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Transcript
TS3A44159
www.ti.com ......................................................................................................................................................... SCDS225A – MARCH 2007 – REVISED JUNE 2008
0.45-Ω QUAD SPDT ANALOG SWITCH
QUAD-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER WITH TWO CONTROLS
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
15
14
13
1
12
2
11
3
10
4
9
6
7
NC2
16
15
13
14
1
12
COM1
GND
2
11
NO1
NO3
3
10
V+
COM3
4
9
8
NC2
GND
NO3
COM3
5
COM4
NO4
IN3-4
NC3
NC1
16
NC1
IN1-2
NO2
COM2
5
6
7
8
COM4
IN1-2
NC1
COM1
NO1
V+
NC4
COM4
NO4
NO2
IN1-2
16
15
14
13
12
11
10
9
NO4
1
2
3
4
5
6
7
8
RSV PACKAGE
(TOP VIEW)
COM1
NO1
V+
NC4
NO2
COM2
NC2
GND
NO3
COM3
NC3
IN3-4
RGT PACKAGE
(TOP VIEW)
IN3-4
PW PACKAGE
(TOP VIEW)
Cell Phones
PDAs
Portable Instrumentation
Audio and Video Signal Routing
Low-Voltage Data-Acquisition Systems
Communication Circuits
Modems
Hard Drives
Computer Peripherals
Wireless Terminals and Peripherals
COM2
•
Specified Break-Before-Make Switching
Low ON-State Resistance (<0.5 Ω)
Control Inputs Are 1.8-V Logic Compatible
Low Charge Injection
Excellent ON-State Resistance Matching
Low Total Harmonic Distortion (THD)
1.65-V to 4.3-V Single-Supply Operation
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
NC3
1
NC4
DESCRIPTION/ORDERING INFORMATION
The TS3A44159 is a quad single-pole double-throw (SPDT) analog switch with two control inputs, which is
designed to operate from 1.65 V to 4.3 V. This device is also known as a dual double-pole double-throw (DPDT)
configuration. It offers low ON-state resistance and excellent ON-state resistance matching with the
break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to
another. The device has an excellent total harmonic distortion (THD) performance and consumes very low
power. These features make this device suitable for portable audio applications
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TS3A44159
SCDS225A – MARCH 2007 – REVISED JUNE 2008 ......................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
PACKAGE
–40°C to 85°C
(1)
(2)
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
RGT – QFN
Tape and reel
TS3A44159RGTR
ZWH
RSV – QFN
Tape and reel
TS3A44159RSVR
ZWH
PW – TSSOP
Tape and reel
TS3A44159PWR
YC4159
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
SUMMARY OF CHARACTERISTICS (1)
Quad 2:1 Multiplexer/Demultiplexer
(4 × SPDT or 2 × DPDT)
Configuration
Number of channels
4
ON-state resistance (ron)
0.45 Ω (max)
ON-state resistance match (Δron)
0.07 Ω (max)
ON-state resistance flatness (rON(flat))
0.1 Ω (max)
Turn-on/turn-off time (tON/tOFF)
23 ns/32 ns
Break-before-make time (tBBM)
30 ns
Charge injection (QC)
139 pC
Bandwidth (BW)
35 MHz
OFF isolation (OISO)
–71 dB
Crosstalk (XTALK)
–73 dB
Total harmonic distortion (THD)
0.003%
0.4 µA
Power-supply current (I+)
Package option
(1)
16-pin QFN
V+ = 4.3 V, TA = 25°C
FUNCTION TABLE
NC TO COM,
COM TO NC
NO TO COM,
COM TO NO
L
ON
OFF
H
OFF
ON
IN
LOGIC DIAGRAM
IN1-2
NC1
COM1
NO1
NC2
COM2
NO2
NC3
COM3
NO3
NC4
COM4
NO4
IN3-4
2
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A44159
TS3A44159
www.ti.com ......................................................................................................................................................... SCDS225A – MARCH 2007 – REVISED JUNE 2008
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
V+
Supply voltage range (3)
–0.5
4.6
V
VNC
VNO
VCOM
Analog voltage range (3) (4) (5)
–0.5
V+ + 0.5
V
IK
Analog port diode current
INC
INO
ICOM
ON-state switch current
VI
Digital input voltage range
VNC, VNO, VCOM < 0
ON-state peak switch current (6)
(3) (4)
IIK
Digital input clamp current
I+
Continuous current through V+
IGND
Continuous current through GND
θJA
Package thermal impedance (7)
Tstg
(1)
(2)
(3)
(4)
(5)
(6)
(7)
VNC, VNO, VCOM = 0 to V+
VI < 0
–50
mA
–200
200
–400
400
–0.5
4.6
–50
–100
V
mA
mA
PW package
108
RGT package
TBD
RSV package
TBD
–65
mA
mA
100
Storage temperature range
UNIT
150
°C/W
°C
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 4.6 V maximum.
