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Transcript
TQP369181
DC-6 GHz Gain Block
Applications
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•
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•
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Wireless Infrastructure
CATV / SATV / MoCA
Point to Point
Defense & Aerospace
Test & Measurement Equipment
General Purpose Wireless
Product Features
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SOT-363 Package
Functional Block Diagram
DC-6000 MHz
Flat, broadband frequency response
15.3 dB Gain @ 1.9 GHz
3.6 dB Noise Figure @ 1.9 GHz
+29 dBm Output IP3 @ 1.9 GHz
+14.4 dBm P1dB @ 1.9 GHz
50 Ohm Cascadable Gain Block
Single Supply, 45 mA Current
SOT-363 Package
General Description
Pin Configuration
The TQP369181 is a general-purpose buffer amplifier
that offers high dynamic range in a low-cost surfacemount package. At 1.9 GHz, the amplifier typically
provides 15.3 dB gain, +29 dBm OIP3, and 3.6 dB Noise
Figure while drawing 45 mA current. The device
combines dependable performance with consistent quality
to maintain MTTF values exceeding 100 years at
mounting temperatures of +85°C. The device is housed
in a lead-free/green/RoHS-compliant industry-standard
SOT-363 package.
Pin #
Symbol
3
6
1, 2, 4, 5
RF IN
RF OUT
GND
The TQP369181 consists of a Darlington-pair amplifier
using the high reliability InGaP/GaAs HBT process
technology. Only DC-blocking capacitors, a bias resistor,
and an inductive RF choke are required for operation.
This broadband MMIC amplifier can be directly applied
to various current and next generation wireless
technologies such as CDMA, W-CDMA, and LTE. In
addition, the TQP369181 will work for other applications
within the DC to 6 GHz frequency range.
Ordering Information
Part No.
Description
TQP369181
TQP369181-PCB
InGaP/GaAs HBT Gain Block
0.5-4 GHz Evaluation Board
Standard T/R size = 3000 pieces on a 7” reel
Data Sheet: Rev C 12/09/11
- 1 of 8 -
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
TQP369181
DC-6 GHz Gain Block
Specifications
Recommended Operating Conditions
Absolute Maximum Ratings
Parameter
Rating
Parameter
Storage Temperature
-55 to 150 oC
Tcase
Tj (for>106 hours MTTF)
RF Input Power,CW,50 Ω,T=25ºC
+27 dBm
Device Voltage, Vdevice
5.2 V
Min
Typ
-40
Max Units
o
+85
+160
C
C
o
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended operating
conditions.
Operation of this device outside the parameter ranges given
above may cause permanent damage.
Electrical Specifications
Test conditions unless otherwise noted: ICC = 45 mA, TCASE = +25ºC, 50 Ω system.
Parameter
Conditions
Operational Frequency Range
Min
Typical
DC
Test Frequency
Max
Units
6000
MHz
1900
Gain
13.8
15.3
MHz
16.8
dB
Input Return Loss
-30
dB
Output Return Loss
-24
dB
Output P1dB
Output IP3
See Note 1.
+26.0
+14.6
dBm
+29.0
dBm
Noise Figure
3.6
Device Voltage, Vdevice
3.9
Current, Icc
45
dB
4.5
mA
226
Thermal Resistance (jnc to case) θjc
V
o
C/W
Notes:
1. OIP3 is measured with two tones at an output power of 0 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product
is used to calculate the OIP3 using 2:1 rule. 2:1 rule gives relative value with respect to fundamental tone.
