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Enhancement of the second harmonic signal from Hg1xCdxTe (MCT) in the presence of an anodic oxide film. A.W. Wark, K. McErlean, F.R. Cruickshank and L.E.A. Berlouis WestCHEM, Department of Pure and Applied Chemistry, University of Strathclyde, Glasgow G1 1XL, UK. P.F. Brevet Laboratoire de Spectrometrie Ionique et Moleculaire, UMR CNRS 5579, Université Claude Bernard Lyon 1, 43 Boulevard du 11 Novembre 1918, 69622 Villeurbanne cedex, FRANCE. Abstract Second harmonic generation (SHG) is now widely regarded as a valuable tool for investigating electrode surfaces. Typically, most studies have been limited to substrates which lack bulk symmetry and monitoring events such as sub-monolayer formation and surface reconstruction. Here, the development of a model that can be used to quantitatively describe the enhanced SH signal observed in the presence of an anodic oxide film on a non-centrosymmetric substrate, Hg1xCdxTe (MCT), is described. The aim is to further expand the utility of SHG for probing different electrode systems. The growth of the high quality oxide films was first followed by in-situ ellipsometry. For thin films (<100 nm) grown at a constant current density of 150 A cm2, an effectively uniform oxide layer is found with a refractive index n of ~2.15 0.05 and exhibiting no absorption of the incident radiation at 632.8 nm (1.96 eV). In the presence of such an oxide film of 58 nm thickness, the second harmonic (SH) signal intensity measured in reflection is found to be significantly enhanced in both the PIN-POUT and PIN-SOUT polarization configurations. To quantify the changes observed, each layer in the model is assigned its own symmetry and optical constants (at the fundamental, and harmonic (= 2) frequencies and a defined thickness. Modeling of the SH rotational anisotropy experiments carried out at different angles of incidence indicated that most of this increase could be accounted for by multiple reflections of the fundamental wave = 1064 nm (1.17 eV) in the composite ambient/oxide/MCT layer, with little contribution from charge accumulation at the buried MCT/oxide interface for this oxide thickness. Keywords: HgCdTe, anodic oxide, ellipsometry, SHG, modeling. 1 Introduction The alloy semiconductor Hg1-xCdxTe (MCT) is one of the most important materials used in the fabrication of infra-red devices1. By varying the composition x of this ternary compound semiconductor, the band-gap can be altered and thus allow the device to access different wavelengths in the infra-red region. One particular region of interest is the atmospheric transmission window between 8 - 12 m wavelength and to access this, an alloy composition of x = 0.22 is employed. As with all devices based on the separation and flow of charge due to photon absorption, the electrical properties and efficiency of such devices have to be well characterised and controlled. However, the surface states present in such narrow gap semiconductors (for x ~ 0.2, Eg = 0.1 eV at 77 K) can dominate the desired properties of the material. Passivation layers2 are employed to not only confer the correct degree of accumulation or flat band conditions to the MCT/passivant interface but also to provide chemical and physical protection during further processing and incorporation into the device. Typical surface passivation methodologies employed include the use of SiO2 by photo-chemical vapour deposition3, ZnS4 as well as the native anodic oxides5 and sulphides6,7,8. Anodic oxide layers are used in the passivation of photoconductors, leading to accumulation of the majority carrier at the surfaces of the n-type material. During the electrochemical formation of the anodic oxide layer, the MCT substrate material is consumed and sharp interfaces have thus been reported to form2. Oxide growth is usually carried out using the well established constant current anodisation method5,9,10 in 0.1 M KOH in 90% ethylene glycol /10% H2O. Optical second harmonic generation (SHG) is a nonlinear process by which two photons at a fundamental frequency are converted into one photon at the harmonic frequency, = 2. SHG by reflection has proven to be particularly useful as a surface or interface probe when the media are centrosymmetric and do not allow, in the dipole approximation, SHG from the bulk11. At any interface though, the inversion symmetry is broken, thus allowing SHG by