Pulse at 1-ms duration <10% duty cycle
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A44159
3
TS3A44159
SCDS225A – MARCH 2007 – REVISED JUNE 2008 ......................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS FOR 4.3-V SUPPLY (1)
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
Analog Switch
Analog signal
range
ON-state
resistance
ON-state
resistance match
between channels
ON-state
resistance
flatness
NC, NO
OFF leakage
current
NC, NO
ON leakage
current
COM
ON leakage
current
VCOM,
VNO, VNC
0
ron
VNO or VNC = 2.5 V,
ICOM = –100 mA,
Switch ON,
See Figure 16
Δron
VNO or VNC = 2.5 V,
ICOM = –100 mA,
Switch ON,
See Figure 16
VNO or VNC = 1 V,
1.5 V, 2.5 V,
ICOM = –100 mA,
Switch ON,
See Figure 16
ron(flat)
INO(OFF),
INC(OFF)
VNO or VNC = 0.3 V,
VCOM = 3.0 V,
or
VNO or VNC = 3.0 V,
VCOM = 0.3 V,
INO(ON),
INC(ON)
VNO or VNC = 0.3 V,
VCOM = Open,
or
VNO or VNC = 3.0 V,
VCOM = Open,
ICOM(ON)
VNO or VNC = Open,
VCOM = 0.3 V,
or
VNO or VNC = Open,
VCOM = 3.0 V,
25°C
Full
0.05
0.02
4.3 V
Full
4.3 V
25°C
See Figure 18
Full
25°C
See Figure 18
Full
–90
–20
4.3 V
5
Ω
nA
20
90
5
Ω
20
90
–90
–20
4.3 V
5
Ω
0.1
0.1
–20
V
0.07
0.1
25°C
Full
0.45
0.5
4.3 V
25°C
See Figure 17
0.3
4.3 V
25°C
Full
V+
nA
20
nA
–90
90
4.3
V
1
V
Digital Control Inputs (IN1-2, IN3-4) (2)
Input logic high
VIH
Input logic low
VIL
Input leakage
current
(1)
(2)
4
IIH, IIL
VIN = 3.6 V or 0
Full
4.3 V
1.5
Full
4.3 V
0
25°C
Full
4.3 V
0.5
10
50
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A44159
TS3A44159
www.ti.com ......................................................................................................................................................... SCDS225A – MARCH 2007 – REVISED JUNE 2008
ELECTRICAL CHARACTERISTICS FOR 4.3-V SUPPLY (continued)
TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
17
23
UNIT
Dynamic
25°C
Turn-on time
tON
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Turn-off time
tOFF
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Break-before-make
time
tBBM
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF
Charge injection
QC
VGEN = 0,
RGEN = 0,
CL = 1 nF
25°C
4.3 V
139
pC
Full
25°C
Full
25°C
Full
4.3 V
25
12
4.3 V
4.3 V
32
35
2
9
1
30
35
ns
ns
ns
NC, NO
off
capacitance
CNC(OFF),
CNO(OFF)
VNC or VNO = V+ or
GND,
Switch OFF,
See Figure 19
25°C
4.3 V
50
pF
NC, NO
ON capacitance
CNC(ON),
CNO(ON)
VNC or VNO = V+ or
GND,
Switch OFF,
See Figure 19
25°C
4.3 V
160
pF
COM
ON capacitance
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 19
25°C
4.3 V
160
pF
25°C
4.3 V
2.5
pF
Digital input
capacitance
CI
VI = V+ or GND
Bandwidth
BW
RL = 50 Ω,
Switch ON
25°C
4.3 V
35
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 100 kHz,
Switch OFF
25°C
4.3 V
–71
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 100 kHz,
Switch ON
25°C
4.3 V
–73
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz
25°C
4.3 V
0.003
%
VI = V+ or GND,
Switch ON or OFF
Supply
Positive supply
current
I+
25°C
Full
4.3 V
0.15
0.4
1.2
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A44159
µA
5
TS3A44159
