Evaluates: MAX4951 MAX4951 Evaluation Kit General Description Features
... Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. ...
... Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. ...
In-Plane Effective Thermal Conductivity of Plain
... Figure 6 plots the reduced effective conductivity as a function of reduced metal fraction. The case for an isotropic screen laminate with K fs = 0 is shown as a bold solid line. An additional case, isotropic screen laminate with K fs = 0. 1 is also shown (solid line). Under these conditions, the eff ...
... Figure 6 plots the reduced effective conductivity as a function of reduced metal fraction. The case for an isotropic screen laminate with K fs = 0 is shown as a bold solid line. An additional case, isotropic screen laminate with K fs = 0. 1 is also shown (solid line). Under these conditions, the eff ...
Evaluates: MAX16821B MAX16821B Evaluation Kit General Description Features
... is typically 10kΩ, and VOV is 1.276V. ...
... is typically 10kΩ, and VOV is 1.276V. ...
Integrated circuits in military equipment
... ntegrated circuits, to a substrate that contains inter:onnections and passive components, the break-even )oint depends on the complexity and the cost of the atachment process. Also, when it is possible to build so nuch circuit complexity into a silicon chip only 50 mils .quare, it seems a waste of s ...
... ntegrated circuits, to a substrate that contains inter:onnections and passive components, the break-even )oint depends on the complexity and the cost of the atachment process. Also, when it is possible to build so nuch circuit complexity into a silicon chip only 50 mils .quare, it seems a waste of s ...
MAX9634 Evaluation Kit Evaluates: General Description Features
... The MAX9634 EV kit is fully assembled and tested. Follow the steps below to verify board operation. Caution: Do not turn on the power supply or electronic load until all connections are completed. 1) Connect the positive terminal of the 3.6V supply to the VBATT pad and the negative terminal of the ...
... The MAX9634 EV kit is fully assembled and tested. Follow the steps below to verify board operation. Caution: Do not turn on the power supply or electronic load until all connections are completed. 1) Connect the positive terminal of the 3.6V supply to the VBATT pad and the negative terminal of the ...
LukeOrsini_Project_Draft_20110807.doc
... Today tin-lead solder is used extensively in electronic assemblies. Tin-Lead solder (SnPb) has been used well over a millennium. The Romans used a Sn-Pb alloy to solder pipes. [1] The solder plays an important role in the performance of a circuit card assembly (CCA). For a leadless chip resistor the ...
... Today tin-lead solder is used extensively in electronic assemblies. Tin-Lead solder (SnPb) has been used well over a millennium. The Romans used a Sn-Pb alloy to solder pipes. [1] The solder plays an important role in the performance of a circuit card assembly (CCA). For a leadless chip resistor the ...
Course Notes
... Current Flow style sheet: When the circuit is animated current flow is displayed. Red = high voltage level Green = low voltage level It has a black background for contrast. This can be changed by selecting View → Display → Background and selecting a colour of choice. ...
... Current Flow style sheet: When the circuit is animated current flow is displayed. Red = high voltage level Green = low voltage level It has a black background for contrast. This can be changed by selecting View → Display → Background and selecting a colour of choice. ...
CONDUCTOR MATERIAL
... conductivity per unit weight. In many cases, weight is more important than volume making aluminium the 'best' conductor material for certain applications. For example, it is commonly used for large-scale power distribution conductors such as overhead power lines. In cases of high voltage transmissio ...
... conductivity per unit weight. In many cases, weight is more important than volume making aluminium the 'best' conductor material for certain applications. For example, it is commonly used for large-scale power distribution conductors such as overhead power lines. In cases of high voltage transmissio ...
MAX2022EVKIT.pdf
... directly to a top metal ground plane on the PCB. Alternatively, the EP can be connected to an internal or bottom-side ground plane using an array of plated vias directly below the EP. The MAX2022 EV kit uses nine evenly spaced 0.016in-diameter, plated through holes to connect the EP to the lower gro ...
... directly to a top metal ground plane on the PCB. Alternatively, the EP can be connected to an internal or bottom-side ground plane using an array of plated vias directly below the EP. The MAX2022 EV kit uses nine evenly spaced 0.016in-diameter, plated through holes to connect the EP to the lower gro ...
Evaluates: MAX40200 “Ideal-Diode” in a 4
... For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. ...
... For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. ...
Evaluation Board User Guide UG-044 r the
... ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken ...
... ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken ...
