Download Shroff S.R. Rotary Institute of Chemical Technology, Vataria

SHROFF S.R. ROTARY
INSTITUTE OF CHEMICAL
TECHNOLOGY, VATARIA
(099)
ANALOG ELECTRONICS (2130902)
Enrolment no. - 130990109010
Operational Amplifier Basics - 2
 Types of Integrated Circuits
 Designations
 Packages
 Pin Configuration
 Power supplies
Types of Integrated
Circuits
• The two types of linear IC packages are
as follows:
1.Monolithic IC
2.Hybrid IC
Monolithic IC
• It is consist of transistor and some passive element.
• This element are fabricated on a one single chip.
• Chip is consist of semiconductor like silicon this
process is called “planar technology”.
• The word monolithic IC is a Greek word its meaning is
“SINGLE STONE”.
• It is by diffusion process and metallisation process.
• Isolation process is carried out by three process:1. Di-electric
2. Beam lead
3. PN junction
Advantages of Monolithic
IC
• It contains high thermal stability.
• All the component are integrated on the
one single chip.
• They are constructed very closer to each
other
Hybrid IC

Hybrid IC is consist of passive element and
the interconnected with the substract which
is used in integrated IC

It is also classified as thin film and thick film.

The active component (TRANSISTOR, DIODE
and MOOLITIC INTEGRATED CIRCUIT) is
connected to this circuit to complete this
circuit.
Advantages of Hybrid IC

The advantage of hybrid circuits is that
components which cannot be included in a
monolithic IC can be used, e.g., capacitors of
large value, wound components, crystals,
inductors.
Manufacturer’s
Designation for IC
In the united States alone there are well over 30
IC manufacturer’s producing millions of IC’s per
year.
 Each manufacturer uses a specific code and
assigns a specific type no to the IC’s it produces.
 That is, each manufacturer uses its own
identifying initials followed by its own type no.
 Ex. The 741 types of initially compensated Opamp was originally manufacture by Fairchild and
is sold as the μA741 where μA represents the
identifying initials used by Fairchild.


Initials used by some of the well-known
manufacturers of linear IC’s are as follows:
μA, μAF
National Semiconductor LM, LH, LF, TBA
Motorola
MC, MFC
RCA
CA, CD
Texas Instruments
SN
Burr-Brown
BB
Fairchild

In addition to producing their own IC’s, A no of
manufacturers also produces one another’s
popular IC’s.

Some manufacturers usually retain the original
type no of IC’s in their own IC designation.

Some Linier IC’s are available in Different
classes such as A,C,E,S etc.

For Ex. 741,741A,741C,741E,741S are different
versions of the same Op-amp.
Types of Packages
• The three types of linear IC packages are as
follows:
1.
The Flat Pack
2.
The Metal-can OR
Transistor Pack
3.
The Dual Inline
Package (DIP)
(Flat pack)
(Metal-can)
(DIP)
Flat Pack
The chip is enclosed in a
rectangular ceramic case with
terminal leads extending
through the sides & ends.
 8,10,14,&18 leads.
 Accomodate power supplies,
input, output & several special
corrections require to
complete the circuit.

Metal-can
The chip is encapsulated in a metal or plastic
case.
 3,5,8,10 or 12 pins.
Voltage regulator IC like :- LM117 – 3 pins
Power op-amp & audio power amplifiers - 5 pins
 Best suited for power amplifier cause metal as a
good heat conductor.
 Better decipation capability then the flat pack &
DIP packages.

Dual Inline Package
Mounted inside a
plastic or ceramic
case.
 Most widely used
package cause it can
mounted easily.
 Available with
8,12,14,16 & 20
pins.

(Base)
(DIP)
Pin Configuration of
Integrated Circuits
Pin 1 & 5 is Offset Null.
 Pin 2 is Input & connected with Inverting
terminal (V-).
 Pin 3 is Input & connected with Non-inverting
terminal (V+).
 Pin 4 is –Vcc.
 Pin 6 is Output.
 Pin 7 is +Vcc.
 Pin 8 is not connected & only used for special
operations.
