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Cray Innovation Barry Bolding, Ph.D. Director of Product Marketing, Cray [email protected] September 2008 Cray Utilizes the Best Processor Technologies. Cray and AMD have worked together in HPC since 2002. Cray currently delivering petascale XT5 systems. Cray “Baker” systems driving to multi-petaflops in 2010-2011 Cray advancing interconnect technologies. Cray and Intel formed a strategic partnership in HPC in 2008 Intel-Cray partnership blends complementary skills Intel has world’s best IC process, and very strong IC design capabilities Cray has brings excellence in system architecture, networking and software expertise in HPC July 17 HPCUser 2008 Slide 2 “Granite” The Cray Roadmap “Baker”+ Realizing Our Adaptive Supercomputing Vision “Marble” “Baker” Adaptive Systems Processing Flexibility Productivity Focus Cray XT5 & XT5h Cray XMT Cray XT4 Cascade Program Rainier Program Hybrid Systems Integrated Infrastructure High Efficiency Scalar Vector 7/6/2017 July 17 Multithreaded HPCUser 2008 Slide 3 The Cray Roadmap Socket G34 & Gemini Realizing Our Adaptive Supercomputing Vision The first Baker delivery * High Efficiency Cabinet “Baker”+ “Marble” “Baker” Cascade Program Adaptive Systems Processing Flexibility Productivity Focus Cray XT5 & XT5h Cray XMT Cray XT4 “Granite” Rainier Program Hybrid Systems Integrated Infrastructure High Efficiency Scalar Multiple Systems Shipped Vector 7/6/2017 July 17 Multithreaded HPCUser 2008 Slide 4 What does “Green” mean in HPC? Green in HPC means more computing in a fixed power envelope. Green in HPC means higher density Customers want more computer in less space Green is in the Total Cost of Ownership (TCO) Customers want fewer dollars diverted away from computing infrastructure. Green should be manageable No issues of condensation or leakage Easy Serviceability Green should be upgradeable Less landfill or recycling of components Green needs to be innovative Cray High Efficiency Cabinet with ECOphlex Technology (PHase change Liquid EXchange(PHLEX)) July 17 HPCUser 2008 Slide 5 ECOphlex Technology in the Cray High Efficiency Cabinet R134a piping Exit Evaporators Inlet Evaporator July 17 HPCUser 2008 Slide 6 The Cray High Efficiency Cabinet with ECOphlex Technology (PHase change Liquid EXchange(PHLEX)) Cray Momentum Executing on $250M DARPA HPCS contract Won majority of TI-08 program, NSF Track-2 system at UT 100TFLOPS350TF 20 50 119 263 TF ~1 PF 40 124 284 TFLOPS July 17 HPCUser 2008 Slide 8 Cray: Petascale and Beyond High Productivity Computing Systems Critical to National Security • Develop a new generation of economically viable high productivity computing systems for national security and industrial user communities (2011) • Ensure U.S. lead, dominance, and control in this critical technology Phase III Vendors: Mission Partners: Impact: • • • • Performance (time-to-solution): speedup by 10X to 40X Programmability (idea-to-first-solution): dramatically reduce cost and development time Portability (transparency): insulate software from system Robustness (reliability): continue operating in the presence of localized hardware failure, contain the impact of software defects, and minimize likelihood of operator error Applications: Weather Prediction Ocean/wave Forecasting Ship Design Climate Modeling Nuclear Stockpile Stewardship Weapons Integration Fill the Critical DoD Need for: Operational weather and ocean forecasting, weapons design and analysis, airborne contaminant modeling, cryptanalysis Cray Proprietary Information Providedintelligence/surveillance/reconnaissance, Under NDA July 17 Slide 10 Cray Cascade Project Cray High Productivity Computing Systems Scalable, High-Bandwidth Interconnect (Aries) Granite Granite Granite Granite Granite Granite Marble Marble Marble Marble Custom Compute Node Custom Compute Node Custom Compute Node Custom Compute Node Custom Compute Node Custom Compute Node x86 Compute Node x86 Compute Node x86 Compute Node x86 Compute Node Marble SIO Node Marble SIO Node Local Local Local Local Local Local Local Local Local Local Local Local Memory Memory Memory Memory Memory Memory Memory Memory Memory Memory Memory Memory Globally Addressable Memory Support for PGAS and DGAS Data Distributions Tightly integrated hybrid computing Configurable network, memory, processing and I/O Globally addressable memory Very high performance communication and synchronization July 17 HPCUser 2008 Slide 11 Thank You!