SiP32419/29 Datasheet
... The device does not require an output capacitor for proper operation. A proper value COUT is recommended to accommodate load transient per circuit design requirements. There are no ESR or capacitor type requirements. Over Temperature Shutdown In case an over temperature event happens, the SiP32419 ...
... The device does not require an output capacitor for proper operation. A proper value COUT is recommended to accommodate load transient per circuit design requirements. There are no ESR or capacitor type requirements. Over Temperature Shutdown In case an over temperature event happens, the SiP32419 ...
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... † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to ...
... † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to ...
SiP32419/29 Datasheet
... The device does not require an output capacitor for proper operation. A proper value COUT is recommended to accommodate load transient per circuit design requirements. There are no ESR or capacitor type requirements. Over Temperature Shutdown In case an over temperature event happens, the SiP32419 ...
... The device does not require an output capacitor for proper operation. A proper value COUT is recommended to accommodate load transient per circuit design requirements. There are no ESR or capacitor type requirements. Over Temperature Shutdown In case an over temperature event happens, the SiP32419 ...
AD7933 数据手册DataSheet下载
... The AD7933/AD7934 are 10-bit and 12-bit, high speed, low power, successive approximation (SAR) analog-to-digital converters (ADCs). The parts operate from a single 2.7 V to 5.25 V power supply and feature throughput rates up to 1.5 MSPS. The parts contain a low noise, wide bandwidth, differential tr ...
... The AD7933/AD7934 are 10-bit and 12-bit, high speed, low power, successive approximation (SAR) analog-to-digital converters (ADCs). The parts operate from a single 2.7 V to 5.25 V power supply and feature throughput rates up to 1.5 MSPS. The parts contain a low noise, wide bandwidth, differential tr ...
BDTIC www.BDTIC.com/infineon Application Note No. 067
... The device’s 3 dB bandwidth covers DC up to 2.7 GHz with a typical gain of 18.5 dB at 1 GHz. The BGA614 is matched to 50 Ω and is unconditionally stable over the entire frequency range. At a device current of 40 mA the MMIC has an output 1 dB compression point of +12 dBm. At this same DC operating p ...
... The device’s 3 dB bandwidth covers DC up to 2.7 GHz with a typical gain of 18.5 dB at 1 GHz. The BGA614 is matched to 50 Ω and is unconditionally stable over the entire frequency range. At a device current of 40 mA the MMIC has an output 1 dB compression point of +12 dBm. At this same DC operating p ...
LOC05b Resistors in Series and Parallel
... parallel across a power supply as shown in Figure 4, the potential difference across each resistor is equal to that supplied by the power supply. What about the current? A current I flows out of the power supply. Let I 1 be the current flowing through R1 and let I 2 be the current flowing through R2 ...
... parallel across a power supply as shown in Figure 4, the potential difference across each resistor is equal to that supplied by the power supply. What about the current? A current I flows out of the power supply. Let I 1 be the current flowing through R1 and let I 2 be the current flowing through R2 ...
LOC12a Resistors in Series and Parallel
... parallel across a power supply as shown in Figure 4, the potential difference across each resistor is equal to that supplied by the power supply. What about the current? A current I flows out of the power supply. Let I 1 be the current flowing through R1 and let I 2 be the current flowing through R2 ...
... parallel across a power supply as shown in Figure 4, the potential difference across each resistor is equal to that supplied by the power supply. What about the current? A current I flows out of the power supply. Let I 1 be the current flowing through R1 and let I 2 be the current flowing through R2 ...
PCA9518A 1. General description Expandable 5-channel I
... using the expansion pins. The PCA9518A is a wider voltage range (2.3 V to 3.6 V) version of the PCA9518 and also improves partial power-down performance, keeping I2C-bus I/O pins in high-impedance state when VDD is below 2.0 V. A PCA9518 cluster cannot be put in series with a PCA9515/16 or with anot ...
... using the expansion pins. The PCA9518A is a wider voltage range (2.3 V to 3.6 V) version of the PCA9518 and also improves partial power-down performance, keeping I2C-bus I/O pins in high-impedance state when VDD is below 2.0 V. A PCA9518 cluster cannot be put in series with a PCA9515/16 or with anot ...
FDDS10H04A_F085A Smart High Side Switch F DDS10H04A_F085A Sm
... RI=2, RL=1, td=400ms, IN=Low o rHigh Load current (Short-circuit current) ...
... RI=2, RL=1, td=400ms, IN=Low o rHigh Load current (Short-circuit current) ...
three phase automatic voltage regulator
... These have rows of triacs on heat sinks and resistors on sub-PCBs. A ‘comb’ shaped item is used to support these heat sinks during transit. Remove them before use so as to maximize air flow. ...
... These have rows of triacs on heat sinks and resistors on sub-PCBs. A ‘comb’ shaped item is used to support these heat sinks during transit. Remove them before use so as to maximize air flow. ...
PTN3360D 1. General description Enhanced performance HDMI/DVI level shifter with active DDC
... HVQFN48 package supply ground is connected to both GND pins and exposed center pad. GND pins and the exposed center pad must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board usi ...
... HVQFN48 package supply ground is connected to both GND pins and exposed center pad. GND pins and the exposed center pad must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board usi ...
Transistor–transistor logic
Transistor–transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT) and resistors. It is called transistor–transistor logic because both the logic gating function (e.g., AND) and the amplifying function are performed by transistors (contrast with RTL and DTL).TTL is notable for being a widespread integrated circuit (IC) family used in many applications such as computers, industrial controls, test equipment and instrumentation, consumer electronics, synthesizers, etc. The designation TTL is sometimes used to mean TTL-compatible logic levels, even when not associated directly with TTL integrated circuits, for example as a label on the inputs and outputs of electronic instruments.After their introduction in integrated circuit form in 1963 by Sylvania, TTL integrated circuits were manufactured by several semiconductor companies, with the 7400 series (also called 74xx) by Texas Instruments becoming particularly popular. TTL manufacturers offered a wide range of logic gate, flip-flops, counters, and other circuits. Several variations from the original bipolar TTL concept were developed, giving circuits with higher speed or lower power dissipation to allow optimization of a design. TTL circuits simplified design of systems compared to earlier logic families, offering superior speed to resistor–transistor logic (RTL) and easier design layout than emitter-coupled logic (ECL). The design of the input and outputs of TTL gates allowed many elements to be interconnected.TTL became the foundation of computers and other digital electronics. Even after much larger scale integrated circuits made multiple-circuit-board processors obsolete, TTL devices still found extensive use as the ""glue"" logic interfacing more densely integrated components. TTL devices were originally made in ceramic and plastic dual-in-line (DIP) packages, and flat-pack form. TTL chips are now also made in surface-mount packages. Successors to the original bipolar TTL logic often are interchangeable in function with the original circuits, but with improved speed or lower power dissipation.