Download Single-sided Module Status

Hybrid and Module Status
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Hybrid Delivery
• First hybrids over-etched and shrunk due to changes in
design and mistakes in manufacturing
– Shrinkage for both circuits and alignment holes
• To use at all have to re-drill holes, hand solder all surface mounts, re-set all
wire bonds
– Build also not as expected
• 2 bond-ply between ground and shield layers, 9 mm instead of 5 mm copper
for two layer, 35 mm instead of 5 mm copper for shield
• Modifications to design to make manufacturing easier
submitted by Nov. 1st, production are supposed to have
started on the Nov. 9th
– Misunderstanding by vendor lead to devices manufacture to start
on Dec. 3
• But have improved communication path to track progress, confront
problems, etc. Build is back to original specifications. New understanding
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on the method to locate the tooling holes
Hybrid Delivery (cont)
• Thus, the delivery is now delayed relative to
AUW schedule
– Foresee delivery week before Christmas
• First pieces back from passive stuffing 2nd-3rd
week of January
– First working re-spun hybrid last January-early
February
• To keep closer to schedule and get experience,
we are populating 3 hybrids with over-etched,
shrunk circuit now to start program
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Module Fixturing Status
Concept
Drawing
Manufacture
Testing
Final
ETA
Chip Tray
Nov 
Vacuum Placement
Chuck
Nov 
Hybrid Bonding Jig
Done 
Module Assembly
Plate
Late Nov
(Dec) 
Module Frame
Late Nov
(Jan) 
Module Bonding
Plate
Late Nov
(Dec) 
Module Testing Box
Jan
Design/manufacture/testing processing well, in the order needed. Progress
since AUW in grey arrows. Slightly off schedule due to unanticipated testing of
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BCC and emergency work in shop for another project
Chip Tray
Asics ‘Set out’ jig
Material :- Acetal (Static
Dissipative)
Second version made. Chips and
pickup tool fit snugly. Vacuum
removed ASICs cleanly
Trialling multiple pickup trial to ensure
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ASICs aren’t damaged.
Vacuum Placement Chuck
Material:- top Aluminium
bottom Acetal
Location dowels
Face contacts ASICs
Second version finished. Fits all jigs and has
be levelled on legs. Checking placement
accuracy of ASICs after pickup trialling
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Hybrid Bonding Jig
• First version finished
– Used successfully to
bond first ASICs
• Will make second
version with separate
vacuum areas for
each hybrid
– Easier repair cycles
– Will only happen
after first few
modules finished
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Module Assembly Plate
Dowel holes for Placement
chuck (In shop)
Height setting pins (In shop)
Vacuum holes
Dowels stops for Silicon
Vacuum port
Dowels being finished this week. Next week, we will start
smart scope measurements of the placement accuracy
achievable for silicon relative to hybrid pins
Will need to grind height setting pins to set correct glue level.
Will attempt first super-mechanical in early January
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Module Frame
With now machine rebate for
module at Liverpool
Machined “mechanical”
blank to
continue
assembly testing
Used for:- Electrical testing
Assembly movement
Storage
Ready to submit today. Will
get just before Christmas
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Test Assembly
With mechanical
sensor, failed
electrical hybrids, and
mechanical frame, we
have shown that
everything “fits”
together
After gluing, we will be
able to give precisions
of the assembly
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Module Bonding Plate
Dowel locators
Vacuum
Dowels in shop. Fits on wirebonder. Will be ready in
time for first assembled module
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Short Term Plans
• Using over-etched electrical hybrids, we will dieattach, wire bond and test 3 hybrids with proper
jig set
– Hopefully the first before Christmas
• With 1 electrical and 1 mechanical, and “failed”
electrical sensor, we will assemble, bond, and
test 1 module in first 2 weeks of January
• Hope to use the other 2 hybrids with FZ2 sensor
to make first module for stavelet program
following this first piece
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Overall Time Schedule
• Finish all jigs needed to assemble and bond module- before
Christmas (with minor tweaks afterward)
• Super-mechanical modules- early January
• Bond/test “over-etched” electrical hybrids- December-early January
• Receive new electrical hybrids- before Christmas ??
• QA and passive attach-early Jan
• Assemble/bond/test first “over-etched” electrical module with best
method available- Mid-Jan
– This is the first test of single-sided module with correct grounding/HV
filter, still some concern about noise performance with two hybrids on
one sensor
• Assuming first assembly ok, will make next 4 modules in February
– Maybe we should have a working meeting at Liverpool of the future
module assembly sites at this point to discuss results
• Depending on results of first mechanical assemblies and electrical
tests, put out jigs sets to industry for other single-sided module build
sites in March/April
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