SCDS225A – MARCH 2007 – REVISED JUNE 2008 ......................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY (1)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
Analog Switch
Analog signal
range
ON-state
resistance
ON-state
resistance match
between channels
ON-state
resistance
flatness
NC, NO
OFF leakage
current
NC, NO
ON leakage
current
COM
ON leakage
current
VCOM,
VNO, VNC
ron
Δron
ron(flat)
0
VNO or VNC = 2.0 V,
ICOM = –100 mA,
Switch ON,
See Figure 16
VNO or VNC = 2.0 V, 0.8
V,
ICOM = –100 mA,
Switch ON,
See Figure 16
VNO or VNC = 2.0 V, 0.8 V Switch ON,
ICOM = –100 mA,
See Figure 16
INO(OFF),
INC(OFF)
VNO or VNC = 0.3 V,
VCOM = 3.0 V,
or
VNO or VNC = 3.0 V,
VCOM = 0.3 V,
INO(ON),
INC(ON)
VNO or VNC = 0.3 V,
VCOM = Open,
or
VNO or VNC = 3.0 V,
VCOM = Open,
ICOM(ON)
VNO or VNC = Open,
VCOM = 0.3 V,
or
VNO or VNC = Open,
VCOM = 3.0 V,
25°C
Full
0.06
0.05
3V
Full
3.6 V
25°C
See Figure 18
Full
25°C
See Figure 18
Full
–50
–15
3.6 V
5
Ω
nA
15
50
5
Ω
15
50
–50
–15
3.6 V
5
Ω
0.1
0.1
–15
V
0.07
0.1
25°C
Full
0.55
0.6
3V
25°C
See Figure 17
0.37
3V
25°C
Full
V+
nA
15
nA
–50
50
Full
1.25
4.3
V
Full
0
0.8
V
Digital Control Inputs (IN1-2, IN3-4) (2)
Input logic high
VIH
Input logic low
VIL
Input leakage
current
(1)
(2)
6
IIH, IIL
VIN = 3.6 V or 0
25°C
Full
3.6 V
0.5
10
50
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A44159
TS3A44159
www.ti.com ......................................................................................................................................................... SCDS225A – MARCH 2007 – REVISED JUNE 2008
ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY (continued)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
20
38
UNIT
Dynamic
Turn-on time
tON
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Turn-off time
tOFF
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Break-before-make
time
tBBM
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF
Charge injection
QC
VGEN = 0,
RGEN = 0,
NC, NO
OFF capacitance
CNC(OFF),
CNO(OFF)
NC, NO
ON capacitance
COM
ON capacitance
Digital input
capacitance
25°C
3V
Full
3 V to
3.6 V
25°C
3V
Full
3 V to
3.6 V
40
14
34
35
ns
25°C
3V
3
Full
3 V to
3.6 V
2
CL = 1 nF
25°C
3V
109
pC
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 19
25°C
3V
51
pF
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 19
25°C
3V
162
pF
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 19
25°C
3V
162
pF
25°C
3V
2.5
pF
CI
VI = V+ or GND
11
ns
35
55
ns
Bandwidth
BW
RL = 50 Ω,
Switch ON
25°C
3V
35
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 100 kHz,
Switch OFF
25°C
3V
–71
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 100 kHz,
Switch ON
25°C
3V
–73
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz
25°C
3V
0.003
%
VI = V+ or GND,
Switch ON or OFF
Supply
Positive supply
current
I+
25°C
Full
3.6 V
0.015
0.2
0.7
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A44159
µA
7
TS3A44159
SCDS225A – MARCH 2007 – REVISED JUNE 2008 ......................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY (1)
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
Analog Switch
Analog signal
