Download P35-4215-0 GaAs MMIC SPDT REFLECTIVE/NON

P35-4215-0
GaAs MMIC SPDT
REFLECTIVE/NON-REFLECTIVE
SWITCH, DC - 4GHz
Features
•
•
Broadband performance
Low insertion loss; 0.5dB typ at 2GHz
•
Ultra low DC power consumption
•
Fast switching speed; 3ns typical
•
Chip form
Description
The P35-4215-0 is a high performance Gallium Arsenide single pole double throw broadband RF switch
MMIC. It is suitable for use in broadband communications and instrumentation applications. The
isolated port of the switch can be terminated with either an on-chip 50Ω load or a short-circuit. Control
is effected by the application of complimentary 0V and -5V levels to the control lines in accordance with
the truth table below.
This die is fabricated using MCL's 0.5µm gate length MESFET process (S20) and is fully protected using
Silicon Nitride passivation for excellent performance and reliability. This device is also available
packaged in a hermetic 8-lead gullwing flatpack (see P35-4215-1R & P35-4215-1T).
Electrical Performance
Ambient temperature = 22±3 °C , ZO = 50 ohms, Control voltages = 0V/-5V unless otherwise stated
Parameter
Conditions
Insertion Loss
Isolation
Input Return Loss1
Output Return Loss1
1dB power
compression point2
Switching Speed
Third Order Intercept3
DC - 2GHz
2 - 4GHz
DC - 2GHz
2 - 4GHz
DC - 2GHz
2 - 4GHz
DC - 2GHz
2 - 4GHz
0/-5V Control; 50MHz
0/-5V Control; 0.25 - 4GHz
0/-8V Control; 50MHz
0/-8V Control; 0.25 - 4GHz
50% Control to 10%90%RF
500MHz
Reflective
Terminated
Min
Typ
Max
Min
Typ
Max
32
26
15
10
15
10
-
0.5
0.9
34
28
25
20
25
20
21
23
25
31
3
46
0.6
1.0
-
21
16
15
10
15
10
-
0.6
1.4
23
17
25
20
25
20
20
24
25
32
3
46
0.7
1.5
-
Units
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dBm
ns
dBm
Notes
1. Return Loss measured in low loss switch state
2. Input power at which insertion loss compresses by 1dB
3. Input power 10dBm/tone
Marconi Caswell Limited, Caswell, Towcester, Northamptonshire, NN12 8EQ
Telephone: + 44 (0) 1327 350581 Fax: + 44 (0) 1327 356775 Website: www.caswelltechnology.com
Caswell Technology is the trading name of Marconi Caswell Limited which is a wholly owned subsidiary of Marconi plc
The data and product specifications are subject to change without notice. These devices should not be used for device qualification and production without prior notice to MCL.
462/SM/00025/200 Iss 1/2
A Marconi company
P35-4215-0
Typical Performance at 22° C
Isolation
Insertion Loss
0
10
Reflective
0.5
1.0
Isolation (dB)
Insertion Loss (dB)
0.0
Terminated
Terminated
20
30
40
Reflective
1.5
50
2.0
60
0
1
2
3
4
0
Frequency (GHz)
1
2
3
4
Frequency (GHz)
Input Return Loss
Output Return Loss
0
10
Re
tur
20
n
Lo
ss 30
(d
B) 40
10
Return Loss (dB)
0
50
20
30
40
50
60
0
1
2
3
4
Frequency (GHz)
60
0
1
2
3
4
Frequency (GHz)
Absolute Maximum Ratings
Max control voltage
Max I/P power
-8V
+33 dBm
Operating temperature
-60°C to +125°C
Storage temperature
-65°C to +150°C
Marconi Caswell Limited, Caswell, Towcester, Northamptonshire, NN12 8EQ
Telephone: + 44 (0) 1327 350581 Fax: + 44 (0) 1327 356775 Website: www.caswelltechnology.com
Caswell Technology is the trading name of Marconi Caswell Limited which is a wholly owned subsidiary of Marconi plc
The data and product specifications are subject to change without notice. These devices should not be used for device qualification and production without prior notice to MCL.
462/SM/00025/200 Iss 1/2
A Marconi company
P35-4215-0
Chip Outline
Electrical Schematic
Chip size:
0.71 x 0.91mm
Bond pad size:
90µm x 90µm minimum
Chip thickness:
210µm
Switching Truth Table
A
B
RF IN-RF1
RF IN-RF 2
0V
-5V
Low Loss
Isolated
-5V
0V
Isolated
Low Loss
Switching Truth Table
The P35-4215-0 can be connected such that the isolated switch output is either terminated in 50Ω or in a
reflective short circuit. A reflective configuration is obtained by bonding GND-R1 and GND-R2 to
ground. A terminated configuration is obtained by bonding GND-T1 and GND-T2 to ground. In both
cases at least two low inductance bondwires should be attached to each pad.
Chip Handling, Mounting and Bonding
The back of the chip is gold metallized and can be die-attached manually onto gold, eutectically with
Au-Sn (80:20) or with low temperature conductive epoxy. The maximum allowable chip temperature
is 310°C for 2 minutes. Bonds should be made onto the exposed gold pads with 17 or 25 microns pure
gold, half-hard gold wire. Bonding should be achieved with the chip face at 225°C to 275°C with a
heated thermosonic wedge (approx. 125°C) and a maximum force of 60 grams. Ball bonds may be used
but care must be taken to ensure the ball size is compatible with the bonding pads shown. The length
of the bond wires should be minimised to reduce parasitic inductance, particularly those to the RF and
ground pads.
Ordering Information
P35-4215-0
Marconi Caswell Limited, Caswell, Towcester, Northamptonshire, NN12 8EQ
Telephone: + 44 (0) 1327 350581 Fax: + 44 (0) 1327 356775 Website: www.caswelltechnology.com
Caswell Technology is the trading name of Marconi Caswell Limited which is a wholly owned subsidiary of Marconi plc
The data and product specifications are subject to change without notice. These devices should not be used for device qualification and production without prior notice to MCL.
462/SM/00025/200 Iss 1/2
A Marconi company