reflection from such structures to be highly surface specific. For non-centrosymmetric materials, where bulk SHG is allowed, it would be expected that the bulk response would overwhelm this surface contribution. However, 2 studies of non-centrosymmetric zinc blende-type materials by a number of workers12-22 have also demonstrated a surface-sensitive SHG response in reflection. Both Stehlin et al12 and Buhenko et al13 observed large variations in the reflected SH intensity during the vacuum deposition of tin and the adsorption of trimethylgallium on GaAs(001) surfaces respectively. Work by Armstrong et al23-26 showed that changes in both the rotational anisotropy pattern and a significant drop in the SH intensity could result on removal of a thin oxide overlayer. Rotational anisotropy studies by Yamada and Kimura14,15,16 were able to demonstrate surface effects through surface reconstruction and, in their discussion of the relative bulk and surface contributions, included the possible mixing of the SHG response from two different faces through either miscuts or vicinal faces. Berlouis et al 17=22 have shown that the use of SHG in-situ was extremely useful in examining and characterising the growth of thin non-centrosymmetric anodic sulfide films on MCT. The above studies have a direct relevance to the work presented here on the effect of the anodic oxide film on MCT. Whereas the MCT has a zinc-blende structure similar to that of GaAs, the anodic oxide consists of a mixture of CdTeO3, HgTeO3 and TeO2 and is thus essentially centrosymmetic. Previous measurements on an oxide-covered MCT sample revealed that in the presence of the oxide film, the SH intensity was substantially increased over that of the bare MCT surface27. This observation suggests that SH generation within the MCT, at the MCT/oxide film and at film/air interfaces have all got to be carefully accounted for in order to quantify the various contributions to the observed SH signal from the oxide-covered MCT surface. The flexible multilayer model developed here expands on the work of Yamada and Kimura16, where each layer is assigned its own symmetry and optical constants as well as a defined thickness. We note that for MCT, the reflected SHG signal is generated over a thin layer of material ca. 4060 nm thick, known as the coupling depth, immediately at the interface17. 3 Model geometry The geometry described in Figure 1 is general and can be extended to any number of layers where each layer is a semi-infinite parallel slab of a defined thickness, di. As described in the above figure the laboratory frame (0, x, y, z) is defined with the sample surface normal oriented along the z axis pointed upwards28. The y and x axes are oriented in the surface plane with the laboratory origin defined at the interface between medium 1 (representing air or electrolyte) and medium 2, with the top surface of the reflecting substrate at z = 0. The relationship between the laboratory and crystallographic axes will be defined later. Each slab is defined with its own complex refractive index, ni and ni at the fundamental and harmonic 2 frequencies respectively. The fundamental wave is incident at the medium 1/medium 2 interface at an angle of 1 . Owing to the laws of refraction, the fundamental beam propagates within medium 2 at an angle 2 and 3 in medium 3 and so on. Similarly, the harmonic beam propagates at angles 1 , 2 and 3 all of which can be related using nonlinear Snell’s law for SHG29 where 1 is the incidence angle at the air/nonlinear material interface i.e. n1 sin 1 n2 sin 2 n2 sin 2 Eq. 1 Additionally, reflection and transmission at each interface is characterised using the Fresnel coefficients. The complex expression for the incoming wave in medium 1 is E1 (r , t ) 1 E1 eˆ1 exp i t k1 r c.c. 2 Eq. 2 with the sign +/- in the subscripts used to denote the direction of propagation: the negative sign for the wave propagating downwards, towards negative z values, and the 4 positive sign for the wave propagating upwards, towards positive values of z in Figure 1. ê1 thus represents a unit vector for the fundamental wave travelling in medium 1 towards the interface with medium 2. The different electric field vectors can be decomposed within medium i as Ei/ Eis sˆ Eip pˆ i/ Eq. 3 where the two unit vectors ŝ and p̂ i- / span the plane perpendicular to the direction of propagation and are defined according to sˆ -yˆ pˆ i cos i xˆ sin i zˆ pˆ i cos i xˆ sin i zˆ Eq. 4 Eq. 5 The polarisation of the incident fundamental electric field is defined through the relations: sˆ eˆ1 sin Eq. 6 pˆ 1 eˆ1 cos e i Eq. 7 where is angle of polarisation of the fundamental wave and is the dephasing angle between E p and E s . Corresponding values evaluated at the harmonic frequency is denoted with capital letters. These include Fresnel coefficients, polarisation angles and the P̂i and Ŝ unit vectors. For example the polarisation state of the outgoing SH wave is defined with angles of polarisation and dephasing angle as: Sˆ eˆ1 sin Eq. 8 Pˆ1 eˆ1 cos ei Eq. 9 5 For convenience, the propagating fundamental wave is described as the m wave in the downwards direction and the p wave in the upward direction. Similarly the downwards and upwards propagating harmonic waves are referred to as M or P respectively. The electric field vectors for these waves within medium 2 can be expressed as: m e2 sˆt12s sˆ pˆ 2t12p pˆ 1w- eˆ1 p e2 sˆt12s r23s sˆ pˆ 2 t12p r23p pˆ 1w eˆ1 M Eq. 10 Eq. 11 s ˆ e2 SˆT21s R23 S Pˆ2T21p R23p Pˆ1 eˆ1 P e2 SˆT21s Sˆ Pˆ2T21p Pˆ1 eˆ1 Eq. 12 Eq. 13 where the electric field vectors within medium 2 are now no longer unit vectors. For multiple layers additional Fresnel reflection (r and R) and transmission (t and T) coefficients are added to Eq’s 10-13 accordingly to describe the electric field vector for that layer. Thus through Eq’s 2 – 13, the directional and polarisation properties of the fundamental and harmonic waves can be fully expressed within the laboratory reference frame in Figure 1 and the electric field vectors projected onto the laboratory cartesian axes. Phase dependence For layers with a finite thickness it is necessary to take into account the effect of phase shifts on the value of the measured SH intensity. With reference to the geometry in Figure 1 it can readily be shown that the path difference between the m and p waves is given by path 2d2 cos 2 Eq. 14 for the fundamental wave and similarly path 2d 2 cos 2 Eq. 15 6 for the harmonic wave. For waves traversing across the slab layer only once the phase ( k2 path ) is shifted by half the values in Eq’s 14 and 15. The phase shift of the wave is normally presented in complex form. For reference purposes the phase of the fundamental wave is defined as zero at the medium 1/medium 2 interface i.e. at z = 0. It is clear from Figure 1 that both the m and p waves accumulate phase as they move downwards away from the interface. However, the increase in phase for the p wave will be greater than that of the m wave by an amount equivalent to the path length AB + BC. By considering the phase difference between the m and p components, the phase shift of each wave transmitting through medium 2 can be represented as a function of z using the following equations with a similar argument applying to the M and P waves: m exp i 2 z p exp i 2 z M P exp i z exp i 2 z 2 Eq. 16 Eq. 17 Eq. 18 Eq. 19 where 0 z d 2 and 2 2 2 o 4 o n2 cos 2 Eq. 20 n2 cos 2 Eq. 21 where in both cases o is the wavelength of the fundamental wave in vacuum and which is usually regarded as equal to air . Similarly, in the description of the phase shift 7 in medium 3, passage of the incident and reflected waves through medium 2 have to be taken into account: m exp i 3 z z23 2 d 2 p exp i 3 z z23 2 d 2 M exp i 3 z z23 2 d 2 P exp i 3 z z23 2 d 2 Eq. 22 Eq. 23 Eq. 24 Eq. 25 where z23 refers to the interface between media 2 and 3. Furthermore 0 z z23 d3 , and 3 3 2 o 4 o n3 cos 3 Eq. 26 n3 cos 3 Eq. 27 For the fundamental wave in medium 2, the electric vector, expressed as the sum of the m and p components is given by Eq. 28 Eq. 29 e2 e2 exp i 2 z e2 exp i 2 z m p and for the harmonic wave e2 e2 exp i 2 z e2 exp i 2 z M P 8 Multiple reflections It has been previously shown30 that SH waves reflected from a thin film may be significantly enhanced by multiple reflections of the SH and fundamental waves within the film. Although the effects of multiple reflections were discussed in the early stages of SHG theory by Bloembergen and Pershan31, they were not properly taken into account until the work by Schoji et al32 who reviewed the absolute values of the nonlinear coefficients for a large range of materials. The reason for this neglect is that for films or crystal slabs, whose thicknesses are much less than that of the propagating wavelength, or have a refractive index of around 