Data Sheet: Rev C 12/09/11
- 2 of 8 -
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
TQP369181
DC-6 GHz Gain Block
Device Characterization Data
S-Parameter Data
Vdevice = 3.9 V (typ.), Icc = 45 mA (typ.), Tcase = +25°C
Freq (MHz)
10
20
50
100
200
500
900
1000
1500
1900
2000
2500
3000
3500
4000
4500
5000
5500
6000
S11 (dB)
-36.7
-35.9
-34.6
-34.1
-32.6
-30.6
-29.1
-29.1
-27.9
-26.7
-24.9
-18.2
-14.4
-13.1
-13.1
-15.0
-19.1
-20.6
-17.1
S11 (ang)
-179.3
178.4
171.4
164.0
153.3
137.1
115.5
118.6
74.3
28.5
17.8
-18.4
-24.2
-26.3
-26.2
-20.5
0.7
60.7
100.0
S21 (dB)
15.9
15.9
15.9
15.9
15.9
15.8
15.6
15.6
15.3
15.1
15.0
14.6
14.2
13.8
13.5
13.3
13.1
12.9
12.6
S21 (ang)
179.7
179.3
178.5
177.2
174.6
167.0
157.3
154.9
143.1
133.6
131.3
120.4
110.1
100.4
91.2
81.7
71.2
60.7
48.8
S12 (dB)
-18.8
-18.8
-18.8
-18.8
-18.9
-18.9
-19.0
-19.0
-19.1
-19.4
-19.4
-19.7
-20.2
-20.5
-20.8
-21.2
-21.7
-22.4
-23.2
S12 (ang)
0.3
-0.1
-0.3
-0.7
-0.9
-2.6
-3.8
-4.1
-6.1
-7.5
-8.0
-9.8
-11.3
-13.1
-12.4
-14.4
-15.9
-17.4
-18.4
S22 (dB)
-30.2
-30.0
-30.8
-31.2
-30.7
-32.3
-33.1
-32.0
-28.2
-22.9
-21.7
-16.6
-14.0
-12.9
-13.7
-16.5
-24.0
-18.9
-13.5
S22 (ang)
14.8
5.6
0.4
-5.2
-10.9
-16.0
-59.1
-59.5
-75.7
-63.3
-64.4
-62.9
-57.5
-54.0
-50.2
-41.9
0.6
84.1
105.3
Notes:
1. Measured on TQP369181-PCB using external off-board, wide-band bias tee and DC blocks (50 Ohm system).
2. SOLT Ecal at network analyzer test cable ends.
3. Input and output reference planes extended to the device leads.
Data Sheet: Rev C 12/09/11
- 3 of 8 -
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
TQP369181
DC-6 GHz Gain Block
Application Circuit Configuration
Notes:
1. See PC Board Layout, under Application Information section, for more information.
2. All components are of 0603 size unless otherwise stated.
Bill of Material: TQP369181-PCB
Reference Des. Value
Description
Manufacturer
Part Number
Q1
n/a
Gain Block
TriQuint
TQP369181
C1
0.018 uF
Cap, Chip, 0603, 16V, X7R, 10%
various
C2, C3
56 pF
Cap, Chip, 0603, 50V, NPO, 5%
various
L1
39 nH
Inductor, 0603, 5%, CS Series
Coilcraft
R1
24 Ω
Res, Chip, 0805, 1/10W, 5%
various
Component Values for Specific Frequencies
Use the component values in this table for optimal operation at specific frequencies.
Reference
Designator
50
500
L1
C2, C3
820 nH
.018 uF
220 nH
1000 pF
Frequency (MHz)
900
1900
2200
68 nH
100 pF
27 nH
68 pF
22 nH
68 pF
2500
3500
18 nH
56 pF
15 nH
39 pF
Bias Resistor Values for Various Supply Voltages
Select R1 to satisfy 45 mA operating current at the available supply voltage.
R1 Value
Size
5
6
7
Vsupply (Volts)
8
24 Ω
0805
47 Ω
1206
68 Ω
1210
91 Ω
1210
Data Sheet: Rev C 12/09/11
- 4 of 8 -
9
10
12
110 Ω
1210
130 Ω
2010
180 Ω
2010
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
TQP369181
DC-6 GHz Gain Block
Typical Performance TQP369181-PCB
Test conditions unless otherwise noted: Vsupply = 5 V, Rbias = 24 Ω, Icc = 45 mA, Tcase = +25°C
Frequency
MHz
500
900
1900
2100
2600
Gain
Input Return Loss
Output Return Loss
Output P1dB
dB
dB
dB
dBm
15.6
-17
-16
+15.4
15.6
-26
-24
+15.2
15.3
-30
-24
+14.6
15
-24
-20
+14.3
14.7
-17
-16
+14.0
OIP3 [1]
dBm
+30.6
+30.0
+29.0
+28.5
+27.7
dB
3.6
3.6
3.6
3.6
3.7
Noise Figure
Notes:
1. OIP3 measured with two tones at an output power of 0 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is
used to calculate the OIP3 using 2:1 rule.