range
ON-state
resistance
ON-state
resistance match
between
channels
ON-state
resistance
flatness
VCOM,
VNO, VNC
ron
0
VNO or VNC = 1.8 V,
ICOM = –100 mA,
25°C
Full
0.45
2.3 V
ron(flat)
VNO or VNC = 1.8 V, 0.8 V, Switch ON,
ICOM = –100 mA,
See Figure 16
VNO or VNC = 1.8 V, 0.8 V
ICOM = –100 mA,
INO(OFF),
INC(OFF)
VNO or VNC = 0.3 V,
VCOM = 2.3 V,
or
VNO or VNC = 2.3 V,
VCOM = 0.3V,
NC, NO
ON leakage
current
INO(ON),
INC(ON)
VNO or VNC = 0.3 V,
VCOM = Open,
or
VNO or VNC = 2.3 V,
VCOM = Open,
ICOM(ON)
VNO or VNC = Open,
VCOM = 0.3 V,
or
VNO or VNC = Open,
VCOM = 2.3 V,
Switch ON,
See Figure 16
Full
0.045
2.3 V
0.06
2.3 V
25°C
See Figure 17
Full
2.7 V
25°C
See Figure 18
Full
25°C
See Figure 18
Full
–20
–10
2.7 V
0.1
Ω
nA
10
20
0.1
Ω
10
20
–20
–10
2.7 V
0.5
Ω
0.15
0.2
–10
V
0.07
0.1
25°C
Full
0.6
0.7
25°C
Δron
NC, NO
OFF leakage
current
COM
ON leakage
current
Switch ON,
See Figure 16
V+
nA
10
–20
20
nA
Digital Control Inputs (IN1-2, IN3-4) (2)
Input logic high
VIH
Full
1.2
4.3
V
Input logic low
VIL
Full
0
0.6
V
Input leakage
current
(1)
(2)
8
IIH, IIL
25°C
VIN = 3.6 V or 0
Full
2.7 V
0.5
10
50
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A44159
TS3A44159
www.ti.com ......................................................................................................................................................... SCDS225A – MARCH 2007 – REVISED JUNE 2008
ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY (continued)
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
2.6
47
UNIT
Dynamic
Turn-on time
tON
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Turn-off time
tOFF
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Break-beforemake time
tBBM
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF
Charge injection
QC
VGEN = 0,
RGEN = 0,
NC, NO
OFF capacitance
CNC(OFF),
CNO(OFF)
NC, NO
ON capacitance
COM
ON capacitance
Digital input
capacitance
25°C
2.5 V
Full
2.3 V to
2.7 V
25°C
2.5 V
Full
2.3 V to
2.7 V
50
16.5
34
35
ns
25°C
2.5 V
4
Full
2.3 V to
2.7 V
3
CL = 1 nF
25°C
2.5 V
84
pC
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 19
25°C
2.5 V
52
pF
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 19
25°C
2.5 V
163
pF
CCOM(ON)
VCOM = V+ or GND,
See Figure 19
25°C
2.5 V
163
pF
25°C
2.5 V
2.5
pF
CI
VI = V+ or GND
15
ns
35
35
ns
Bandwidth
BW
RL = 50 Ω,
Switch ON
25°C
2.5 V
35
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 100 kHz,
Switch OFF
25°C
2.5 V
–71
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 100 kHz,
Switch ON
25°C
2.5 V
–73
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz
25°C
2.5 V
0.009
%
VI = V+ or GND,
Switch ON or OFF
Supply
Positive supply
current
I+
25°C
Full
2.5 V
0.004
0.1
0.5
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Copyright © 2007–2008, Texas Instruments Incorporated
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µA
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TS3A44159
SCDS225A – MARCH 2007 – REVISED JUNE 2008 ......................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (1)
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
