
LT6300 - 500mA, 200MHz xDSL Line Driver in
... has been optimized to provide sufficient headroom when operating from ±12V power supplies in full-rate ADSL applications. The LT6300 also allows for an adjustment of the operating current to minimize power consumption. In addition, the LT6300 is available in a small footprint surface mount package t ...
... has been optimized to provide sufficient headroom when operating from ±12V power supplies in full-rate ADSL applications. The LT6300 also allows for an adjustment of the operating current to minimize power consumption. In addition, the LT6300 is available in a small footprint surface mount package t ...
AD8106 数据手册DataSheet 下载
... The AD8106 and AD8107 are high speed, 16 × 5 video crosspoint switch matrices. They offer a −3 dB signal bandwidth greater than 260 MHz, and channel switch times of less than 25 ns with 1% settling. With −78 dB of crosstalk and −97 dB isolation (@ 5 MHz), the AD8106/AD8107 are useful in many high sp ...
... The AD8106 and AD8107 are high speed, 16 × 5 video crosspoint switch matrices. They offer a −3 dB signal bandwidth greater than 260 MHz, and channel switch times of less than 25 ns with 1% settling. With −78 dB of crosstalk and −97 dB isolation (@ 5 MHz), the AD8106/AD8107 are useful in many high sp ...
MAX9160 LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver General Description
... Pulse generator conditions for SE_IN input: frequency = 125MHz, 50% duty cycle, ZO = 50Ω, tR = 1.2ns, and tF = 1.2ns (20% to 80%), VOH = VCC, VOL = 0V. Pulse generator conditions for IN+, IN- input: frequency = 125MHz, 50% duty cycle, ZO = 50Ω, t R = 1ns, and t F = 1ns (20% to 80%). V ID , V CM as s ...
... Pulse generator conditions for SE_IN input: frequency = 125MHz, 50% duty cycle, ZO = 50Ω, tR = 1.2ns, and tF = 1.2ns (20% to 80%), VOH = VCC, VOL = 0V. Pulse generator conditions for IN+, IN- input: frequency = 125MHz, 50% duty cycle, ZO = 50Ω, t R = 1ns, and t F = 1ns (20% to 80%). V ID , V CM as s ...
General Description Features
... Lead Temperature (soldering, 10s).................................. +300°C ...
... Lead Temperature (soldering, 10s).................................. +300°C ...
Chapter 12 SIMPLIFIED QRO AMPLIFIER DESIGNS
... defective in some way? I had built them from the 1979 handbook linear amplifier plans. I had followed the winding instructions exactly using identical CWS (Amidon) 106-6 toroid cores. To test the 15 meter Chebyshev filter, I substituted it for the TVI low pass output filter on my working tuned Class ...
... defective in some way? I had built them from the 1979 handbook linear amplifier plans. I had followed the winding instructions exactly using identical CWS (Amidon) 106-6 toroid cores. To test the 15 meter Chebyshev filter, I substituted it for the TVI low pass output filter on my working tuned Class ...
AD7823 数据手册DataSheet 下载
... (convert start) signal at the end of a conversion, the AD7823 may be used in an automatic power-down mode. When used in this mode, the AD7823 powers down automatically at the end of a conversion and “wakes up” at the start of a new conversion. This feature significantly reduces the power consumption ...
... (convert start) signal at the end of a conversion, the AD7823 may be used in an automatic power-down mode. When used in this mode, the AD7823 powers down automatically at the end of a conversion and “wakes up” at the start of a new conversion. This feature significantly reduces the power consumption ...
FMS6502 8-Input, 6-Output Video Switch Matrix with Output Drivers,
... One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse. Changes in the data line during this time are interpreted as control signals. ...
... One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse. Changes in the data line during this time are interpreted as control signals. ...
FMS6502 8-Input, 6-Output Video Switch Matrix with Output Drivers
... One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse. Changes in the data line during this time are interpreted as control signals. ...
... One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse. Changes in the data line during this time are interpreted as control signals. ...
MAX13174E +5V Multiprotocol, Pin-Selectable Cable Terminator General Description
... 104Ω typical differential resistance and high-Z common-mode impedance. The MAX13170E's internal V.28 termination is disabled by opening S3. The V.11 specification allows for signals with commonmode variations of ±7V and differential signal amplitudes from 2V to 6V. The MAX13174E maintains terminatio ...
... 104Ω typical differential resistance and high-Z common-mode impedance. The MAX13170E's internal V.28 termination is disabled by opening S3. The V.11 specification allows for signals with commonmode variations of ±7V and differential signal amplitudes from 2V to 6V. The MAX13174E maintains terminatio ...
here - RAD 2012
... direct current source that simulate the output from ionizing radiation detectors. Range: 100 fA - 100 mA (uncertainty better than 0.05 %), depending of chamber type IEC 60731 Calibration: using method of direct measurement ...