Performance Plots
Test conditions unless otherwise noted: Vsupply = 5 V, Rbias = 24 Ω, Icc = 45 mA
Input Return Loss (dB)
Gain (dB)
15
12
+85°C
+25°C
−40°C
9
Input Return Loss vs. Freq over Temp
0
6
-10
-20
+85°C
+25°C
−40°C
-30
-40
0
1000
2000
3000
4000
5000
6000
-20
+85°C
+25°C
−40°C
-30
1000
2000
3000
4000
5000
6000
0
1000
2000
Frequency (MHz)
OIP3 vs. Output Power/Tone
32
3000
4000
5000
6000
Frequency (MHz)
P1dB vs. Temperature
18
+85°C
+25°C
−40°C
Freq.=1900 MHz
1 MHz Tone Spacing
17
P1dB (dBm)
OIP3 (dBm)
-10
-40
0
Frequency (MHz)
30
Output Return Loss vs. Freq over Temp
0
Output Return Loss (dB)
Gain vs. Freq over Temp
18
28
26
24
16
15
900 MHz
1900 MHz
14
13
22
12
-3
-2
-1
0
1
2
3
Output Power/Tone (dBm)
Data Sheet: Rev C 12/09/11
-40
-15
10
35
60
85
Temperature (deg. C)
- 5 of 8 -
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
TQP369181
DC-6 GHz Gain Block
Pin Description
Pin
Symbol
Description
3
RF IN
6
RF OUT
1, 2, 4, 5
GND
RF input, matched to 50 ohms. External DC Block is required.
RF output / DC supply, matched to 50 ohms. External DC Block, bias choke, and
dropping resistor is required.
Multiple vias should be employed to minimize inductance and thermal resistance; see
PCB mounting pattern in Mechanical Information section.
Applications Information
PC Board Layout
Top RF layer is .014” NELCO N4000-13, єr = 3.7 typ., 4 total layers
(0.062” thick) for mechanical rigidity. Metal layers are 1-oz copper. 50
ohm Microstrip line details: width = .029”, spacing = .035”
The pad pattern shown has been developed and tested for optimized
assembly at TriQuint Semiconductor. The PCB land pattern has been
developed to accommodate lead and package tolerances. Since surface
mount processes vary from company to company, careful process
development is recommended.
For further technical information, Refer to www.TriQuint.com
Data Sheet: Rev C 12/09/11
- 6 of 8 -
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
TQP369181
DC-6 GHz Gain Block
Mechanical Information
Package Information and Dimensions
The component is marked on the top surface
of the package with a “181” designator and
on the bottom surface with an alphanumeric
lot code.
Top 1
Bottom PCB Mounting Pattern
.
Notes:
1. All dimensions are in millimeters (inches).
Angles are in degrees
2. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a
.35mm (#80 / .0135”) diameter drill and have a
final plated thru diameter of .25 mm (.010”).
3. Use 1 oz. Copper minimum. Add as much copper
as possible to inner and outer layers near the part
to ensure optimal thermal performance.
4. RF trace width depends upon the PC board
material and construction.
Data Sheet: Rev C 12/09/11
- 7 of 8 -
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®
TQP369181
DC-6 GHz Gain Block
Product Compliance Information
ESD Information
Solderability
Package lead plating: annealed matte tin over copper
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes ≥ 1000 V to < 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating:
Value:
Test:
Standard:
Class IV
Passes ≥ 1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Compatible with both lead-free (260°C max. reflow
temp.) and tin/lead (245°C max. reflow temp.) soldering
processes.
RoHS Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C15H12Br402) Free
• PFOS Free
• SVHC Free
MSL Rating
The part is rated Moisture Sensitivity Level 1 at 260°C per
JEDEC standard IPC/JEDEC J-STD-020.
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information about
TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
+1.503.615.9000
+1.503.615.8902
For technical questions and application information:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint
assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained
herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with
the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest
relevant information before placing orders for TriQuint products. The information contained herein or any use of such
information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property
rights, whether with regard to such information itself or anything described by such information. TriQuint products are not
warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other
applications where a failure would reasonably be expected to cause severe personal injury or death.
Data Sheet: Rev C 12/09/11
- 8 of 8 -
Disclaimer: Subject to change without notice
www.BDTIC.com/TriQuint/
© 2011 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network®