2 or lower, then the effects of multiple reflections could be regarded as small and well within the generally large experimental error associated with the measurement of nonlinear coefficients. In the case of CMT itself, multiple reflection effects can be ignored as it is a highly absorbing material at room temperature. However, this does not apply to the anodic oxide layer as this has a refractive index of 2.22 at the harmonic frequency. Considering the propagation of a wave within medium 2 in Figure 1, the multiple reflection effect can be accounted for by multiplication of the amplitude of the propagating wave by a factor 1 1 r21r23 exp i 2 2 d 2 Eq. 30 which is the convergent term for a sum to infinity of a geometric series with phase r21r23 exp i 2 2 . Thus for the s and p-polarised components of the m, p, M and P waves the relevant factors are: 2s 2s 1 1 r r exp i 2 2 d 2 2p 2p Eq. 31 1 1 r r exp i 2 2 d 2 Eq. 32 s s 23 21 p p 23 21 9 2S 2S 1 1 R R exp i 2 2 d 2 Eq. 33 2P 2P 1 1 R R exp i 2 2 d 2 Eq. 34 S 23 P 23 S 21 P 21 Substituting Eq’s 31-34 into Eq’s 10-13, respectively gives: e2 sˆt12s 2s- sˆ pˆ 2t12p 2p- pˆ 1w- eˆ1 Eq. 35 e2 sˆt12s r23s 2s sˆ pˆ 2 t12p r23p 2p pˆ 1w eˆ1 Sˆ T s e2 SˆT21s R23 2S Sˆ Pˆ2T21p R23p 2P Pˆ1 eˆ1 e2 s 21 S 2 Sˆ Pˆ2T21p 2P Pˆ1 eˆ1 Eq. 36 Eq. 37 Eq. 38 As can be deduced from the above equations, the effect of multiple reflections is the generation of an interference pattern, dependent on both incident angle and layer thickness. This pattern is superimposed on the Maker Fringe pattern33 but has a much smaller oscillation period compared to the Maker fringe transmission coherence length. MCT belongs to the crystallographic group 43m and for such a surface covered by a thin oxide film, the overall harmonic electric field amplitude for the reflected Pmm wave can be written as E2,Pmm C e2 Rφ Rvic 423m : e2e2 E1 2 Eq. 39 where C is a numerical constant, 4( 23)m is the susceptibility tensor for the material. R and Rvic deal with tensor transformation due to sample rotation around the surface normal (the z direction) and the transformation from the pure {100} surface to the vicinal surface, respectively16,21 (see Figure 2). 10 Experimental The epitaxial MCT samples were obtained from the QinetiQ Malvern Technology Centre (formerly the Defence and Evaluation Research Agency, Malvern, UK). These were grown using the inter-diffused multi-layer process by metal-organic vapour-phase epitaxy (IMP-MOVPE) on a vicinal GaAs {100} substrate34, with an off-angle of 4o towards the 110 direction in order to improve the lattice match between the II-VI epilayer and the III-V substrate. The MCT layers were of the order of 15 m thick and were capped by a ca. 2000 Å layer of CdTe in order to prevent the out-diffusion of Hg during the final anneal stages of the IMP-MOVPE process. Prior to sample use, the capping layer was removed by an electrochemical etching process35 and the underlying MCT layer was examined by the technique of electrolyte electroreflectance (EER)36,37 in order to determine the alloy composition x. Growth of the anodic oxide was carried out in a solution of 0.1 M KOH in 90 vol% ethylene glycol in water. A platinum gauze served as the counter electrode and a saturated (KCl) calomel electrode (SCE) was used as a reference electrode. This has a potential of 0.242 V at 25oC versus the standard hydrogen electrode (SHE). Removal of the anodic oxide, where necessary, was carried out by dissolving in 10% volume of lactic acid in water. All solutions were prepared using Analar grade reagents in singly distilled water. The experimental set-up for the in-situ ellipsometry experiments has been described elsewhere38. Briefly, a computer-controlled Gaertner L116B rotating analyser ellipsometer employing a HeNe laser of wavelength = 632.8 nm (1.96 eV) was incident onto the sample surface at an angle of 70o. The samples were mounted in a special electrochemical cell constructed of Perspex and fitted with quartz windows for the incident and reflected beams. The ellipsometry angles of and were automatically recorded at specified time intervals, 5 s. The details of the apparatus used for the reflection SHG measurements have been reported previously17. Essentially, infra-red laser pulses (20 ns) with a fundamental wavelength of 1064 nm are incident on the MCT surface. The incident radiation is S- or P-polarised and the reflected beam, containing