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R&D lines @ IFCA
Jornadas Futuros Aceleradores, Barcelona May8th ‘09
Iván Vila Álvarez
Instituto de Física de Cantabria
Main Actors, Roles & R&D communities
Physicists: Celso Martínez, Alberto Ruíz,
Marcos Fernández, Amparo L. Virto & Iván
Vila
 Students: Jordi Duarte + new student.
 Engineer: David Moya (mechanics),
Richard Jaramillo (electronics) and J.
Gonzalez (software).
 R&D playgrounds: EUDET, SiLC, CEC (CMS
upgrade), Spanish groups.

Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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Outline: R&D lines

R&D on sensors




R&D on mechanics




Integration of Fiber Optic Sensors on CF composites
Mechanical design and FEA simulation.
DAQ software


Improved IR-semitransparent sensors.
Thin micro-strips sensors.
Strixels sensors
DAQ integration with EUDET pixel telescope (EUDAQ)
Facilities
Outlook and next steps
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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RD on Sensors: IRuS for alignment

Statement of the issue:




Real time position monitoring of the tracker during
detector operation with a few microns accuracy.
Reference laser lines going through tracker’s sensors.
Name of the game, increase the IR transmittance of
the microstrip sensors introducing minimal
modifications to the sensor layout: same materials,
avoid fine tuning.
R&D targets:

ILD FTD, SiD tracker, CMS tracker upgrade.
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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RD on Sensors: IRuS for alignment (2)




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1st Validation of optical simulation software with
material samples. (done)
2nd Babysensor baseline design (p on n; AC coupling,
50 um pitch) minimal design modifications to boost
sensor IR transmittance. (done)
3th Production of IR mini-sensors. (on progress)
4th Bench and beam testing of sensors
5th Know-how transfer to main vendors.
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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Validation of the optical simulation (1)
• Simulation predicts calibrated thickness of 6 calibrated
bands of SiO2 [d=0-500] nm on a 1-sided polished Si wafer,
from Ocean Optics
• Si characterized from 1st band (not shown)
Difference
calibrated-fitted
thickness= 2 nm
Difference
calibrated-fitted
thickness= 1 nm !!
CEC Meeting,
09 -8thl
Marcos'09,
Fernandez
-IFCA
Jornadas Sobre Futuros Aceleradores
, Apr
May
I. Vila
97
Validation of Full Optical Simulation (diffraction pattern)
CNM wafer + diffraction Al pattern, using GICSERV07 access.
40 diffraction orders
45 nm Al roughness
CEC Meeting,
09 - 8thl
Marcos'09,
Fernandez
-IFCA
Jornadas Sobre Futuros Aceleradores
, Apr
May
I. Vila
128
IR transparent mini-sensors Final-Design

Currently being produced (GICSERV08)
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D on sensors: thin ustrips




GICSERV09 access on ustrip
thin sensors.
Direct wafer bonding and
deep anisotropic etching.
Aim: frame layout design,
FEA analysis, mechanical
characterization of dummies,
bonding tests, bench & test
beam testing.
R&D Targets: CMS upgrade
Figure 2: Thinning of double-sided processed
detectors. See text and ref. [6] for further
details.
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D on Sensors: CMS upgrade HPK Run
Aachen
DESY
Hamburg
Karlsruhe
Louvain
Santander
Vienna
Vilnius
Warsaw
Pixel cells
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D on sensors: HPK sensors
6
6 each
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R&D on mechanics (1)
System Design
Forward Tracker Disk @ ILD
Outer layers already on official ILD full
simulation geometry.
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D mechanics: Alignment Requirements

LICTOY tracking simulation software from HEPHY
SiD LoI geometry
Single muon events.
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R&D on mechanics: Alignment requirements
DPt/Pt vs. alignment errors 1um, 7um, 10um (5um nominal)
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D on mechanics(2): SMART structures




Well know monitoring technologies in
aeronautics and civil works based on optical fiber
sensors (OFS)
Distributed strain & temperature sensors are
conventionally used for structure health
monitoring : SMART structures
Other OFS for acceleration & radiation dose and
rate.
In aeronautics (embedded or bonded) on the of
the CFRP composite ( for instance, plane radar
redome)
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D on mechanics: Bragg grating

Fiber Bragg Grating optical transducer very
common to measure strain and temperature
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D on mechanics: Bragg grating
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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OFS & FBG advantages
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Integrating OFS & carbon fiber composites