Analog Switch
Analog signal
range
ON-state
resistance
ON-state
resistance match
between
channels
ON-state
resistance
flatness
VCOM,
VNO, VNC
0
VNO or VNC = 1.5 V,
ICOM = –100 mA,
Switch ON,
See Figure 16
Δron
VNO or VNC = 1.5 V, 0.6 V
ICOM = –100 mA,
Switch ON,
See Figure 16
ron(flat)
VNO or VNC = 1.5 V, 0.6 V
1.5 V, 2.5 V,
ICOM = –100 mA,
Switch ON,
See Figure 16
ron
Full
0.5
1.65 V
INO(OFF),
INC(OFF)
VNO or VNC = 0.3 V,
VCOM = 1.65 V,
or
VNO or VNC = 1.65 V,
VCOM = 0.3 V,
NC, NO
ON leakage
current
INO(ON),
INC(ON)
VNO or VNC = 0.3 V,
VCOM = Open,
or
VNO or VNC = 1.65 V,
VCOM = Open,
ICOM(ON)
VNO or VNC = Open,
VCOM = 0.3V,
or
VNO or VNC = Open,
VCOM = 1.65 V,
0.05
1.65 V
Full
0.5
1.65 V
25°C
See Figure 17
1.95 V
Full
25°C
See Figure 18
25°C
See Figure 18
0.1
Ω
nA
10
20
0.1
Ω
10
20
–20
–10
1.95 V
Full
–20
–10
1.95 V
Full
0.5
Ω
0.7
0.8
–10
V
0.07
0.1
25°C
Full
0.7
0.8
25°C
NC, NO
OFF leakage
current
COM
ON leakage
current
25°C
V+
nA
10
–20
20
nA
Digital Control Inputs (IN1-2, IN3-4) (2)
Input logic high
VIH
Full
1
4.3
V
Input logic low
VIL
Full
0
0.4
V
Input leakage
current
(1)
(2)
10
IIH, IIL
VIN = 3.6 V or 0
25°C
Full
1.95 V
0.5
10
50
nA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (continued)
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
40
70
UNIT
Dynamic
Turn-on time
tON
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Turn-off time
tOFF
VCOM = V+,
RL = 50 Ω,
CL = 35 pF
Break-beforemake time
tBBM
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF
Charge injection
QC
VGEN = 0,
RGEN = 0,
NC, NO
OFF capacitance
CNC(OFF),
CNO(OFF)
NC, NO
ON capacitance
COM
ON capacitance
Digital input
capacitance
25°C
1.8 V
Full
1.65 V to
1.95 V
25°C
1.8 V
Full
1.65 V to
1.95 V
75
22
45
50
ns
25°C
1.8 V
5
Full
1.65 V to
1.95 V
4
CL = 1 nF
25°C
1.8 V
64
pC
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 19
25°C
1.8 V
52
pF
CNC(ON),
CNO(ON)
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 19
25°C
1.8 V
164
pF
CCOM(ON)
VCOM = V+ or GND,
Switch ON,
See Figure 19
25°C
1.8 V
164
pF
25°C
1.8 V
2.5
pF
CI
VI = V+ or GND
25
ns
70
75
ns
Bandwidth
BW
RL = 50 Ω,
Switch ON
25°C
1.8 V
35
MHz
OFF isolation
OISO
RL = 50 Ω,
f = 100 kHz,
Switch OFF
25°C
1.8 V
–71
dB
Crosstalk
XTALK
RL = 50 Ω,
f = 100 kHz,
Switch ON
25°C
1.8 V
–73
dB
Total harmonic
distortion
THD
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to
20 kHz
25°C
1.8 V
0.1
%
VI = V+ or GND,
Switch ON or OFF
Supply
Positive supply
current
I+
25°C
Full
1.95 V
0.001
0.05
0.15
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TYPICAL PERFORMANCE
0.70
TA = –40ºC
TA = 25ºC
TA = 85ºC
2.50
0.60
0.50
0.40
1.50
ron (Ω)
ron (Ω)
2.00
0.30
1.00
0.20
0.50
2.21
2.07
1.79
1.93
1.52
1.66
1.38
1.10
1.24
0.83
0.97
0.69
0.41
0.55
0.14
0.28
0.00
1.58
1.49
1.29
1.39
1.09
1.19
0.99
0.79
0.89
0.59
0.69
0.50
0.30
0.40
0.10
0.20
0.00
0.00
0.00
TA = –40ºC
TA = 25ºC
TA = 85ºC
0.10
VCOM (V)
VCOM (V)
Figure 1. ron vs VCOM
(V+ = 1.65 V)
Figure 2. ron vs VCOM
(V+ = 2.3 V)
0.45
0.60
0.40
0.50
0.35
0.30
ron (Ω)
0.30
0.25
0.20
0.15
0.20
0.10
TA = –40ºC
TA = 25ºC
TA = 85ºC
0.10
TA = –40ºC
TA = 25ºC
TA = 85ºC
