Download This document creates a standard fluidic interfacing system to

Background Statement for SEMI Draft Document 4214A
NEW STANDARD: SPECIFICATION FOR MICROFLUIDIC INTERFACES
TO ELECTRONIC DEVICE PACKAGES
Note: This background statement is not part of the balloted item. It is provided solely to assist the
recipient in reaching an informed decision based on the rationale of the activity that preceded the creation
of this document.
Note: Recipients of this document are invited to submit, with their comments, notification of any relevant
patented technology or copyrighted items of which they are aware and to provide supporting
documentation. In this context, “patented technology” is defined as technology for which a patent has
issued or has been applied for. In the latter case, only publicly available information on the contents of the
patent application is to be provided.
This is a re-ballot of 4214 where references to wire bonding have been removed to avoid any concerns
with existing intellectual property. A new figure 5 was added to include spacers and general editing has
been performed.
This document creates a standard fluidic interfacing system to integrated circuits that incorporate fluidics.
Manufacturers of microfluidics have customized components and interfaces. Customized interfaces lead
to increased cost, incompatible architectures, and long development times. Standard fluidic interfaces can
reduce redundant engineering and re-engineering.
This document defines an open industry-standard for fluidic interfaces with electronic devices. The
specification describes the connection attributes and specifies the interface dimensions required to design
and build devices and systems that are compliant with this standard. The goal is to enable devices from
different vendors to interconnect via an open architecture. The specification is intended as an enhanced
capability to state-of-the-art electronic device technologies incorporating a combination of electronics and
fluidics. It is intended to provide device users adequate room for product versatility and market
differentiation without the burden of carrying obsolete interfaces, losing compatibility, and choice.
The standard is primarily targeted toward die manufacturers, design engineers, packaging engineers,
chemical engineers, packaging equipment suppliers, peripheral developers and system OEMs. This
specification can be used for developing new products and associated hardware
If you need technical assistance, or have questions, please contact Mark Crockett at 408-563-1256 or
email at [email protected]. For procedural issues, please contact Susan Turner at 408-943-7019
or e-mail at [email protected]
Semiconductor Equipment and Materials International
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DRAFT
SEMI Draft Document 4214A
NEW STANDARD: SPECIFICATION FOR MICROFLUIDIC INTERFACES
TO ELECTRONIC DEVICE PACKAGES
1 Purpose
1.1 This document defines an industry-standard for fluidic interfaces with electronic devices. The specification
describes the connection attributes and specifies the interface dimensions required to design and build devices and
systems that are compliant with this standard. The goal is to enable devices from different vendors to interconnect
via an open architecture. The specification is intended as an enhanced capability to state-of-the-art electronic device
technologies incorporating a combination of electronics and fluidics. It is intended to provide device users adequate
room for product versatility and market differentiation without the burden of carrying obsolete interfaces, losing
compatibility, and choice.
2 Scope
2.1 The specification is primarily targeted toward die manufacturers, design engineers, packaging engineers,
chemical engineers, packaging equipment suppliers, peripheral developers and system OEMs. This specification
can be used for developing new products and associated hardware.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 This specification does not address material-to-fluid compatibility, material-mechanical limitations, nor
electromagnetic / fluid interactions.
4 Referenced Standards and Documents
4.1 SEMI Standards
SEMI PR9-0705— Guide for Design and Materials for Interfacing Microfluidic Systems
4.2 JEDEC Standards
JEDEC MO-187 — Solid State Product Outline; Plastic, Low/Thin/Very Thin Shrink Small Outline Package 0.65
and 0.50 Pitch, Issue E, Dec 2004
4.3 ANSI / SBS Standards
ANSI/SBS 4-2004 — ANSI / Society for Biomolecular Screening; Well Positions for Microplates
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
5 Terminology
5.1 Abbreviations and Acronyms
5.1.1 IC — Integrated Circuit
5.1.2 EFIC — Electrofluidic Integrated Circuit
5.2 Definitions
5.2.1 Electrofluidic Integrated Circuit (EFIC) — the integration of semiconductor electronics and microfluidics on
a common substrate.