3. Test Board
... 802.3 architecture. The main active components of the board are the Vertical Cavity Surface Emitting Laser (VCSEL), used to transmit data with light, and the Photodiode (PD), used to receive the optical data. Our VCSEL is driven by a Maxim MAX3287 laser driver that takes a differential input and con ...
... 802.3 architecture. The main active components of the board are the Vertical Cavity Surface Emitting Laser (VCSEL), used to transmit data with light, and the Photodiode (PD), used to receive the optical data. Our VCSEL is driven by a Maxim MAX3287 laser driver that takes a differential input and con ...
The Simplest Equivalent Circuit of
... The Simplest Equivalent Circuit of a Multi-Terminal Network Masahiko HOSOYA Department of Physics and Earth Sciences, Faculty of Science, University of the Ryukyus, Nishihara, Okinawa 903-0213, Japan ...
... The Simplest Equivalent Circuit of a Multi-Terminal Network Masahiko HOSOYA Department of Physics and Earth Sciences, Faculty of Science, University of the Ryukyus, Nishihara, Okinawa 903-0213, Japan ...
P 1 - 123SeminarsOnly.com
... All 80x51 devices have separate address spaces for program and data memory. The logical separation of program and data memory allows the data memory to be accessed by 8-bit addresses, which can be quickly stored and manipulated by an 8-bit CPU. Program memory (ROM, EPROM) can only be read, not writt ...
... All 80x51 devices have separate address spaces for program and data memory. The logical separation of program and data memory allows the data memory to be accessed by 8-bit addresses, which can be quickly stored and manipulated by an 8-bit CPU. Program memory (ROM, EPROM) can only be read, not writt ...
Type B - Eaton
... line voltage and current for each section of the board, plus power factor and max demand information. Through the Modbus RS 485 version meter these parameters can also be accessed remotely. Eaton’s new smart metered board is the same width of a standard TPN board (440mm) and is available in four siz ...
... line voltage and current for each section of the board, plus power factor and max demand information. Through the Modbus RS 485 version meter these parameters can also be accessed remotely. Eaton’s new smart metered board is the same width of a standard TPN board (440mm) and is available in four siz ...
KA05_manual (rev4).indd
... • Needle nose pliers, for bending leads, or to hold components in place. • Small blade and Phillips screwdrivers. A basic range is fine. For some projects, a basic multi-meter is required, or might be handy. 1.2 Assembly Hints : • Make sure the skill level matches your experience, to avoid disappoi ...
... • Needle nose pliers, for bending leads, or to hold components in place. • Small blade and Phillips screwdrivers. A basic range is fine. For some projects, a basic multi-meter is required, or might be handy. 1.2 Assembly Hints : • Make sure the skill level matches your experience, to avoid disappoi ...
Evaluates: MAX13042E MAX13042E Evaluation Kit General Description Features
... The MAX13042E translates between VL and VCC logic levels and guarantees data rates up to 100Mbps. As configured, the EV kit dedicates two channels for translation between VL to VCC and two channels for translation between VCC to VL. The EV kit gives the option of using SMA connectors or test points ...
... The MAX13042E translates between VL and VCC logic levels and guarantees data rates up to 100Mbps. As configured, the EV kit dedicates two channels for translation between VL to VCC and two channels for translation between VCC to VL. The EV kit gives the option of using SMA connectors or test points ...
REACTIVITY OF NO-CLEAN FLUX RESIDUES IN
... are paramount, the activity of this residue must be tightly controlled. Over the last decade, assembly material suppliers have been extremely successful at commercializing no-clean soldering products providing excellent performance to endusers while leaving safe residues on the board. However, the i ...
... are paramount, the activity of this residue must be tightly controlled. Over the last decade, assembly material suppliers have been extremely successful at commercializing no-clean soldering products providing excellent performance to endusers while leaving safe residues on the board. However, the i ...
Analysis of Five Different Dielectric Substrates on
... Five different substrates Bakelite, FR4 Glass epoxy, RO4003, Taconic TLC and RT Duroid, which are used for the fabrication of microstrip patch antenna, has been studied. Results are found to be best in the case of RT Duroid as it gives 80% efficiency with a bandwidth of 15%. The reason for increase ...
... Five different substrates Bakelite, FR4 Glass epoxy, RO4003, Taconic TLC and RT Duroid, which are used for the fabrication of microstrip patch antenna, has been studied. Results are found to be best in the case of RT Duroid as it gives 80% efficiency with a bandwidth of 15%. The reason for increase ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.