... direct current source that simulate the output from ionizing radiation detectors. Range: 100 fA - 100 mA (uncertainty better than 0.05 %), depending of chamber type IEC 60731 Calibration: using method of direct measurement ...
LTC5541 - 1.3GHz to 2.3GHz High Dynamic Range Downconverting Mixer.
... Ground. These pins must be soldered to the RF ground plane on the circuit board. The exposed pad metal of the package provides both electrical contact to ground and good thermal contact to the printed circuit board. SHDN (Pin 5): Shutdown Pin. When the input voltage is less than 0.3V, the internal c ...
... Ground. These pins must be soldered to the RF ground plane on the circuit board. The exposed pad metal of the package provides both electrical contact to ground and good thermal contact to the printed circuit board. SHDN (Pin 5): Shutdown Pin. When the input voltage is less than 0.3V, the internal c ...
MAX9934T Evaluation Kit Evaluates: General Description Features
... x 1.5mm, 3 x 2-bump UCSP package (U1) and an 8-pin FMAX package (U2). The EV kit can also be used to evaluate the MAX9934F current-sense amplifier. Contact the factory to obtain free samples. See the Evaluating the MAX9934F section for more information. The device’s precision inputs measure very sma ...
... x 1.5mm, 3 x 2-bump UCSP package (U1) and an 8-pin FMAX package (U2). The EV kit can also be used to evaluate the MAX9934F current-sense amplifier. Contact the factory to obtain free samples. See the Evaluating the MAX9934F section for more information. The device’s precision inputs measure very sma ...
SKY65015-92LF 数据资料DataSheet下载
... SKY65015. The probe fixture comprises a very short coplanar waveguide (CPW) transmission line to pin 3 and an identical line to pin 6. All other pins of the amplifier are grounded. The CPW transmission lines are compatible with ground-signal-ground wafer probe tips, which can be connected to the RF ...
... SKY65015. The probe fixture comprises a very short coplanar waveguide (CPW) transmission line to pin 3 and an identical line to pin 6. All other pins of the amplifier are grounded. The CPW transmission lines are compatible with ground-signal-ground wafer probe tips, which can be connected to the RF ...
ADS805 数据资料 dataSheet 下载
... input configuration is the digitization of IF signals. The wide track-and-hold input bandwidth makes the ADS805 well suited for IF down conversion in both narrow and wideband applications. The ADS805 maintains excellent dynamic performance in multiple Nyquist regions covering a variety of IF frequen ...
... input configuration is the digitization of IF signals. The wide track-and-hold input bandwidth makes the ADS805 well suited for IF down conversion in both narrow and wideband applications. The ADS805 maintains excellent dynamic performance in multiple Nyquist regions covering a variety of IF frequen ...
ICS9DB202.pdf
... In these systems, a jitter-attenuating device may be necessary in order to reduce high frequency random and deterministic jitter components from the PLL synthesizer and from the system board. The ICS9DB202 has two PLL bandwidth modes. In low bandwidth mode, the PLL loop bandwidth is 500kHz. This set ...
... In these systems, a jitter-attenuating device may be necessary in order to reduce high frequency random and deterministic jitter components from the PLL synthesizer and from the system board. The ICS9DB202 has two PLL bandwidth modes. In low bandwidth mode, the PLL loop bandwidth is 500kHz. This set ...
MAX2654-56 - Maxim Integrated
... The MAX2654/MAX2655/MAX2656 high third-order intercept point (IP3), low-noise amplifiers (LNAs) are designed for applications in GPS, PCS, WLL, and satellite phone systems. The MAX2654/MAX2655/MAX2656 incorporate on-chip internal output matching to 50Ω, eliminating the need for external matching com ...
... The MAX2654/MAX2655/MAX2656 high third-order intercept point (IP3), low-noise amplifiers (LNAs) are designed for applications in GPS, PCS, WLL, and satellite phone systems. The MAX2654/MAX2655/MAX2656 incorporate on-chip internal output matching to 50Ω, eliminating the need for external matching com ...
AD8112 数据手册DataSheet 下载
... thermal impedance (θJA) is 40°C/W. For long-term reliability, the maximum allowed junction temperature of the plastic encapsulated die should not exceed 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the packa ...
... thermal impedance (θJA) is 40°C/W. For long-term reliability, the maximum allowed junction temperature of the plastic encapsulated die should not exceed 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the packa ...