0.05
4.13
3.87
3.35
3.61
3.10
2.84
2.58
2.06
2.32
1.81
1.55
1.29
0.77
VCOM (V)
VCOM (V)
Figure 3. ron vs VCOM
(V+ = 3 V)
Figure 4. ron vs VCOM
(V+ = 4.3 V)
1.80
200
1.65 V
1.60
1.8 V
2.3 V
150
2.5 V
3V
1.40
3.3 V
100
4.3 V
4.3 V
1.20
50
1.00
QC (pC)
ron (Ω)
1.03
0.00
2.88
2.70
2.52
2.34
2.16
1.98
1.80
1.62
1.44
1.26
1.08
0.90
0.72
0.54
0.36
0.18
0.00
0.26
0.00
0.00
0.52
ron (Ω)
0.40
0.80
0
–50
0.60
–100
0.40
–150
0.20
–200
VCOM (V)
1.58
1.49
1.39
1.29
1.19
1.09
0.99
0.89
0.79
0.69
0.59
0.50
0.40
0.30
0.20
0.10
0.00
0.00
–250
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.5 2.7 3.0 3.3 3.6 3.9 4.2 4.3
VCOM (V)
Figure 5. ron vs VCOM
(All Voltages)
12
Figure 6. Charge Injection (QC) vs VCOM
(TA = 25°C)
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TYPICAL PERFORMANCE (continued)
18
50
tON
tOFF
45
16
40
14
tON/tOFF (ns)
tON/tOFF (ns)
35
30
25
20
12
10
8
15
6
10
4
5
2
0
tON
tOFF
0
1.65
1.80
1.95
2.30
2.50
2.70
3.00
3.30
3.60
4.30
–40
25
85
Supply Voltage (V+)
Temperature (°C)
Figure 7. tON and tOFF vs Supply Voltage
(TA = 25°C)
Figure 8. tON and tOFF vs Temperature
(V+ = 4.3 V)
0
0
–10
–2
–20
–30
Attenuation (dB)
Gain (dB)
–4
–6
–8
–40
–50
–60
–70
–10
–80
–12
–14
100.0E+3
–90
–100
1.0E+6
10.0E+6
100.0E+6
100.0E+3
1.0E+9
1.0E+6
Frequency (Hz)
100.0E+6
1.0E+9
Frequency (Hz)
Figure 9. Bandwidth
Figure 10. OFF Isolation
0
0.160
–10
0.140
–20
0.120
–30
–40
0.100
–50
THD (%)
Attenuation (dB)
10.0E+6
–60
–70
–80
0.060
0.040
–90
100.0E+3
0.080
1.0E+6
10.0E+6
100.0E+6
1.0E+9
0.020
Frequency (Hz)
0.000
1
10
100
1000
10000
100000
Frequency (Hz)
Figure 11. Crosstalk
Figure 12. Total Harmonic Distortion vs Frequency
(V+ = 1.8 V)
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TYPICAL PERFORMANCE (continued)
0.012
0.0033
0.0032
0.010
THD (%)
0.0032
THD (%)
0.008
0.006
0.0031
0.0031
0.0030
0.0030
0.004
0.0029
0.002
0.0029
1
10
100
1000
10000
100000
Frequency (Hz)
0.000
1
10
100
1000
10000
100000
Frequency (Hz)
Figure 13. Total Harmonic Distortion vs Frequency
(V+ = 2.5 V)
0.004
Figure 14. Total Harmonic Distortion vs Frequency
(V+ = 3.3 V)
0.003
THD (%)
0.003
0.002
0.002
0.001
0.001
0.000
1
10
100
1000
10000
100000
Frequency (Hz)
Figure 15. Total Harmonic Distortion vs Frequency
(V+ = 4.3 V)
14
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PARAMETER MEASUREMENT INFORMATION
V+
VNC NC
COM
+
VCOM
VNO NO
Channel ON
r on =
VI
IN
ICOM
VCOM –VNO or VNC
W
I COM
VI = V IH or V IL
+
GND
Figure 16. ON-state Resistance (rON)
V+
VNC NC
COM
+
VCOM
+
VNO NO
IN
VI
OFF-State Leakage Current
Channel OFF
VI = V IH or V IL
+
GND
Figure 17. OFF-State Leakage Current
(INC(OFF), INC(PWROFF), INO(OFF), INO(PWROFF), ICOM(OFF), ICOM(PWROFF))
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PARAMETER MEASUREMENT INFORMATION (continued)
V+
VNC NC
COM
+
VCOM
VNO NO
VI
ON-State Leakage Current
Channel ON
VI = V IH or V IL
IN
+
GND
Figure 18. ON-State Leakage Current
(ICOM(ON), INC(ON), INO(ON))
V+
Capacitance
Meter
VNC
NC
VNO
NO
VBI AS = V + or GND
VI = V + or GND
VCOM COM
VBI AS
VI
Capacitance is measured at NC,
NO, COM, and IN inputs during
ON and OFF conditions.
