Download AMRDEC SDS ver 0.2 - ECE Louisville

UNIVERSITY OF LOUISVILLE
US Army AMRDEC
Fragment Scanning System
System Design Specification
Adam Anderson, Will Barrett, and Asato Tashiro
4/18/2013
Revision 2
This is the System Design Specification for the Fragment Scanning System to be developed for the US Army
AMRDEC.
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0.2 Table of Contents
1.0
System Description ........................................................................................................................... 3
1.1 System Interfaces ................................................................................................................................ 3
1.1.1 X-Ray Source ................................................................................................................................ 3
1.1.2 Sample.......................................................................................................................................... 4
1.1.3 Detector ....................................................................................................................................... 4
1.1.4 Image Processor ........................................................................................................................... 4
1.2 Major Components ............................................................................................................................. 4
1.2.1 X-Ray Source ................................................................................................................................ 4
1.2.2 Sample.......................................................................................................................................... 4
1.2.3 Detector ....................................................................................................................................... 4
1.2.4 Image Processor ........................................................................................................................... 4
2.0 Detailed Design ....................................................................................................................................... 5
2.1 X-Ray Source ....................................................................................................................................... 5
2.1.1 Flat Panel Detector ...................................................................................................................... 5
2.1.2 Image Processing Unit.................................................................................................................. 5
2.1.3 X-Ray Tube Support ..................................................................................................................... 5
2.1.4 Variable Aperture......................................................................................................................... 5
2.1.5 X-Ray High-Voltage Generator ..................................................................................................... 5
2.1.6 X-Ray Tube Unit............................................................................................................................ 5
2.2 Temperature Sensors .......................................................................................................................... 6
3.0 Principles of Operation ........................................................................................................................... 7
3.1 Moisture Sensors ................................................................................................................................ 7
3.2 Temperature Sensors .......................................................................................................................... 7
3.3 Control Board ...................................................................................................................................... 7
3.4 Power Transformer and Rectifier Circuit ............................................................................................ 8
3.5 Display and Data Management System ............................................... Error! Bookmark not defined.
3.5.1 DDMS Frame ................................................................................. Error! Bookmark not defined.
3.6 Voltage Buffer Daughter Card .............................................................. Error! Bookmark not defined.
4.0 Test Procedures ...................................................................................................................................... 8
4.1 Moisture Sensor Testing ..................................................................................................................... 8
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4.2 Temperature Sensor Testing ............................................................................................................... 9
5.0 Requirements Traceability ...................................................................................................................... 9
6.0 List of References .................................................................................................................................. 10
1.0 System Description
X-Ray
Source
Sample
Detector
Image
Processor
Figure 1: System Block Diagram
The system is a combination of an industrial radiography scanning system that will be operated via
a PC, and image analysis software. The user will expose the panels with the X-ray source. These
high-energy radiation photons will penetrate the panel and land onto the digital detector. This
detector will create a 2d image of the different materials located in the panel. The images will be
uploaded to the computer for image analysis. First the grayscale images are converted to a two
color binary image and then inverted to obtain the negative. The negative image is then analyzed
using image processing software that locates the X/Y coordinates, the area and perimeter of each
fragment.
1.1 System Interfaces
1.1.1 X-Ray Source
The X-Ray source will be used to expose the samples in order to “see” what is located inside.
This source will be able to pick up all types of metals including those that are nonferrous.
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1.1.2 Sample
The sample is placed on top of the flat panel detector where it is exposed to the X-Ray
source.
1.1.3 Detector
A digital X-Ray detector is used to create a 2D grayscale image of the panels. This detector
could capture an image at the size of 15” x 22”.
1.1.4 Image Processor
The images will be enhanced with software before being analyzed for location and size of
fragments imbedded into the panels.
1.2 Major Components
The system is composed of four major components: X-Ray source, samples, detector, and image
processor.
1.2.1 X-Ray Source
The X-ray source consists of a high energy electron source and X-ray target. This system emits
X-rays through excitation and collapse of the target’s atoms.
1.2.2 Sample
The samples are a medium-density fiber panel (similar to ceiling tiles) called Celotex. These
panels are 0.5” thick with the dimensions of 4’ x 8’. The reason that Celotex panels have
been chosen is because of their relatively low cost, availability at local hardware stores, and
fragment stopping power.
1.2.3 Detector
The detector captures the X-rays that have passed through the panel and the shadows
created by the shrapnel which blocks the X-rays.
1.2.4 Image Processor
The image process is divided into two parts. The first part of this process is the conversion of
the X-Rays into a digital image by the radiography software. The second is the image
processing programs that enhance and tabulate the fragment information.
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2.0 Detailed Design
2.1 X-Ray Source
The X-Ray source are COTS devices that can be purchased from any radiography medical
supplier. We used the Shimadzu RADspeed which has a X-Ray high-voltage generator that has a
rated output of 80kW and tube voltage from 40kV to 150kV.