both fundamental and harmonic responses is passed through a polariser (P or S) into a Thorn-EMI 9813B photomultiplier (PMT) tubes masked by a 532 nm narrow band-pass 11 filter. The signal from the PMT is digitised (Tektronix 7D20) and sent, via the General Purpose Interface Bus (GPIB), to a personal computer (PC) fitted with a National Instruments MC-GPIB card, running custom written software. The MCT sample was mounted on an optical rotation stage controlled by an Ealing Electro-Optics 4-axis DPS controller which was in turn controlled by the PC over the GPIB. The sample stage was typically rotated at 5o degrees intervals with the rotation angle and the measured SH signal stored onto disk allowing complete characterisation of the rotational anisotropy pattern. Each anisotropy pattern reported here is the average of three repeat 360º rotations. Measurements of SH intensity at a fixed sample position over a period of time indicated a signal variation of ~8%. Calculation of the SH intensities and modeling of the SHG rotational anisotropy data were carried using custom written software in Igor Pro 3.13 (WaveMetrics Inc.) Results and Discussion Anodic oxide growth The cyclic voltammogram obtained for the MCT sample (x = 0.277) in a solution containing 0.1 M KOH in 90 % ethylene glycol and 10 % water (pH = 12.2) is given in Figure 3. Here, the potential was swept at a scan rate of 10 mV s-1 from an open circuit value of –0.110 V to a final value of 1 V before reversing back to –0.1 V. For the second cycle the potential was swept to a value of 1.5 V before returning to –0.1 V. The initial anodic oxidation curve exhibited two distinct current maxima, and , at 0 V and 0.46 V with corresponding peak values of 5 and 230 A cm2 respectively. These were followed by a passivation region where the growth current remained at a constant value of ca. 63 A cm2. The data here can be directly compared to the work performed by Seelmann-Eggebert39 which involved XPS analysis of the HgTe (and MCT) surfaces during anodic oxide growth. It is very likely that the anodic peak I is associated with the oxidation of elemental Hg according to the reaction Hg 2OH Hg OH 2 2e 12 which occurs at a potential of ~ 0.070 V vs. SCE. The Hg atom is the most weakly bound element in the MCT lattice and there have been a number of reports examining Hgevaporation from the MCT surface and Hg-accumulation/depletion effects at various MCT/film interfaces40-42. It is feasible therefore that the residue film promotes an accumulation of Hg at the MCT surface. The initial stages of the oxide film growth have long been considered to occur by a dissolution-precipitation mechanism9. On scanning the potential positive, dissolution of the semiconductor surface continues at an increasing rate until the concentration of the dissolved species approaches its solubility limit. At this point, a precipitate forms on the anode surface and is associated with the formation of the passivation peak II. Beyond this, growth of the oxide layer is supported by a high-field growth mechanism43,44 (electric field ~ 106 to 107 V cm1) whereby the field is able to drive ions through the film at a rate such that growth can be sustained. Thus, on the second scan, no further film growth is observed until the applied potential is positive enough to provide the electric field necessary for that process to occur. The ellipsometry plot for growth of the anodic oxide at a constant current density of 150 A cm2 is shown in Figure 4. A three-phase model (ambient-film-substrate)45 was employed to fit the experimental data, with a value of 1.43 employed for the refractive index of the oxide growth solution. As can be seen from the figure, the model used provides an excellent fit to the experimental data. The initial oxide layer grown in this medium had a refractive index of 2.1 and this is consistent with data from the literature. 27,46 . The layer here consisted of essentially CdTeO3 and HgTeO3 39. Beyond a thickness of 30 nm, a small change in the refractive index of the growing film was found and this is associated with a small variation in the composition/morphology of the layer. Significantly though, the extinction coefficient for the layer up to at least 100 nm thickness remained at zero indicating that the oxide layer did not absorb any of the incident radiation of 632.8 nm (1.96 eV). 