IN
GND
Figure 19. Capacitance
(CI, CCOM(ON), CNC(OFF), CNO(OFF), CNC(ON), CNO(ON))
16
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PARAMETER MEASUREMENT INFORMATION (continued)
V+
VCOM
NC or NO
VNC or V NO
NC or NO
CL(2)
TEST
RL
CL
VCOM
tON
50 Ω
35 pF
V+
tOFF
50 Ω
35 pF
V+
COM
RL
IN
VI
CL(2)
RL
GND
(1)
V+
Logic
Input
(VI)
50%
50%
0
tON
tOFF
90%
90%
(VNC or V NO)
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 20. Turn-On (tON) and Turn-Off Time (tOFF)
V+
NC or NO
V+
Logic
Input
(VI)
VNC or V NO
VCOM
50%
0
COM
NC or NO
CL(2)
VI
Logic
Input(1)
90%
RL
90%
(VCOM)
IN
tBBM
VNC or VNO = V+
RL = 50 W
CL = 35 pF
GND
A.
CL includes probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
Figure 21. Break-Before-Make Time (tBBM)
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PARAMETER MEASUREMENT INFORMATION (continued)
V+
Network Analyzer
50 VNC
NC
Channel ON: NC to COM
COM
Source
Signal
VCOM
VI = V+ or GND
NO
Network Analyzer Setup
IN
VI
50 Source Power = 0 dBm
(632-mV P-P at 50- load)
+
GND
DC Bias = 350 mV
Figure 22. Bandwidth (BW)
V+
Network Analyzer
Channel OFF: NC to COM
50 VNC NC
VI = V + or GND
COM
Source
Signal
50 VCOM
NO
Network Analyzer Setup
IN
Source Power = 0 dBm
(632-mV P-P at 50- load)
VI
50 +
GND
DC Bias = 350 mV
Figure 23. OFF Isolation (OISO)
V+
Network Analyzer
Channel ON: NC to COM
50 VNC
Channel OFF: NO to COM
NC
VCOM
Source
Signal
VNO
NO
VI
50 +
VI = V+ or GND
50 IN
GND
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50- load)
DC Bias = 350 mV
Figure 24. Crosstalk (XTALK)
18
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PARAMETER MEASUREMENT INFORMATION (continued)
V+
RGEN
VGEN
OFF
ON
OFF V
IL
NC or NO
COM
+
VIH
Logic
Input
(VI)
VCOM
∆VCOM
VCOM
NC or NO
CL(2)
VI
VGEN = 0 to V+
IN
Logic
Input(1)
RGEN = 0
CL = 1 nF
QC = C L ×⋅∆VCOM
VI = V IH or V IL
GND
A.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B.
CL includes probe and jig capacitance.
Figure 25. Charge Injection (QC)
VI = V IH or V IL
Channel ON: COM to NO
VSOURCE = V+ P-P
Source Signal = 20 Hz to 20 kHz
RL = 600 W
CL = 50 pF
V+/2
V+
Audio Analyzer
RL
Source
Signal
10 mF
NO
10 mF
COM
600 W
600 W
CL(1)
VI
IN
GND
600 W
A.
CL includes probe and jig capacitance.
Figure 26. Total Harmonic Distortion (THD)
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PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TS3A44159PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
YC4159
TS3A44159PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
YC4159
TS3A44159RGTR
ACTIVE
QFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZWH
TS3A44159RGTRG4
ACTIVE
QFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZWH
TS3A44159RSVR
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
ZWH
TS3A44159RSVRG4
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ZWH
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Feb-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS3A44159PWR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TS3A44159RGTR
QFN
RGT
16
3000
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q2
TS3A44159RSVR
UQFN
RSV
16
3000
177.8
12.4
2.0
2.8
0.7
4.0
12.0
Q1
TS3A44159RSVR
UQFN
RSV
16
3000
180.0
12.4
2.1
2.9
0.75
4.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Feb-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3A44159PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
TS3A44159RGTR
QFN
RGT
16
3000
346.0
346.0
35.0
TS3A44159RSVR
UQFN
RSV
16
3000
202.0
201.0
28.0
TS3A44159RSVR
UQFN
RSV
16
3000
203.0
203.0
35.0
Pack Materials-Page 2
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