
White Paper on Installing and Maintaining Protective Relay Systems
... Station DC supply associated with protective functions (including station batteries, battery chargers, and non-battery-based dc supply) Control circuitry associated with protective functions through circuit breaker trip coils or other interrupting devices ...
... Station DC supply associated with protective functions (including station batteries, battery chargers, and non-battery-based dc supply) Control circuitry associated with protective functions through circuit breaker trip coils or other interrupting devices ...
Discussion on lightning impulse test procedure
... It is then no problem to obtain a sufficient wave-length, but the voltage across the inductance is very short. This is only a good test of the insulation strength to ground. On the other hand it must be considered that already low order harmonics of low impedance windings show a high frequency and a ...
... It is then no problem to obtain a sufficient wave-length, but the voltage across the inductance is very short. This is only a good test of the insulation strength to ground. On the other hand it must be considered that already low order harmonics of low impedance windings show a high frequency and a ...
r2 testing guideline
... R2 testing needs to be undertaken at both component level and system level, to ensure that the integrated behaviour of various plant and control systems is understood and captured. When derivation of model parameters would require sub-component level testing, such tests should be included in the tes ...
... R2 testing needs to be undertaken at both component level and system level, to ensure that the integrated behaviour of various plant and control systems is understood and captured. When derivation of model parameters would require sub-component level testing, such tests should be included in the tes ...
Reducing EMI in buck converters
... Due to the discontinuous nature of the buck converter input current and the fact that the supply lines to the converter are often quite long, the input loop A3 can radiate considerably or result in exceeding conducted emission levels in the conducted EMC measurements (150kHz ~ 30MHz band) To reduce ...
... Due to the discontinuous nature of the buck converter input current and the fact that the supply lines to the converter are often quite long, the input loop A3 can radiate considerably or result in exceeding conducted emission levels in the conducted EMC measurements (150kHz ~ 30MHz band) To reduce ...
E-Guide to Solving Today`s Semiconductor Device Characterization
... memory cells or a small array of cells, such as when isolated cells need to be tested in research and development or for process verification. Because the 4225-PMU can be used for both the pulsing and measurement, total test time is reduced. The Model 4225-PMU and the Model 4225-RPM Remote Amplifier ...
... memory cells or a small array of cells, such as when isolated cells need to be tested in research and development or for process verification. Because the 4225-PMU can be used for both the pulsing and measurement, total test time is reduced. The Model 4225-PMU and the Model 4225-RPM Remote Amplifier ...
Selecting a Littelfuse Varistor
... line can be drawn on the log - log, V-I characteristic as shown in Figure 3. The two curves intersect at the peak current value. The rated single pulse current, ITM, is the maximum allowable for a single pulse of 8/20µs exponential waveform (illustrated in Application Note AN9767, Figure 21). For lo ...
... line can be drawn on the log - log, V-I characteristic as shown in Figure 3. The two curves intersect at the peak current value. The rated single pulse current, ITM, is the maximum allowable for a single pulse of 8/20µs exponential waveform (illustrated in Application Note AN9767, Figure 21). For lo ...
CMOS Technology Logic Circuit Structures
... • Sensitive RF and analog circuit behavior (failure and/or degradation) based on the number of drivers switching at one time • Study various substrate contact and guard ring structures at different distances to isolate analog circuits from digital noise sources • Single devices, transmission lines, ...
... • Sensitive RF and analog circuit behavior (failure and/or degradation) based on the number of drivers switching at one time • Study various substrate contact and guard ring structures at different distances to isolate analog circuits from digital noise sources • Single devices, transmission lines, ...
DescoAsia.com
... transistor where the bond has melted is typical of surges from Inductors, Transformers, and Motors. ...
... transistor where the bond has melted is typical of surges from Inductors, Transformers, and Motors. ...
Modeling and Analysis of Differential Signaling for Minimizing
... cross-talk eects are substantial in long busses associated with 0.18 micron technology. Simulation experiments are then used to demonstrate that cross-talk in such high speed technologies is much better controlled by re-deploying interdigitated power lines to perform dierential signaling. 1 Introd ...
... cross-talk eects are substantial in long busses associated with 0.18 micron technology. Simulation experiments are then used to demonstrate that cross-talk in such high speed technologies is much better controlled by re-deploying interdigitated power lines to perform dierential signaling. 1 Introd ...
Electromagnetic Force Modification in Fault Current Limiters under
... force is calculated as the vector product of current density and magnetic field density as given in equation below [5, 12, 22]: ...
... force is calculated as the vector product of current density and magnetic field density as given in equation below [5, 12, 22]: ...
Understanding and Mitigating System-Level ESD and EOS
... able to protect against low-level system ESD and EOS events. Only high system-level ESD and EOS events were able to damage a Xilinx device installed on a board. Such events were usually readily recognized and eliminated. For advanced technology nodes, 28 nm and beyond, the component-level ESD immuni ...
... able to protect against low-level system ESD and EOS events. Only high system-level ESD and EOS events were able to damage a Xilinx device installed on a board. Such events were usually readily recognized and eliminated. For advanced technology nodes, 28 nm and beyond, the component-level ESD immuni ...
Circ.12 of 2002 Moderation of Practical Examinations for Technical
... Wiring of Capacitor start / Capacitor start and run starters Wiring of start-delta starters (Includes the automatic star-delta starter) ...
... Wiring of Capacitor start / Capacitor start and run starters Wiring of start-delta starters (Includes the automatic star-delta starter) ...
Testing in the Fourth Dimension
... Coupling Fault (CF): Transition in bit j causes unwanted change in bit i 2-Coupling Fault: Involves 2 cells, special case of k-Coupling Fault Must restrict k cells to make practical Inversion and Idempotent CFs -- special cases of 2-Coupling Faults Bridging and State Coupling Faults involve any # of ...
... Coupling Fault (CF): Transition in bit j causes unwanted change in bit i 2-Coupling Fault: Involves 2 cells, special case of k-Coupling Fault Must restrict k cells to make practical Inversion and Idempotent CFs -- special cases of 2-Coupling Faults Bridging and State Coupling Faults involve any # of ...
Electromagnetic compatibility

Electromagnetic compatibility (EMC) is the branch of electrical sciences which studies the unintentional generation, propagation and reception of electromagnetic energy with reference to the unwanted effects (electromagnetic interference, or EMI) that such energy may induce. The goal of EMC is the correct operation, in the same electromagnetic environment, of different equipment which use electromagnetic phenomena, and the avoidance of any interference effects.In order to achieve this, EMC pursues two different kinds of issues. Emission issues are related to the unwanted generation of electromagnetic energy by some source, and to the countermeasures which should be taken in order to reduce such generation and to avoid the escape of any remaining energies into the external environment. Susceptibility or immunity issues, in contrast, refer to the correct operation of electrical equipment, referred to as the victim, in the presence of unplanned electromagnetic disturbances.Interference mitigation and hence electromagnetic compatibility is achieved by addressing both emission and susceptibility issues, i.e., quieting the sources of interference and hardening the potential victims. The coupling path between source and victim may also be separately addressed to increase its attenuation.