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Transcript
P R ODUC T BR IE F
®
TM
LX24232 - 32 Channel BackLight
LED Driver
DESCRIPTION
KEY FEATURES
♦
White LED or RGB BackLight
driver for large size display
panels
♦
Up to 32 LED strings with
±1.5% precision current
matching
♦
Wide dimming ratio with PWM
and LED current amplitude
control
♦
12-bit PWM duty-cycle
resolution and 8-bit resolution
for LED current setting
♦
LED power supply voltage
control
♦
SPI communication interface
♦
Open string, short LED and
over-temperature protection
for each individual channel
♦
On-chip thermal monitoring
Plastic 8x8mm QFN 56 pin
RoHS Compliant/Pb free
LX24232ILQ
-40 to +85°C
Note: Available in Tape & Reel. Append the letters ”TR” to the part number. (i.e. LX24232ILQ-TR)
TA (°C)
Copyright  2011
Rev. 0.1, April 2011
Microsemi
LX24232
PACKAGE ORDER INFO
W W W. Microsemi .CO M
The LX24232 is a 32-channel display backlight LED controller. The
device is part of a chipset consisting of the LX24232 and the LX23108A 8channel LED driver. Each controller is capable of controlling up to 32 LED
channels, by controlling up to four LX23108A LED drivers. Each driver
contains eight FETs and controls up to 4 x 8 LED channels, where each
channel is capable of driving a current of up to 200mA.
The LX24232 has 32 independent, frame-by-frame controlled PWM
output channels; each output channel supports independent duty-cycle
and phase delay control. It uses a Vsync input for flexible synchronization
schemes, including synchronization to either rising or falling edges,
optimal Vsync jitter support, as well as single or multiple PWM cycles per
frame support, and loss of Vsync support.
The LX24232 consists of an on-chip internal power supply control
circuitry that can be used to adjust the voltage level of an external LED
power source. This is done by regulating the LED supply voltage to the
optimum level, and thus minimizing the system power loss. At the same
time, accurate current regulation for each of the 32 LED strings is
maintained.
The LX24232 includes an on-chip analog to digital converter for drain
voltage (VD) measurements, for power supply control, fault detection and
protection. The device is configured through the SPI interface which
speeds up communication and reduces the number of control signals
between the LX24232 and the host system (FPGA, Video Processor, and
CPU).
The LX24232 supports a daisy chain connection in case more than 32
channels are required and can detect three types of system faults on each
of its 32 channels (over-temperature, open LEDs and short LEDs). After
detecting the faults the unit takes the required measures to protect the
system.
The LX24232 is capable of controlling up to 8 LX23108A drivers, in a
special configuration where two consecutive channels are connected
together for increased current support. Refer to the application note for
more details.
C O M P ANY C O NF I DE NTI AL
LX24232 - 32 Channel BackLight
LED Driver
®
TM
PWM12
PWM11
PWM10
PWM09
PWM08
PWM07
PWM06
PWM05
PWM04
PWM03
PWM02
PWM01
PWM00
PSEL_SIG
PS_CTRL 1 56 55 54 53 52 51 50 49 48 47 46 45 44 4342 PWM13
SDI 2
41 PWM14
MOD0 3
40 PWM15
39 FAULT_IN
38 VZAP
MOD1 4
CLK 5
SCAN0 6
SCAN1 7
VDD
8
SCAN2
9
SCAN3
10
SCK
11
CS_N
12
SYNC_IN
13
SYNC_OUT
W W W. Microsemi .CO M
Pin Configuration
37 VREF
36 ATB_P
LX24232ILQ
32-CHANNEL
LED DRIVER
35 ATB_N
34 VDMEAS
33 VCC
32 PSEL_CLK
31 PWM16
30 PWM17
14
29 PWM18
15 16 17 18 19 20 21 22 23 24 25 26 27 28
PWM19
PWM21
PWM20
PWM23
PWM22
PWM24
PWM26
PWM25
PWM28
PWM27
PWM29
PWM31
PWM30
SDO
ABSOLUTE MAXIMUM RATINGS
Supply Input Voltage (VCC, VDD) ….………………………………………..……………….… -0.5V to 4.5V
All other pins…………………………………………………………….……. -0.5V to VCC+0.3 up to 4.5V
Operating Ambient Temperature Range……………………………………….………………. -40 to 85°C
Maximum Operating Junction Temperature………………………………………….……………….150°C
ESD Protection at all I/O pins……………………………………………….………………… +/- 2KV HBM
Storage Temperature Range………………………………………………………….……. -65°C to 150°C
Package Peak Temperature for Solder Reflow (40 seconds maximum exposure)….… 260°C (+0/-5°C)
Notes: Exceeding these ratings could result in damage to the device. All voltages are with respect to Ground.
THERMAL DATA (POWER CONSUMPTION)
For support contact: [email protected] or visit our website at www.microsemi.com.
Copyright  2011
Rev. 0.1, April 2011
Microsemi
LX24232
21°C/W – according to JESD51-7.
THERMAL RESISTANCE-JUNCTION TO AMBIENT
Junction Temperature Calculation: TJ = TA + (PD x θJA).