KV5x High Speed ADC Design Reference Manual
... Use bulk capacitors and bypass capacitors close to the MCU pins. Bypass capacitors are the reservoir for the instantaneous switching current required by the MCU and filter out noise at the pins of the MCU. The capacitors should be physically close to the pins. The further away they are, the less eff ...
... Use bulk capacitors and bypass capacitors close to the MCU pins. Bypass capacitors are the reservoir for the instantaneous switching current required by the MCU and filter out noise at the pins of the MCU. The capacitors should be physically close to the pins. The further away they are, the less eff ...
XRD98L59ZGEVAL Evaluation System User Manual
... described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the informat ...
... described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the informat ...
GPS TRACKER – Designing and prototyping hardware and software Bachelor’s Thesis (UAS)
... The thesis is divided into 2 main parts: hardware and software. The hardware part consists of dividing the project into modules which are explained in detail. Then, the design part describes the tools required to produce a schematic representation and also give information about basic electronics co ...
... The thesis is divided into 2 main parts: hardware and software. The hardware part consists of dividing the project into modules which are explained in detail. Then, the design part describes the tools required to produce a schematic representation and also give information about basic electronics co ...
MAX16839 Evaluation Kit Evaluates: General Description Features
... the three channels. Each PWM input accepts a digital signal up to 10kHz at the DIM1, DIM2, or DIM3 and GND PCB pads. Additionally, each PWM input functions as an active-high enable for the corresponding channel. Multiple EV kits can be cascaded using the FLTS1, FLTS2, FLTS3, and GND PCB pads and con ...
... the three channels. Each PWM input accepts a digital signal up to 10kHz at the DIM1, DIM2, or DIM3 and GND PCB pads. Additionally, each PWM input functions as an active-high enable for the corresponding channel. Multiple EV kits can be cascaded using the FLTS1, FLTS2, FLTS3, and GND PCB pads and con ...
TPS65950/30/20 32 KHz Oscillator Schematic and PCB Layout
... 4. Avoid long connections to the crystal and to the load capacitor that create a large loop on the PCB or that pass under the uBGA package. 5. Use a short connection between the two crystal load capacitors and route the common connection to the oscillator ground reference. 6. Place a ceramic capacit ...
... 4. Avoid long connections to the crystal and to the load capacitor that create a large loop on the PCB or that pass under the uBGA package. 5. Use a short connection between the two crystal load capacitors and route the common connection to the oscillator ground reference. 6. Place a ceramic capacit ...
EMI EMC Considerations for Energy Meters Application Note
... bias voltages. The voltage difference between back planes and front planes becomes more prone to noise and produces incorrect results. Segmented LCDs may have 20 to 30 lines running in parallel from the driver to the LCD glass thereby making the LCD interface sensitive to external noise. The followi ...
... bias voltages. The voltage difference between back planes and front planes becomes more prone to noise and produces incorrect results. Segmented LCDs may have 20 to 30 lines running in parallel from the driver to the LCD glass thereby making the LCD interface sensitive to external noise. The followi ...
Evaluate: MAX9987/MAX9988 MAX9987/MAX9988 Evaluation Kits General Description Features
... high-VSWR loads, do not turn on DC power or RF signal generators until all connections are made. 1) Calibrate the power meter at 900MHz for the MAX9987, or at 1800MHz for the MAX9988. Important: Use a power sensor rated to at least 0dBm. Measure the loss in the 20dB attenuator (pad) that will be con ...
... high-VSWR loads, do not turn on DC power or RF signal generators until all connections are made. 1) Calibrate the power meter at 900MHz for the MAX9987, or at 1800MHz for the MAX9988. Important: Use a power sensor rated to at least 0dBm. Measure the loss in the 20dB attenuator (pad) that will be con ...
AN-1876 LM2841 Evaluation Board (Rev. C)
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain t ...
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain t ...
High Current Voltage Regulator Module Employs Novel
... contact pads that can be soldered directly to the PCB. The copper 'can' forms the drain connection from the other side of the die to the board (See Fig. 1). A proprietary passivation system on the silicon die isolates the gate and the source pads to prevent shorting and acts as a solder mask when th ...
... contact pads that can be soldered directly to the PCB. The copper 'can' forms the drain connection from the other side of the die to the board (See Fig. 1). A proprietary passivation system on the silicon die isolates the gate and the source pads to prevent shorting and acts as a solder mask when th ...
Simplified Guide to Understanding SCCR
... maximum level of short-circuit current that the component or assembly can withstand and is used for determining compliance with NEC® 110.10.This rating can be marked on individual components or assemblies. Assembly ratings take into account all components contained within the equipment. A common mis ...
... maximum level of short-circuit current that the component or assembly can withstand and is used for determining compliance with NEC® 110.10.This rating can be marked on individual components or assemblies. Assembly ratings take into account all components contained within the equipment. A common mis ...
LTspice_lecture
... LTspice has schematic capture and is much easier to use than traditional text-based SPICE. The user can enter a circuit to be simulated via a graphical user interface • Has virtual scope, makes Bode plots, performs FFT, etc. • Worth learning about – It is fast, expandable, powerful, and free – Most ...
... LTspice has schematic capture and is much easier to use than traditional text-based SPICE. The user can enter a circuit to be simulated via a graphical user interface • Has virtual scope, makes Bode plots, performs FFT, etc. • Worth learning about – It is fast, expandable, powerful, and free – Most ...
IPC 7801 - Reflow Oven Process Control Standard
... is to show consistency and repeatability information to confirm that the way the process was operating yesterday is the way it is still running today. The Golden Board can be any size or shape that best represents the product. Golden Boards do not have to be complicated or complex. In fact, since th ...
... is to show consistency and repeatability information to confirm that the way the process was operating yesterday is the way it is still running today. The Golden Board can be any size or shape that best represents the product. Golden Boards do not have to be complicated or complex. In fact, since th ...
Reduction of Induced Voltages deriving from Ground Return
... noise voltage among the other types of PCBs having ground patterns with slits being used in the reference [4]. Figure 1 (b) shows a set-up for evaluating noise voltages via a common ground current for two signal traces by measuring with a network analyzer. With respect to the ground patterns, we eva ...
... noise voltage among the other types of PCBs having ground patterns with slits being used in the reference [4]. Figure 1 (b) shows a set-up for evaluating noise voltages via a common ground current for two signal traces by measuring with a network analyzer. With respect to the ground patterns, we eva ...
ARC32_UsersManual
... to SS0 generated by the timing board. The timing board writes its DSP data bits D15 to D0 to the backplane as SS15 to SS0 whenever the DSP writes to the switch state memory mapped address ($FFB0 for Gen II and $FFFFF3 for Gen III), valid on the rising edge of the strobe signal WRSS. The remaining da ...
... to SS0 generated by the timing board. The timing board writes its DSP data bits D15 to D0 to the backplane as SS15 to SS0 whenever the DSP writes to the switch state memory mapped address ($FFB0 for Gen II and $FFFFF3 for Gen III), valid on the rising edge of the strobe signal WRSS. The remaining da ...
NCV887300LEDGEVB NCV887300 Automotive Grade High‐frequency Dimmable LED Boost
... are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marki ...
... are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marki ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.