5.2.2 Fluidic Routing Card- a fluidic manifold used to interconnect the fluid flow between any multiple of EFIC’s.
6 Architecture/System Considerations for A MEMS Fluidics System
NOTE 1: The purpose of this document was initiated as a general reminder for MEMS Fluidic Interface designers that MEMS
fluidics devices by themselves mostly provide certain localized functions. In order to fully explore the potential of MEMS
fluidics devices some added functions and user-friendly interfaces to the outside world are required. These external functional
providers could be well designed connected to or incorporated into the MEMS Fluidics interfaces. However in order not to
provide these external functions as after thoughts, it is important to design them as an integrated parts of the whole MEMS
Fluidics system at the beginning of the design, be at the system or subsystem architecture level. For convenience we will use the
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
reproduction and/or distribution without the prior written consent of SEMI is prohibited.
Page 1
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Document Number: 4214A
Date: 4/29/2017
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DRAFT
terminology of MEMS Fluidics System to include MEMS Fluidics sub-systems. In order not to restrict creativity, it is not
necessary to fix the actual architecture but to establish a set of guidelines that most of the practitioners in this field would agree.
The following is set of such proposals:
6.1 Definition: a MEMS fluidics system consists of an integration of one or more MEMS fluidics components and
related components to provide a new or replace an existing function with performance, cost, intelligence and
footprints advantages.
6.2 A MEMS fluidics system should be easily adoptable to and interface to its environment with minimum
requirements for existing environment modification.
6.3 A MEMS fluidics system is preferred to be “intelligent” such that its output requires minimum data or
information processing to be real time and cost effective. Software for data and information processing necessary to
provided meaningful real time output to save time and effort could be either loaded into the system IC chip or
imbedded in the device as firmware. Only system with useful intelligence is worthy of replacement and/or adoptive
consideration.
6.4 A MEMS fluidics system may consists the following components
6.4.1 A MEMS fluidics component which could be just a chamber or a more complex MEMS Fluidics device
6.4.2 Fluidics interface to Micro and/or Macro interfaces preferably a smooth transition to present standard fluidics
connectors/tubing
6.4.3 Mechanical interface for positioning and equipment integration
6.4.4 Electrical interface for power supply (if required) and signal input and out put
6.4.5 Optical interface for optoelectric and /or opto-bio interaction or measurements. This may require minimum
one side of the fluidics chamber to be optically transparent.
6.4.6 Software for data and information processing necessary to provide meaningful real time output to save time
and effort could be either loaded into the system IC chip or imbedded in the device as firmware. Only system with
useful intelligence is worthy of replacement and/or adoptive consideration.
6.5 A representative integrated MEMS fluidics system architecture is shown in Figures 1-3 below, where the
fluidics I/O interfaces are on both top ends, electrical/electronic interface at the bottom, and the middle portion space
could be a convenient optical interface. The integration of all the components requires engineering design of
material compatibility, reliable connections, and compactness of spacing. Of course the fluidics dynamics in various
physical regions should be considered/simulated to provide necessary functions in the first place.
6.6 If the system is a throw away type bio-medical devices, the disposal of the system and its environment impact
should be considered during the design stage
6.7 From the cost point of view the final test and the testing procedures of the system should be designed at the
beginning of the design cycle to assure high yield, i.e., low cost and easy to obtain reliability assurance data of the
MEMS fluidics system.
7 Requirements
NOTE 2: Refer to layout for typical package shown below.
The package outline is taken from JEDEC MO-187 (a variation of an SOP surface mount 8-pin electronic device) typical package.
An open cavity has been added with an array of 8 x 8 fluidic ports. Compliance to the EFIC, micro to micro adapter, fluidic
routing card, and macro adapter, design constraint requirements provides compatibility with this standard for parts A, B, C, and D.
All dimensions are mean values where tolerances are dependent upon material selection and application requirements.
7.1 Part A - EFIC fluidic I/O Design constraints:
7.1.1 Fluidic interconnects shall not to be closer than 0.075 mm to electrical bond pads.
7.1.2 Port diameters shall be uniform and consisting of either 25, 50, 100, 200, or 400 microns with a pitch to port
size ratio of 2.