2.1.1 Flat Panel Detector
Direct-conversion FPD, 16-bit grayscale (65,536 shades), 2880 x 2880 effective pixels, 432 mm x
432 mm effective field of view, and 150 μm pixel pitch.
2.1.2 Image Processing Unit
Radiographic image display: approx. 3 seconds after exposure Monitor: 15-inch color LCD touch
panel Functions: Auto density correction, grayscale processing, multi-frequency processing,
noise reduction DICOM 3.0 Compatibility: Print, Storage, MWM, and MPPS
2.1.3 X-Ray Tube Support
Vertical stroke: 160 cm control panel: 9-inch color LCD linkage with X-ray tube vertical
movement and rotation auto-positioning.
2.1.4 Variable Aperture
Auto collimator (auto/manual switchable)
2.1.5 X-Ray High-Voltage Generator
Rated output: 80 kW Tube voltage: 40 kV to 150 kV
2.1.6 X-Ray Tube Unit
0.6/1.2 mm focal point, 400 kHU, 12-degree target angle, 1-second startup time
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Figure 2: Shimadzu RAD – X-Ray Source
2.2 Sample
The sample is a 4 x 8 foot Celotex fiber panel, impregnated by fragments with fragments from
warhead testing. The fragments may be ferrous and nonferrous.
Figure 3: Celotex fiber panel
2.3 Detector
The detector is a Direct-conversion FPD, 16-bit grayscale (65,536 shades), 2880 x 2880 effective
pixels, 432 mm x 432 mm effective field of view, and 150 μm pixel pitch.
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Figure 4: Flat Panel Detector
2.4 Image Processor
3.0 Principles of Operation
3.1 X-Ray Source
The moisture sensors are to be operated by the controller. The controller will decide when to
poll the moisture sensors based on the display and data management system. When polled, the
moisture sensors will return a value to the controller’s analog to digital converter.
3.2 Sample
The temperature sensors are also to be operated by the controller. The controller will decide
when to poll the temperature sensors, and this action will ultimately be decided by the display
and data management system. When polled, the temperature sensors will return a value to the
controller’s analog to digital converter.
3.3 Detector
The main purpose of the control board is to provide a central interfacing hub for all the major
components involved in the system. It interfaces to the moisture and temperature sensors via
the analog to digital converters on the microcontroller unit, to the solenoid sprinkler valves via
the on-board relays, and to the display and data management system via the integrated RS-232.
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3.4 Image Processor
3.4.1 X-Ray Image Processing
The power transformer and rectifier circuit power both the solenoid sprinkler valves and the
control board. It supplies the necessary voltage and also supplies an optional 5 volts if desired
for expandability.
3.4.2 Post Image Processing
The circuit operates by using a power transformer to convert the wall power to 26.8 VAC. This is
distributed to the relays as necessary and also to the rectifier circuit. The rectifier circuit then
converts the 26.8 VAC to 20 VDC, which powers the control board.
4.0 Test Procedures
4.1 Ground Penetrating Radar
The ground penetrating radar used a 2000MHz antenna/receiver to view the subsurface, it did
so by pulsing thousands of frequencies in the RF/UF range. The antenna/receiver is dragged
across the surface of the fiber panel while pulsing through its frequency range. The razor thin
slices produce an image of the subsurface, showing objects as a distinct hyperbolic signature.
The slices are combined to recreate a 2D image of the area being scanned.
The panels were placed on a flat surface, and the 2000MHz antenna/receiver head was dragged
across the surface at intervals of a quarter of an inch. This interval was chosen because of the
resolution requirements of the project. The characteristics of the reflected signal yield
information on X/Y location, material composition, and size. That information is uploaded to an
excel file for analysis.
The ground penetrating radar proved to unsuccessful in testing. The resolution required in the
project requirements resulted in the need for an ultra-high frequency antenna. With the
frequencies pushed to the maximum, the depth penetration of the antenna was drastically
affected. Also, with the frequency set at such a high level, the receiver picked up the
imperfections in the fiber board, which appeared as fragments. Another reason for failure was
the method in which the system worked. At scanning intervals of a quarter of an inch, the
process was able to “overlook” fragments between the scan intervals. In order to get a complete
picture inside the panel, the scan intervals would be extremely small, increasing the analysis
time to unacceptable levels.
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4.2 Radiography
The software has a built in calibration algorithm that will calibrate the temperature sensors
based on two measure values and two actual values. The actual values will be gathered by an
infrared heat gun. The software will then be adjusted so that the measured temperature values
match the correct temperature. The software dialog used to calibrate the sensors is show in
Figure 34
For more details in the calibration algorithm see Appendix D.
5.0 Requirements Traceability
Requirement
Number
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
R16
R17
Requirements
Moisture sensors must be able to measure the
moisture content of soil.