13 SHG analysis The SH rotation anisotropy pattern obtained in air for the MCT (100) vicinal surface before and after the removal of an anodic oxide is displayed in Figure 5. The angle of the incident beam was 56º with respect to the sample normal. Both the PIN-POUT and PIN-SOUT patterns in the figure were obtained as a result of averaging over 3 repeat runs. The anodic oxide was grown at a constant current density of 70 A cm2 to a cell voltage of 13 V, consuming a total charge density of 73.67 mC cm2. On comparing the anodic charge density passed and the final anode voltage with the ellipsometry measurements discussed earlier, the film thickness was calculated to be 58 3 nm. Removal of the oxide, using a 10 vol% lactic acid solution in water, was performed within the electrochemical cell with no alteration in either the sample position or optical set-up. The data in Figure 5 reveals that the presence of the oxide results in a substantial increase in the reflected SH intensity with respect to the bare surface. Indeed, if the measured SH intensity for the oxide present is plotted against the SH intensity when the oxide is removed for each corresponding angle in the anisotropy pattern, then the linear relationships shown in Figure 6 are obtained. The plots of the measured intensities in the PIN-POUT and PIN-SOUT configurations indicate that the presence of the oxide increases the intensity of the rotational anisotropy pattern by a constant multiple but has no significant effect on the symmetry of the anisotropy pattern itself. As described by SeelmannEggebert39 and Stahle et al47, the composition of the bulk anodic oxide consists of a mixture of HgTeO3, CdTeO3 and TeO2. These components are not symmetrically distributed within the oxide layer and it is unlikely therefore that any long range order exists within the bulk oxide. It is thus centrosymmetric and no SH generation within the bulk oxide is allowed under the electric dipole approximation. Also these measurements were performed in air and so no electric field polarisation effects across the film need be considered which could affect the centrosymmetry of the oxide film. From the above discussion, it is clear from the anisotropy results in Figure 5 that the increased SH signal must originate from the MCT bulk signal. Two possible explanations for the source of the SH signal increase can be considered, viz.,( i) charge accumulation at 14 the MCT/oxide interface and (ii) multiple reflections of the fundamental and harmonic beams within the oxide layer. From capacitance-voltage (C-V) measurements it is known that the growth of the anodic oxide on n-type MCT leads to an accumulation of positive fixed charge (due to oxygen vacancies) of the order of 5.0 – 9.0 1011 cm2 on the oxide surface48,49,50. This leaves the MCT surface slightly accumulated with the formation of a small space charge region, and it is this increase in electron density that could be associated with the rise in SH intensity through an increase in the (2) susceptibility tensor. It has been shown in previous work51 that the intensity of SH waves reflected from a thin film may be strongly enhanced through multiple reflections of the fundamental and harmonic beams within the film. In this case and as in subsequent work on SH waves in thin films52, the films themselves were non-centrosymmetric and therefore generated SH. However, the anodic oxide film here is centrosymmetric and any increase in the SH intensity due to multiple reflections within the oxide film would be as a result of an increased interaction of the fundamental beam with the CMT substrate. In order to investigate more deeply the effects due to multiple reflections, a study was carried in which the SH intensity was measured over the whole anisotropy pattern as a function of the angle of incidence of the fundamental beam. A total of three angles of incidence, viz. 32º, 45º and 56º with respect to the sample surface normal were employed. At all angles care was taken in the arrangement of the experimental optics to ensure that the path length travelled by the laser beam, before and after reflection, remained constant. Anisotropy patterns were obtained in both the PIN-POUT and PIN-SOUT configurations at each incidence angle before and after removal of an oxide film, the latter grown under exactly the same conditions as described for Figure 5. Comparison of the results in Figures 7 and 8 clearly demonstrate that changes in the angle of incidence