7.1.3 Rectangular array sizes shall consist of 2x ports.
7.1.4 Segregation of electronics and fluidics (not in mutual contact except where fluid sensing or flow control is
required).
7.1.4.1 Fluidic distribution shall be at the top and flush with top of device package.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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LETTER (YELLOW) BALLOT
Document Number: 4214A
Date: 4/29/2017
Semiconductor Equipment and Materials International
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Phone:408.943.6900 Fax: 408.943.7943
DRAFT
Figure 1
An example of an open cavity JEDEC MO-187 package containing an EFIC. Port
dimensions are 0.100 mm diameter, a pitch of 0.200 mm, and a 2 6 = 8 x 8 array.
7.2 Part B - In-package (micro-to-micro) fluidic adapter design constraints:
7.2.1 In-package (micro-to-micro) fluidic adapters shall be used to interface a fluidic die to the same height as the
package top surface.
7.2.2 The in-package fluidic adapter shall be the same port size and pitch as the EFIC.
7.2.3 The in-package fluidic adapter shall contain the same number of ports and pitch on both its top and bottom
surfaces.
7.3 Part C - Fluidic routing card constraints:
7.3.1 A fluidic interface (or fluidic routing card) adapter shall be used to connect fluid I/O to the EFIC.
7.3.2 EFIC interface port diameters on the fluidic routing card shall be uniform and consisting of either 25, 50, 100,
200, or 400 microns with a pitch to port size ratio of 2.
7.3.3 On the fluidic routing card, rectangular array sizes shall consist of 2x ports.
7.3.4 On the fluidic routing card, the fluidic routing card shall terminate to a mini-fluidic adapter.
7.3.5 On the fluidic routing card, the mini-fluidic adapter port diameters shall be uniform and consisting of 1 mm
diameter ports.
7.3.6 On the fluidic routing card, the mini-fluidic adapter port pitch shall be 2.25 mm x 2.25 mm.
7.3.7 On the fluidic routing card, there shall be an equal number of EFIC ports and mini-fluidic adapter ports.
7.3.8 One side of the fluidic routing card shall be 25 mm in length where the other shall be any multiple of 25 mm.
7.4 Part D - Mini-fluidic adapter constraints :
7.4.1 The mini–fluidic adapter port diameters shall be uniform and consisting of 1 mm diameter ports.
7.4.2 The mini-fluidic adapter port pitch shall be 2.25 mm x 2.25 mm.
7.4.3 One side of the mini-fluidic adapter shall be 25 mm in length.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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Document Number: 4214A
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LETTER (YELLOW) BALLOT
Document Number: 4214A
Date: 4/29/2017
Figure 2
Top: In-package (micro to micro) fluidic adapter and EFIC package.
Figure 3
In-package fluidic adapter shown in normal place to create ports that are flush with top
surface of the EFIC package.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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Figure 4
An example of multiple electrofluidic integrated circuit (EFIC) devices attached between an
electrical printed circuit board and a fluidic andapter (fluidic routing card) above the
devices.
Figure 5
The same EFIC device as shown in Figure 2 in an assembly layout with mini to mini-fluidic
adapters at top. The bottom layer (layer 1) is a printed circuit board with 2 EFIC’s. Layers
2-10 are the fluidic routing card, and the two blocks at the top are mini fluidic adapters.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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Document Number: 4214A
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DRAFT
Figure 6
The in-package micro-micro adapters are shown with seals. Spacers, also shown, may be used to control the
amount of loading imparted to the seals.
7.5 Fluidic Routing Card Dimensions
7.5.1 The following figures contain the dimensions for a standard fluidic interface for connecting electrofluidic
integrated circuits to larger fluidic devices.
