FSL156MRBN Green-Mode Fairchild Power Switch (FPS™)
... (such as the FOD817) and shunt regulator (such as the KA431) are typically used to implement the feedback network. Comparing the feedback voltage with the voltage across the RSENSE resistor makes it possible to control the switching duty cycle. When the reference pin voltage of the shunt regulator e ...
... (such as the FOD817) and shunt regulator (such as the KA431) are typically used to implement the feedback network. Comparing the feedback voltage with the voltage across the RSENSE resistor makes it possible to control the switching duty cycle. When the reference pin voltage of the shunt regulator e ...
Simple temperature measurement using a PT100 loop
... connected to a multitude of control or monitoring equipment. The temperature transmitter’s (4 to 20) mA output current will be configured to represent a range of temperature from the PT100 probe. For example a temperature range of (0 to 100) °C can be represented by (4 to 20) mA by the output of the ...
... connected to a multitude of control or monitoring equipment. The temperature transmitter’s (4 to 20) mA output current will be configured to represent a range of temperature from the PT100 probe. For example a temperature range of (0 to 100) °C can be represented by (4 to 20) mA by the output of the ...
MAX258 500mA, Push-Pull Transformer Driver for Isolated Power
... Transformer selection for the MAX258 can be simplified by the use of the ET product. The ET product relates the maximum allowable magnetic flux density in a transformer core to the voltage across a winding and switching period. Inductor magnetizing current in the primary winding changes linearly wit ...
... Transformer selection for the MAX258 can be simplified by the use of the ET product. The ET product relates the maximum allowable magnetic flux density in a transformer core to the voltage across a winding and switching period. Inductor magnetizing current in the primary winding changes linearly wit ...
DATA SHEET PMEGXX10BEA; PMEGXX10BEV
... any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolu ...
... any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolu ...
Protection components - Elektronický katalog Schneider Electric
... Checking the PTC thermistor probes for correct operation With the machine stopped, in the cold state and after having taken all the necessary safety precautions: b disconnect the line linking the thermistors to the LT3 S protection unit, at the terminals of the machine being protected: motor, etc., ...
... Checking the PTC thermistor probes for correct operation With the machine stopped, in the cold state and after having taken all the necessary safety precautions: b disconnect the line linking the thermistors to the LT3 S protection unit, at the terminals of the machine being protected: motor, etc., ...
AD596 数据手册DataSheet 下载
... to changes in ambient or device temperatures. This is typically 0.02°C/°C over the +25°C to +100°C recommended ambient temperature range. The parts will operate over the extended ambient temperature ranges from –55°C to +125°C, but thermocouple nonlinearity at the reference junction will degrade the ...
... to changes in ambient or device temperatures. This is typically 0.02°C/°C over the +25°C to +100°C recommended ambient temperature range. The parts will operate over the extended ambient temperature ranges from –55°C to +125°C, but thermocouple nonlinearity at the reference junction will degrade the ...
AN3964
... the previous silicon revisions “Y” (cut 1.1) and “X” (cut 1.2). The factory calibration data are tested for validity when the example application is initialized. If data is present in the memory, it is used for temperature calculation. Otherwise, the user calibration data stored during user calibrat ...
... the previous silicon revisions “Y” (cut 1.1) and “X” (cut 1.2). The factory calibration data are tested for validity when the example application is initialized. If data is present in the memory, it is used for temperature calculation. Otherwise, the user calibration data stored during user calibrat ...
ICS854S01I Datasheet - Integrated Device Technology
... NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached ...
... NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached ...
Specification Status: Released PolyZen GENERAL DESCRIPTION
... Zener diode is thermally coupled to a resistively non-linear, polymer PTC (positive temperature coefficient) layer. This PTC layer is fully integrated into the device, and is electrically in series between VIN and the diode clamped VOUT. This advanced PTC layer responds to either extended diode heat ...
... Zener diode is thermally coupled to a resistively non-linear, polymer PTC (positive temperature coefficient) layer. This PTC layer is fully integrated into the device, and is electrically in series between VIN and the diode clamped VOUT. This advanced PTC layer responds to either extended diode heat ...
PAM2808 Description Pin Assignments
... 4.7µF minimum value capacitor from VO to GND is also required. To improve transient response, noise rejection, and ripple rejection, an additional 10μF or larger, low ESR capacitor is recommended at the output. A higher-value, low ESR output capacitor may be necessary if large, fast-rise-time load t ...
... 4.7µF minimum value capacitor from VO to GND is also required. To improve transient response, noise rejection, and ripple rejection, an additional 10μF or larger, low ESR capacitor is recommended at the output. A higher-value, low ESR output capacitor may be necessary if large, fast-rise-time load t ...
DEVELOPMENT OF A SUSPENDED, ROBUST, THERMALLY INSULATED
... infrared imaging. The devices presented here have been fabricated to confirm process parameters and device design. It is evident that 525 µm thick wafers can not be used since etching of high-aspect-ratio trenches of those depths is very hard, or even impossible. Thinner wafers must be used or even ...
... infrared imaging. The devices presented here have been fabricated to confirm process parameters and device design. It is evident that 525 µm thick wafers can not be used since etching of high-aspect-ratio trenches of those depths is very hard, or even impossible. Thinner wafers must be used or even ...
P11 Series - Allied Electronics
... Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction (e.g. use a metal oxide varistor for limitation of overvoltage condition). This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. ...
... Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction (e.g. use a metal oxide varistor for limitation of overvoltage condition). This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. ...
BSP75N 60V self-protected low-side Intellifet MOSFET switch Summary
... The overtemperature protection circuit trips at a minimum of 150°C. So the available package dissipation reduces as the maximum required ambient temperature increases. This leads to the following maximum recommended continuous operating currents. ...
... The overtemperature protection circuit trips at a minimum of 150°C. So the available package dissipation reduces as the maximum required ambient temperature increases. This leads to the following maximum recommended continuous operating currents. ...
Thermal runaway
Thermal runaway refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback.In other words, ""thermal runaway"" describes a process which is accelerated by increased temperature, in turn releasing energy that further increases temperature. In chemistry (and chemical engineering), this risk is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation, although exothermic chemical reactions can be of concern here too. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar mass stars, the ""helium flash"".There are also concerns regarding global warming that a global average increase of 3-4 degrees Celsius above the preindustrial baseline could lead to a further unchecked increase in surface temperatures. For example, releases of methane, a greenhouse gas more potent than CO2, from wetlands, melting permafrost and continental margin seabed clathrate deposits could be subject to positive feedback.