright INCASES Engineering GmbH Details on Electrical Parameter Buffer Classification Signal Class Explanation BUS Bus-inputs and outputs; e.g.at bus driver, controller, etc. CLOCK All clock inputs and outputs; e.g. at flip-flop, counters, processor, etc. CTRL Control inputs like Reset, RAS, CAS, WE, OE, DIR, etc. DATA Data inputs and outputs like gates, memory components, etc. SUPPLY Supply pins of all components HYPOTHETIC Pins that cannot be assigned to other classes DEFAULT DEFAULT BUS,CLOCK,CTRL,DATA,SUPPLY, HYPOTHETIC Copyright INCASES Engineering GmbH Summary EMI - Analysis of PCB’s requires behavioral buffer models like IBIS additional ‘classification’ parameters for an expert approach specific geometrical package information Extension of current standardization required! Copyright INCASES Engineering GmbH