IOSR Journal of VLSI and Signal Processing (IOSR-JVSP)
... and NOR gate by using transistor stacking technique. The logic gates are designed using 130nm technology parameter and are simulated using PSPICE. The input vector combinations are compared with the simulated result on the basis of propagation delay and power consumption. It is found that when the n ...
... and NOR gate by using transistor stacking technique. The logic gates are designed using 130nm technology parameter and are simulated using PSPICE. The input vector combinations are compared with the simulated result on the basis of propagation delay and power consumption. It is found that when the n ...
Section 2: Characterizing Components Using Lab Tools and LTSpice
... 2. Begin by adding an AC voltage source. To do this, press F2 on the keyboard and select ”voltage” from the list of options. Click OK to place the source on the new schematic. Once the voltage source has been placed on the schematic, right click on it and then click ”advanced” to bring up the option ...
... 2. Begin by adding an AC voltage source. To do this, press F2 on the keyboard and select ”voltage” from the list of options. Click OK to place the source on the new schematic. Once the voltage source has been placed on the schematic, right click on it and then click ”advanced” to bring up the option ...
Paper Title (use style: paper title)
... A 2:1 Multiplexer has been implemented using various adiabatic techniques and was compared with the conventional CMOS logic. Table.1 shows the average power dissipation of ECRL, PFAL, DFAL & CMOS based 2:1 Mux at different frequencies. It was observed that the power dissipation in DFAL, ECRL & PFAL ...
... A 2:1 Multiplexer has been implemented using various adiabatic techniques and was compared with the conventional CMOS logic. Table.1 shows the average power dissipation of ECRL, PFAL, DFAL & CMOS based 2:1 Mux at different frequencies. It was observed that the power dissipation in DFAL, ECRL & PFAL ...
Chapter06
... circuit, add the series resistances and combine the parallel resistances. In this diagram, R1 and R2 are in series, and R3 and R4 are in parallel. However, R2 is not in series with the parallel resistances: Resistances in series have the same current, but the current in R2 is equal to the sum of t ...
... circuit, add the series resistances and combine the parallel resistances. In this diagram, R1 and R2 are in series, and R3 and R4 are in parallel. However, R2 is not in series with the parallel resistances: Resistances in series have the same current, but the current in R2 is equal to the sum of t ...
Oscillators
... other two (perhaps 50 pF), and would give a considerable range of frequencies. The inductor was a 120 μH (shown as uH on schematics) ferrite core inductor I happened to have on hand. The 1 mH inductor in the source lead is a radio-frequency choke or RFC, designed to retain its inductance when a reas ...
... other two (perhaps 50 pF), and would give a considerable range of frequencies. The inductor was a 120 μH (shown as uH on schematics) ferrite core inductor I happened to have on hand. The 1 mH inductor in the source lead is a radio-frequency choke or RFC, designed to retain its inductance when a reas ...
![Lesson 3: [llel+llel] Parallel Circuits](http://s1.studyres.com/store/data/014097890_1-3c36e45d3295a1e9d71d4d9b7f7bb136-300x300.png)
Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small plate (""chip"") of semiconductor material, normally silicon. This can be made much smaller than a discrete circuit made from independent electronic components. ICs can be made very compact, having up to several billion transistors and other electronic components in an area the size of a fingernail. The width of each conducting line in a circuit can be made smaller and smaller as the technology advances; in 2008 it dropped below 100 nanometers, and has now been reduced to tens of nanometers.ICs were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using discrete electronic components. The integrated circuit's mass production capability, reliability and building-block approach to circuit design ensured the rapid adoption of standardized integrated circuits in place of designs using discrete transistors.ICs have two main advantages over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, packaged ICs use much less material than discrete circuits. Performance is high because the IC's components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. As of 2012, typical chip areas range from a few square millimeters to around 450 mm2, with up to 9 million transistors per mm2.Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of integrated circuits.