has a marked influence on the intensity of the SH rotational anisotropy pattern. Table I summarises the results obtained at each incident angle from a linear plot of the SH intensity when the oxide is present against the measured SH intensity on oxide removal at each corresponding rotational angle over the whole anisotropy pattern. From Table I it is clear that, in the PIN-POUT configuration, as the angle of incidence is increased, the constant factor by which the oxide induces an increase the SH intensity of the anisotropy pattern is 15 reduced. However, for the PIN–SOUT configuration the opposite trend is observed. The intercept of the calculated slope is included in the table to provide an indication of the noise level. Modeling of the effect of multiple reflections within the oxide film on the amplitude of the incident fundamental wave and the SH wave generated on reflection at the MCT surface was carried out using the expressions described above. Using values of n 2.15 and n 2.22 for the refractive indices of the oxide film at the fundamental and harmonic waves, respectively, and n 3.54 , k = 0.4 and n 3.485 , k = 1.405 for the MCT layer53, Figure 9 compares modeled anisotropy curves for both the PIN-SOUT and PIN-SOUT polarisation configurations with experimental data acquired in the presence of a 58 nm thick anodic oxide film and after its removal. The angle of incidence employed in these calculations was 45º and the vicinal angles were = 2.3º and = 55º. With all model parameters unchanged except for the oxide layer thickness, an increase in the SH intensity by factors of 1.59 and 2.27 for the PIN-POUT and PIN-SOUT polarisation configurations, respectively, were calculated giving excellent agreement with the experimental data. Table II lists the calculated increase in the SH response for both these polarisation configurations at all the incidence angles employed. On comparing the results in Tables I and II, it can be seen there is excellent correspondence between the values obtained at the three different angles of incidence. This indicates that multiple reflections can thus account for most of the experimentally observed SH increase and that charge accumulation at the MCT/oxide interface for the oxide thickness employed in this study does not play a significant role in the SH increase. It may well be that for a different oxide thickness, the charge accumulation at the buried MCT/oxide interface could vary and so affect the SH intensity to a much greater extent than in the present case. This will be explored in future work. However, it is also interesting to note that a closer match between the experimental and calculated values is obtained for the PIN-POUT configuration compared to the PIN-SOUT configuration. A possible explanation for this could be that the s-polarised beam along the MCT/oxide interface is more affected by scattering at the MCT/oxide interface due to small scale roughening54 in this region. 16 Conclusions The growth of the anodic oxide film on MCT has been followed using in-situ ellipsometry and the information obtained used to help support the development of a quantitative model that describes the enhancement in the second harmonic signal in the presence of the oxide film. Analysis of the ellipsometry data shows that for thin films (<100 nm) grown galvanostatically at 150 A cm2, the layer is essentially uniform with a refractive index of ~2.15 and exhibits no absorption of the 1.96 eV incident radiation. SHG rotational anisotropy carried out on the bare MCT surface and in the presence of a 58 nm thick anodic oxide film shows a clear increase in SH intensity when the oxide film is present but no change in the anisotropy pattern occurs. This confirms that the oxide film is centrosymmetric and that the increase in the observed SH intensity must arise from the underlying MCT. Careful modeling of the data, at different angles of incidence and polarization configurations of PIN-POUT and PIN-SOUT indicate that this increase can be largely attributed to multiple reflections of the fundamental beam of frequency within the composite layer (ambient/oxide/MCT). The model could successfully reproduce the experimentally observed variations in the magnitude of the incremental factor with increasing angle of incidence for both the PIN-POUT and PIN-SOUT polarization configurations. Acknowledgements: The authors are particularly grateful to Dr M G