The system must be able to read the moisture
sensor output.
The system must be able to interpret the
moisture sensor output.
The system must be able to compare the
moisture sensor output against the thresholds
There must be a minimum of 8 moisture
thresholds.
There must be a minimum of 2 temperature
sensors.
The temperature sensors must output the
correct values.
The system should log the moisture level of the
benches.
The system should log the temperature
readings.
The system should log when the benches were
watered.
The system should log how long the benches
were watered.
There must be a quick adjust feature to
simultaneously adjust all the watering times.
The system must use the sprinkler valves.
The system should run after a power outage.
The control board must support 10 sensors.
The control board must have 8 relays.
The control board must be able to
Test
Pass/Fail
T1, T2
Passed
T2
Passed
T2
Passed
T7, T3
Passed
T3
Passed
T3
Passed
T5, T6
Passed
T7, T3
Passed
T7, T3
Passed
T7, T3
Passed
T7, T3
Passed
T3
T4, T2
T8, T3
T4
T4
T4
Passed
Passed
Passed
Passed
Passed
Passed
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R18
R19
communicate with a PC via a serial cable.
There must be a weather-proof box to protect
the componants from dust, moisture, etc.
No more than two valves can be on at one
time.
Test Number
T1
T2
Tests
Preparing pots with optimal amounts of water.
Use digital multimeter to verify readouts.
T3
User test (the user will visually or electrically
verify the requirement).
T4
T5
T6
Datasheet.
Use infrared heat gun.
Use software calibration software.
T7
T8
T9
Use hardware simulator.
Unplugging the PC.
Junit testing.
T3
Passed
T9
Passed
Requirement
Fulfilled
R1
R1, R2, R3, R13
R4, R5, R6, R8,
R9, R10, R11,
R12, R14, R18
R13, R15, R16,
R17
R7
R7
R4, R8, R9, R10,
R11
R14
R19
6.0 List of References
[1] Mikroelektronica. Installing USB Drivers. [Online]. Available:
http://www.mikroe.com/eng/downloads/get/8/installing_usb_drivers_v101.pdf
[2] Mikroelektronica. MikroICD User Manual. [Online]. Available:
http://www.mikroe.com/eng/downloads/get/9/mikroicd_manual_v102.pdf
[3] Microchip. PIC18F2420/2520/4420/4520 Data Sheet. [Online]. Available:
http://ww1.microchip.com/downloads/en/DeviceDoc/39631a.pdf
[4] Mikroelektronica. PIC-PLC8A Dimensions. [Online]. Available:
http://www.mikroe.com/pdf/picplc8a_dimensions_v103.pdf
[5] N. Matic and Mikroelektronika. PIC-PLC8A Manual. [Online]. Available:
http://www.mikroe.com/pdf/picplc8a_manual_v101.pdf
[6] RainBird. CP-100-SS Installation Instructions. [Online]. Available:
http://www.rainbird.com/documents/diy/man_CP.pdf
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[7] RainBird. Tips on Installing and Maintaining Rain Bird Residential Valves. [Online]. Available:
http://www.rainbird.com/documents/diy/ValveInstallTips.pdf
[8] Vishay Semiconductors. Glass Passivated Single-Phase Bridge Rectifier. [Online]. Available:
http://www.vishay.com/docs/88609/gbl005.pdf
[9] National Semiconductors. LM117/LM317A/LM317 3-Terminal Adjustable Regulator. [Online].
Available: http://www.national.com/ds/LM/LM117.pdf
[10] Fairchild Semiconductors. LM78XX/LM78XXA 3-Terminal 1A Positive Voltage Regulator.
[Online]. Available: http://www.fairchildsemi.com/ds/LM%2FLM7805.pdf
[11] Fairchild Semiconductors. MJE3055T NPN Silicon Transistor. [Online]. Available:
http://hep.fi.infn.it/PAMELA/pdf/MJE3055.pdf
[12] Texas Instruments. TLC274, TLC274A, TLC274B, TLC274Y, TLC279 LinCMOSE PRECISION QUAD
OPERATIONAL AMPLIFIERS. [Online]. Available:
http://www.hep.upenn.edu/SNO/daq/parts/tlc274.pdf
[13] muRata. NTC Thermistors for Temperature Sensor Lead Insulation Type. [Online]. Available:
http://pdf.eicom.ru/datasheets/murata_pdfs/ntsd1_spec/ntsd1_spec.pdf
[14] Vegetronix. VH400 Soil Moisture Sensor Probes. [Online]. Available:
http://pdf.eicom.ru/datasheets/murata_pdfs/ntsd1_spec/ntsd1_spec.pdf
[15] FORWARD INDUSTRIAL COMPANY. FRM18 RELAY. [Online]. Available:
http://www.ficrelay.com.hk/details/FRM18.pdf
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