Layer 1
7x 0.200
25.00
0.250
7x 0.200
64x
0.100
A
25.00
DETAIL
SCALE 20/1
A
11.80
8.80
Figure 7
Layer 1 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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Document Number: 4214A
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DRAFT
Layer 2
16x
R 0.050
48x
0.100
8x 0.100
4x 5.53
4x 4.87
25.00
7x 0.200
4x 6.15
16x
7x 0.200
DETAIL
A
R 0.50
25.00
A
SCALE 20/1
4x 6.6
11.80
7x 2.25
4.62
2x 1.00
0.25
8.80
Figure 8
Layer 2 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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Document Number: 4214A
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DRAFT
Layer 3
7x 0.200
48x
0.100
DETAIL
7x 0.200
25.00
0.25
A
SCALE 20/1
A
11.80
4.62
2x 1.00
9.00
Figure 9
Layer 3 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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DRAFT
Layer 4
5x 0.200
16x R 0.050
0.200
7x
32x
0.100
4x 6.83
14x
16x
4x 5.61
0.100
16x
1.00
R 0.50
4x 8.36
4x 0.200
4x 0.400
0.800
4x
DETAIL
A
10.21
A
SCALE 20/1
25.00
7x 2.25
4.62
2x 1.00
2x 3.25
9.00
25.00
0.25
Figure 10
Layer 4 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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DRAFT
Layer 5
7x 0.200
3x 0.200
32x
32x
1.00
0.100
25.00
DETAIL
A
A
SCALE 20/1
25.00
7x 2.25
4.62
2x 1.00
2.25
2x
0.25
9.20
Figure 11
Layer 5 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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Document Number: 4214A
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DRAFT
Layer 6
16x
0.100
R 0.050
16x
0.200
2x
0.100
14x
25.00
1.00
2x 7.00
8x R 0.50
16x
2x 0.800
0.200
3x
0.200
0.400
11.45
2x
0.800
DETAIL
A
SCALE 20/1
A
25.00
16.83
2x
7x 2.25
4.62
1.00
2.25
2.25
2x 8.32
9.200
0.25
Figure 12
Layer 6 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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Document Number: 4214A
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Phone:408.943.6900 Fax: 408.943.7943
DRAFT
Layer 7
16x
0.200
0.100
25.00
24x
1.00
0.200
7x
DETAIL
A
SCALE 20/1
A
25.00
7x 2.25
4.62
1.00
0.250
2.25
2.25
9.40
Figure 13
Layer 7 for fluidic routing Card
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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Document Number: 4214A
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DRAFT
Layer 8
25.00
R 0.050
18.56
2x
20.1
2x
0.100
0.825
A
DETAIL
A
SCALE 20/1
25.00
0.200
0.400
0.800
B
2.25
2.875
39.50
2x
4.62
1.00
2.25
4.925
19.36
2x
0.25
2.25
2.25
DETAIL
SCALE 10/1
B
9.40
Figure 14
Layer 8 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
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DRAFT
Layer 9
25.00
32x
1.00
0.25
25.00
7x 2.25
4.62
1.00
3x 2.25
Figure 15
Layer 9 for fluidic routing card.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
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Leadframe
Leadframe
Die attach pad
Die attach pad
Fluidic Routing Card
Mold compound
n Sequence A
ncludes integrated
nnel + sacrificial
ated dice get mounted to
pad
cal interconnection
encapsulation
cial Material removal
Mold compound
Mold compound
Fabrication Sequence A
Fabrication Sequence A
1) Wafer includes integrated
1) Wafer includes integrated
fluidic channel + sacrificial
fluidic channel + sacrificial
Micro – Fluidic
material
material
Connectors2) Singulated dice get mounted to
2) Singulated dice get mounted to
die attach pad
die attach pad
3) Electrical interconnection
3) Electrical interconnection
4) Plastic encapsulation
4) Plastic encapsulation
5) Sacrificial Material removal
5) Sacrificial Material removal
Micro – Fluidic
Connectors
Die attach pad Mold compound
Entire
Entire
Stack
Stack
Fabrication Sequence A
1) Wafer includes integrated
fluidic channel + sacrificial
material
2) Singulated dice get mounted to
die attach pad
3) Electrical interconnection
Entire
Die
Entire
Integrated
4) Plastic encapsulation
Stack
Stack
fluidic
5) Sacrificial Material removal
channel
Die
Die
Fabrication Sequence B
Fabrication Sequence C
Fabrication
Sequence
B
Fabrication