Astles of the QinetiQ Malvern Technology Centre (formerly the Defence and Evaluation Research Agency, Malvern, UK) for making the MCT samples available to us. 17 Tables Angle of incidence 32o 45o 56o Table I PIN-POUT Increment Intercept factor -0.032 1.77 4 % -0.007 1.56 4 % -0.006 1.26 4 % Measured increase in SH intensity due to presence of a 58 nm thick anodic oxide film, as per analysis method of Figure 6. Angle of incidence 32o 45o 56o Table II PIN-SOUT Increment Intercept factor -0.029 2.02 4 % -0.039 2.34 4 % -0.009 2.48 4 % PIN-POUT Increment factor 1.87 1.59 1.29 PIN-SOUT Increment factor 2.21 2.27 2.34 Calculated increase in SH intensity of an oxide covered MCT surface due to multiple reflections within the 58 nm anodic oxide layer. 18 Figure Captions Figure 1 Schematic of the different waves present within the multilayer model. For the layer of thickness d2, the difference in geometrical path for reaching C directly or by reflection at the interface at B is path = AB + BC. Figure 2 Definition of vicinal surface and showing sample rotation about the surface normal. Figure 3 Cyclic voltammograms of an MCT sample (x = 0.277) in a 0.1 M KOH solution in 90 vol% ethylene glycol/10 vol% water. Figure 4 In-situ ellipsometry plot for the growth of an anodic oxide film on MCT at a constant current density of 150 μA cm2 in a 0.1 M KOH solution in 90 /10 vol% ethylene glycol/water. Figure 5 Rotational anisotropy SH intensity patterns obtained in air in the (a) PINPOUT and (b) PIN-SOUT polarisation configurations, before and after the removal of the anodic oxide film (~58 nm thick). The angle of incidence was 56º. Figure 6 Plots of the measured SH intensity for the oxide present against the SH intensity measured when the oxide is removed, for each corresponding rotation angle in the (a) PIN-POUT and (b) PIN – SOUT anisotropy patterns of Figures 5 (a) and (b) respectively. Figure 7 Rotational anisotropy patterns for the PIN-POUT polarisation configuration measured at incidence angles of 32º, 45º and 56º before (a) and after (b) removal of a 58 nm oxide film. Figure 8 Rotational anisotropy patterns for the PIN-SOUT polarisation configuration measured at incidence angles of 32o, 45o and 56o before (a) and after (b) removal of a 58 nm oxide film. Figure 9 Experimental data and modelled rotational anisotropy patterns for the (a) PIN-POUT and (b) PIN-SOUT polarisation configurations at an incidence angle of 45º, comparing the effects of multiple reflections within the ambient/oxide/MCT layer. 19 z p m P 1 1 1 y 2 d2 M 2 C 2 x A B 3 3 Figure 1 20 z y y' z' x x' Figure 2 21 250 i D (A cm-2 ) II 200 150 100 1st cycle 2nd cycle 50 0 -0.1 I 0.3 0.7 1.1 1.5 Potential /V Figure 3 22 400 350 300 250 Film 1: n = 2.1, k = 0.0, = 30 nm Film 2: n = 2.2, k = 0.0, = 70 nm 200 /º Data Film 1 Film 2 150 Start: Bare MCT 100 50 0 0 10 20 30 40 50 60 -50 /º Figure 4 23 0.6 (a) P IN - P OUT SH intensity /a.u. 0.5 oxide film 0.4 bare MCT 0.3 0.2 0.1 0 0 60 120 180 240 300 360 Rotation angle /º 1.2 (b) P IN - S OUT 1 SH intensity /a.u. oxide film bare MCT 0.8 0.6 0.4 0.2 0 0 60 120 180 240 300 360 Rotation angle /º Figure 5 24 0.6 (a) PIN - POUT SHG (oxide) 0.5 0.4 0.3 0.2 0.1 0 0.05 0 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.3 0.35 0.4 P IN - P OUT SHG (MCT) 1.2 (b) PIN - SOUT SHG (oxide) 1 0.8 0.6 0.4 0.2 0 0 0.05 0.1 0.15 0.2 0.25 P IN - S OUT SHG (MCT) Figure 6 25 SH intensity /a.u. 0.6 (a) 0.5 56º (oxide) 45º (oxide) 0.4 32º (oxide) 0.3 0.2 0.1 0 SH intensity /a.u. 0 0.45 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 60 120 180 240 Rotation angle /º 300 360 300 360 (b) 56º (bare MCT) 45º (bare MCT) 32º (bare MCT) 0 60 120 180 240 Rotation angle /º Figure 7 26 (a) SH intensity /a.u. 1 56º (oxide) 45º (oxide) 0.8 32º (oxide) 0.6 0.4 0.2 0 0 0.45 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 60 120 180 240 Rotation angle /º (b) 300 360 56º (bare MCT) SH intensity /a.u. 45º (bare MCT) 32º (bare MCT) 0 60 120 180 240 Rotation angle /º 300 360 Figure 8 27 SH intensity/a.u. 0.4 bare MCT oxide film model fit bare MCT model fit with oxide film (a) PIN - POUT 0.3 0.2 0.1 0.0 0 50 100 150 0.6 SH intensity/a.u. 200 Rotation angle/º 250 (b) P IN - SOUT 0.5 300 350 bare MCT oxide film model fit bare MCT model fit with oxide 0.4 0.3 0.2 0.1 0.0 0 50 100 150 200 Rotation angle/º 250 300 350 Figure 9 28 References 1 C.T. 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