MAX6690 2°C Accurate Remote/Local Temperature Sensor with SMBus Serial Interface General Description
... yields the best thermal response times. Take care to account for thermal gradients between the heat source and the sensor, and ensure that stray air currents across the sensor package do not interfere with measurement accuracy. When measuring the temperature of a CPU or other IC with an on-chip sens ...
... yields the best thermal response times. Take care to account for thermal gradients between the heat source and the sensor, and ensure that stray air currents across the sensor package do not interfere with measurement accuracy. When measuring the temperature of a CPU or other IC with an on-chip sens ...
— Shielded Gate PowerTrench® AN-4163 MOSFET Datasheet Explanation Introduction
... the VGS is decreased from 10 VGS to 5 VGS at 60 A of ID, the RDS(on) increases three times, which can be translated to 18.9 mΩ (3 times 6.3 mΩ) and the maximum ID is saturated at around 60 A with 5 VGS due to the increased RDS(on). Figure 3 shows the normalized drain-to-source on resistance accordin ...
... the VGS is decreased from 10 VGS to 5 VGS at 60 A of ID, the RDS(on) increases three times, which can be translated to 18.9 mΩ (3 times 6.3 mΩ) and the maximum ID is saturated at around 60 A with 5 VGS due to the increased RDS(on). Figure 3 shows the normalized drain-to-source on resistance accordin ...
Methods of thermoelectric enhancement in silicon
... thermal gradient across the couple generates a thermoelectric voltage, sourcing a current through the load. ...
... thermal gradient across the couple generates a thermoelectric voltage, sourcing a current through the load. ...
Itelco-RLC-Cap. 01
... RLC Series chillers are manufactured to the most stringent design and construction standards to ensure high performance, reliability and adaptability to all types of air conditioning installations. The unit is intended for cooling water (and heating water in the case of heat recovery chillers of tho ...
... RLC Series chillers are manufactured to the most stringent design and construction standards to ensure high performance, reliability and adaptability to all types of air conditioning installations. The unit is intended for cooling water (and heating water in the case of heat recovery chillers of tho ...
SK6812MINI
... Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin of not. Do not clean the LEDs by the ultrasonic. When it is absolutely n ...
... Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin of not. Do not clean the LEDs by the ultrasonic. When it is absolutely n ...
CLASSICAL SOLUTION OF 1st and 2nd ORDER DEQ`S OBTAINED
... overall forcing function that has additional terms of V IN or V IN . Keep in mind that V IN is a known and one would use superposition to handle these cases. In general the approach taken to solve, is to obtain the forced response and the natural response. The total response is the sum of the two. T ...
... overall forcing function that has additional terms of V IN or V IN . Keep in mind that V IN is a known and one would use superposition to handle these cases. In general the approach taken to solve, is to obtain the forced response and the natural response. The total response is the sum of the two. T ...
A Broad Range of Electronic Materials Solutions Deliver
... specific application requirements. Visitors to the Henkel booth can learn more about award-winning Gap Pad thermal interface materials, which deliver excellent conformability, low stress and effective thermal control. For processes that require automated, high-volume solutions in addition challengin ...
... specific application requirements. Visitors to the Henkel booth can learn more about award-winning Gap Pad thermal interface materials, which deliver excellent conformability, low stress and effective thermal control. For processes that require automated, high-volume solutions in addition challengin ...
Basic Laws
... Conductors (e.g. Wires) have very low resistance (<0.1 Ω), which is usually be neglected (i.e. We will assume that wires have zero resistance). Insulators (e.g. air) have very large resistance (>50 MΩ) that can be usually ignored ( omitted from circuit for analysis). Resistors have a medium range of ...
... Conductors (e.g. Wires) have very low resistance (<0.1 Ω), which is usually be neglected (i.e. We will assume that wires have zero resistance). Insulators (e.g. air) have very large resistance (>50 MΩ) that can be usually ignored ( omitted from circuit for analysis). Resistors have a medium range of ...
A Coupled Electromagnetic and Thermal Model for
... of volumetric heat generation within the rotating disk layers, which serves as an input to the HT model. The HT model includes only the rotating disk, not the flying head. The top PFPE lubrication is also excluded from the HT model because of its small thickness. The disk substrate is fused silica w ...
... of volumetric heat generation within the rotating disk layers, which serves as an input to the HT model. The HT model includes only the rotating disk, not the flying head. The top PFPE lubrication is also excluded from the HT model because of its small thickness. The disk substrate is fused silica w ...
A Coupled Electromagnetic Ion-Hong Chao
... of volumetric heat generation within the rotating disk layers, which serves as an input to the HT model. The HT model includes only the rotating disk, not the flying head. The top PFPE lubrication is also excluded from the HT model because of its small thickness. The disk substrate is fused silica w ...
... of volumetric heat generation within the rotating disk layers, which serves as an input to the HT model. The HT model includes only the rotating disk, not the flying head. The top PFPE lubrication is also excluded from the HT model because of its small thickness. The disk substrate is fused silica w ...
TB5R1 数据资料 dataSheet 下载
... high-K boards, covered by EIA/JESD51-3 and EIA/JESD51-7 respectively. Figure 10 shows the low-K and high-K values of θJA versus air flow for this device and its package options. The standardized θJA values may not accurately represent the conditions under which the device is used. This can be due to ...
... high-K boards, covered by EIA/JESD51-3 and EIA/JESD51-7 respectively. Figure 10 shows the low-K and high-K values of θJA versus air flow for this device and its package options. The standardized θJA values may not accurately represent the conditions under which the device is used. This can be due to ...
If 4.7 ´ 1016 electrons pass a particular point in a wire every second
... B. If the resistance of resistor B is R, what is the resistance of A? ...
... B. If the resistance of resistor B is R, what is the resistance of A? ...
AN-9021 A Novel IGBT Inverter Module for Low
... The power carrying potential of a device is dependent on the heat transfer capability of the device. The SPM provides not only good thermal performance but also operating frequency options in accordance with the application. 1. Thermal resistance For a heat-sink attached device, the major thermal pa ...
... The power carrying potential of a device is dependent on the heat transfer capability of the device. The SPM provides not only good thermal performance but also operating frequency options in accordance with the application. 1. Thermal resistance For a heat-sink attached device, the major thermal pa ...
Lumped element model
The lumped element model (also called lumped parameter model, or lumped component model) simplifies the description of the behaviour of spatially distributed physical systems into a topology consisting of discrete entities that approximate the behaviour of the distributed system under certain assumptions. It is useful in electrical systems (including electronics), mechanical multibody systems, heat transfer, acoustics, etc.Mathematically speaking, the simplification reduces the state space of the system to a finite dimension, and the partial differential equations (PDEs) of the continuous (infinite-dimensional) time and space model of the physical system into ordinary differential equations (ODEs) with a finite number of parameters.