Sequence
1) Wafer includes
integrated
1) Wafer includes
only C
bare
1)
Wafer
includes
integrated
1)
Wafer
includes only
bare
fluidic
channel
+ Vertical
Microsensor
+
sacrificial
material
fluidic
channel
+
Vertical
Microsensor
+
sacrificial
material
micro fluidic adapter
2) Singulated dice get mou
micro
fluidic adapter
2)
2) Singulated
dice get mounted to
dieSingulated
attach pad dice get mou
2)
Singulated
dice
get
mounted
to
die
attach padinterconnectio
die attach pad
3) Electrical
die
attach padinterconnection
3)
Electrical
interconnectio
3) Electrical
4)
Plastic
Die
Integrated
3)
interconnection
Vertical4) Plastic encapsulation
Vertical
encapsulation
4) Electrical
Plastic encapsulation
5) Sacrificial material remo
fluidic
micro- 5) Sacrificial material remo
micro-4) Plastic encapsulation
channel
micro
micro
fluidic
fluidic
Fabrication
D
Fabrication
Sequence
C Sequence
adapter
adapter
Fabrication
Sequence
D
1) Wafer
includes only bare
1) Wafer includes
only bare
1)
Wafer
includes only bare
sensor
sensor + sacrificial
material
sensor
2) Singulated
dicetoget mounted to
2) Singulated dice
get mounted
2) Singulated
attach pad dice get mounted to
die attach pad die
die
attach padmaterial added
3) Sacrificial
3) Electrical interconnection
3)
Sacrificial
material added
4)
Electrical
interconnection
4) Plastic encapsulation
4)
Electrical
interconnection
5) Plastic
encapsulation
5) Sacrificial material
removal
5)
encapsulation
6) Plastic
Sacrificial
material removal
6) Sacrificial material removal
n Sequence B
ncludes integrated
nnel + Vertical Microic adapter
ted dice get mounted to
pad
al interconnection
encapsulation
Fabrication
FabricationSequence
SequenceBC
1)1)Wafer
Waferincludes
includesintegrated
only bare
fluidic
channel
+ Vertical
Microsensor
+ sacrificial
material
micro
fluidic adapter
2) Singulated
dice get mounted to
2)dieSingulated
attach paddice get mounted to
die
padinterconnection
3) attach
Electrical
3)4) Electrical
interconnection
Plastic encapsulation
4)5) Plastic
encapsulation
Sacrificial
material removal
n Sequence D
ncludes only bare
Fabrication Sequence D
1) Wafer includes only bare
Figure 16
sensor
An
example
for a manufacturing
process sequence for an EFIC.
2) Singulated
dice
get mounted
to
die attach pad
3) Sacrificial material added
4) Electrical interconnection
5) Plastic encapsulation
6) Sacrificial material removal
ated dice get mounted to
pad
cial material added
cal interconnection
encapsulation
cial material removal
Micro – Fluidic
Micro – Fluidic
Connectors
Connectors
Fluidic Routing Card
Leadframe
LETTER (YELLOW) BALLOT
8 Assembly of the Fluidic Device
Fluidic
Routing
Card
8.1 The assembly of the EFIC device may take the form of any of the 4 sequences below. This
diagram
is an
Fluidic
Routing
Card
example of an EFIC sequence. Applications will vary from this example. This particular implementation has 4
fluidic micro ports.
me
pad
DRAFT
Document Number: 4214A
Date: 4/29/2017
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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DRAFT
8.2 A functional description of the parts.
Figure 17
Functional description of assembled parts.
9 Test Methods
9.1 Test per relevant SEMI standards or as required by the manufacturer.
10 Certification
10.1 This standard may be referenced when either paragraphs 7.1, 7.2, 7.3, or 7.4 are in full compliance and stating
the relevant section(s) that apply. Partial compliance to an individual line item in one of these sections does not
meet compliance to this standard.
11 Product Labeling
11.1 Label per manufacturer’s requirements.
12 Packing and Package Labeling
12.1 Package per relevant standards.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
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respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to
reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other
reproduction and/or distribution without the prior written consent of SEMI is prohibited.
Page 16
Doc. 4214A  SEMI
LETTER (YELLOW) BALLOT
Document Number: 4214A
Date: 4/29/2017