For the Track structure would be
interesting to use a embedded
fiber optic sensor.


more precise and reliable data
It could be use 2 side solution


Better understanding of the
results
Useful to quantify the thermal
strain
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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Plans


R&D Targets: ILD, SiD, SCMS, SBelle
Current activities:



Market survey and contact with OFS vendors
Contacting CF producers (Inta, Fermilab,…)
Next activities:




Testing of standalone OFS.
Prepare CFRP test samples with embedded OPS
Preparing some CF test structures with bonded or
embedded fibers.
Mechanical and thermal characterization of the test
structures.
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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DAQ software : EUDAQ Framework
Integration of SiLC and CMS APV25 r/o
software with EUDET telescope f/w.
 As members of the EUDET project we
have been active users of the “EUDET
pixel telescope” .
 We have carry-out the its integration
with other daq and trigger DUT (thanks
to EUDAQ software from the University
of Geneva)

Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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EUDAQ FRAMEWORK
Hierarchy, distribution and communication between applications:
1
Key:
Data Collector
Application
Thread
Buffer
Signal
/data
N
Listening
Socket
Command
Cmd
Receiver
Storage
M
Monitor
Data
Merge
Data
Sender
Cmd
Receiver
Data
Server
N
Data
Receiver
GUI
M
Producer
Data
Sender
Data
Logging
Hardware
Polling
Cmd
Receiver
Log
Server
Hardware
Logger
Cmd
Server
1
Run Control
Cmd
Receiver
• DAQ software: C++
• Communication: POSIX
• GUIs: Qt
• Online Monitor: ROOT
• Runs on Mac OS X, Linux, and Windows (using cygwin).
• Highly modular. Easy integration of devices into the DAQ.
GUI
1
Log
Receiver
GUI
Cmd
Sender
Storage
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Short-term Outlook

In 2009:







Increase our participation on SiD and ILD tracking
groups.
The IR alignment sensor fully tested with laser and
source test bench using ALIVABA electronics. Maybe
test beam.
Thin sensors produced, mechanical dummies tested.
Improved mechanical design.
OFS proof of principle for tracking deformation
monitoring.
HPK order in production.
SCMS and SiLC test beams.
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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THANK YOU
Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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BACKUP
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Naïve FEA model
Simple Geometry with frame + thinned area.
Support: Four corners fixed.
All Silicon structure
Measured dummy structure shows 20 um bow
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Naïve FEA: gravitational bend
Gravity parallel to Z axis
Deformation in Z direction
Max deformation 12 um
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Naïve FEA: Longitudinal (X) strain
Top surface
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Naïve FEA: Transversal (Y) strain
Top surface
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Naïve FEA: Strain vs. Deformation
Z DOF / X STRAIN DIFERENT g´s
1.40E-04
1.20E-04
8.00E-05
6.00E-05
4.00E-05
2.00E-05
0.00E+00
0.00E+00
Y STRAIN / X STRAIN DIFERENT g`s
5.00E-06
1.00E-05
1.50E-05
2.00E-05
2.50E-05
3.00E-05
1.20E-05
X STRAIN
1.00E-05
8.00E-06
Y STRAIN
Z DOF
1.00E-04
6.00E-06
4.00E-06
2.00E-06
0.00E+00
0.00E+00
5.00E-06
1.00E-05
1.50E-05
2.00E-05
2.50E-05
X STRAIN
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Naïve FEA: Conclusions


Gravitation bend depends linearly with top
surface strain
Output values for nominal conditions:



Maximum deformation of 12 um
Maximum longitudinal strain about 2.5 me at the
middle of the DEPFET “frame”.
Maximum transversal strain about 1 me at the middle
of the DEPFET “frame”.
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A possible commercial solution
Deformation monitoring with 750nm resolution
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An event cleaner/lighter solution ?

Several options:

Embdeding of fiber sensors on suporting structures
(BTeV)
Or event much better, embedding the sensing element on the depfet frame,
Integrating a Bragg grating on it, still studying its feasibility.
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Summary and next steps



FBG commercial sensor will provide 750nm
monitoring resolution with small amount of extra
material.
More realistic FEA simulations are still needed:
thermal loads, better mechanical supports,…
Eventually, a realistic test with a mock-up will be
needed.
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