Download 4241_ECs

FROM:
1.1
- Change guide to practice
1.1 The purpose is to establish a guide for reproducible electrostatic measurements on any surface or
object, consistent with the scope and limitations set forth below.
3.3
- Change guide to document - 2 places
3.3 This guide does not describe instrumentation and techniques capable of making highly precise
measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and
no methods of characterizing the basic electrostatic performance of materials, such as tribocharging,
resistance/resistivity, and decay rate are a part of this document. Measurements made using this guide on
the same surface or object may differ due to differences in the environment or history of the surface or
object between the times any two measurements are made.
7.2.1.1 - Change guide to document
7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.”
For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The
fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or
less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters
that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld
fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between
the fieldmeter sensor and the object under investigation.
1
9.3.3 - Change guide to document
9.3.3 Measurements made to this guide should be taken/reported in units that conform to the customer
specifications. Most common fieldmeters manufactured to date have operating instructions that reflect the
user doing calibration and taking measurements in English units of Volts/inch or Volts at a fixed distance in
inch(es) and in these cases, raw data are reported/listed directly. The international community specifies that
units shall be in SI (Standard International).
9.3.4 - Change guide to document
9.3.4.1 Measurements made to this guide are only valid for surfaces that are flat to a radius of 1.5 times
the measurement distance from a point directly below the sensor head. For surfaces that are not flat,
measurements should be made by moving the sensor over the surface such that the specified measurement
distance is maintained as closely as possible. These measurements may only be stated as a range, with
rounding as applicable to the meter's measurement range according to Section 9.3.1.1. See Figure 4,
Example of a Survey of a Carrier of Semiconductor Wafers. See Related Information 2 for notes on test
methods environment and measurements.
Note 4 - delete Guide - 2 places
NOTE 4: It is anticipated that SEMI will publish an ESD Primer Guide to complement this document. Refer to the
ESD Primer Guide for additional information on measurements of charge on insulators.
10.1 - Change guide to document
10.1
It is reasonable to expect that the person chosen to survey production areas for static charge levels
4241 ECs (submitted to the A&R SC)
has been certified to perform that task. The certified person shall be someone qualified by education and/or
training to calibrate and make measurements with the equipment called out in this guide. The ESD
Association conducts such education programs and certifies individuals as ESD Program Managers. 1 The
International Association of Radio and Television Engineers (iNARTE) administers an ESD Engineer and
ESD technician certification program. 2
R1-1.1 - Change guide to document
R1-1.1 A charged plate monitor is an instrument typically used to monitor the performance of air ionization
equipment. Monitoring is done with an electrically isolated 15 cm  15 cm (6 inches  6 inches) metal plate,
henceforth referred to as “the plate.” The instrument typically provides a means to charge the plate to a
known voltage (1000 or 5000 Volts of either polarity), a plate sensor to determine the voltage on the plate,
and timing circuitry to determine the time required to discharge the plate to a percentage of its initial charge.
For the purposes of this guide, the charged plate monitor, or a separate isolated plate assembly, can be used
for performance verification purposes as explained in Section 9.
4241 ECs (submitted to the A&R SC)
TO:
1.1
- Change guide to practice
1.1 The purpose is to establish a practice for reproducible electrostatic measurements on any surface or
object, consistent with the scope and limitations set forth below.
3.3
- Change guide to document - 2 places
3.3 This document does not describe instrumentation and techniques capable of making highly precise
measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and
no methods of characterizing the basic electrostatic performance of materials, such as tribocharging,
resistance/resistivity, and decay rate are a part of this document. Measurements made using this document
on the same surface or object may differ due to differences in the environment or history of the surface or
object between the times any two measurements are made.
7.2.1.1 - Change guide to document
7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.”
For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The
fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or
less, from the field source to the sensor for this document, as written. However, see Section 9.2.4 for
fieldmeters that are operated at fixed distance(s), and adjust values in this document where applicable. The
handheld fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance
between the fieldmeter sensor and the object under investigation.
9.3.3 - Change guide to document
9.3.3 Measurements made to this document should be taken/reported in units that conform to the
customer specifications. Most common fieldmeters manufactured to date have operating instructions that
reflect the user doing calibration and taking measurements in English units of Volts/inch or Volts at a fixed
distance in inch(es) and in these cases, raw data are reported/listed directly. The international community
specifies that units shall be in SI (Standard International).
9.3.4 - Change guide to document
9.3.4.1 Measurements made to this document are only valid for surfaces that are flat to a radius of 1.5
times the measurement distance from a point directly below the sensor head. For surfaces that are not flat,
measurements should be made by moving the sensor over the surface such that the specified measurement
distance is maintained as closely as possible. These measurements may only be stated as a range, with
rounding as applicable to the meter's measurement range according to Section 9.3.1.1. See Figure 4,
Example of a Survey of a Carrier of Semiconductor Wafers. See Related Information 2 for notes on test
methods environment and measurements.
Note 4 - delete Guide - 2 places
NOTE4: It is anticipated that SEMI will publish an ESD Primer document to complement this document. Refer to the
ESD Primer document for additional information on measurements of charge on insulators.
10.1 - Change guide to document
10.1 It is reasonable to expect that the person chosen to survey production areas for static charge levels
has been certified to perform that task. The certified person shall be someone qualified by education and/or
training to calibrate and make measurements with the equipment called out in this document. The ESD
Association
conducts
education
programs and certifies individuals as ESD Program Managers. 1 The
4241 ECs
(submitted
to thesuch
A&R
SC)
International Association of Radio and Television Engineers (iNARTE) administers an ESD Engineer and
ESD technician certification program. 2
R1-1.1 - Change guide to document
Justification: This document will be balloted in the future as a test method. In order to
prepare this document for the change in type of standard and to stay consistent with the
type chosen for this balloting cycle, the general term “document” has been chosen by the
ESD Task Force and the NA Metrics Committee.
FROM:
2.1, 3.3: Change “instrumentation” to “equipment” to be consistent with terminology used throughout the
document.
2.1 The measurement methods described herein can be applied to characterize the general electrostatic
charge, voltage, field level(s) and electrostatic discharge on objects and surfaces in semiconductor
manufacturing environments. Acceptable instrumentation, calibration, and measurement techniques are
described in this document. Appendices include background information on the equipment specified and
calibration procedures, as well as information and advice on performing a useful general static survey.
3.3 This guide does not describe instrumentation and techniques capable of making highly precise
measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and
no methods of characterizing the basic electrostatic performance of materials, such as tribocharging,
resistance/resistivity, and decay rate are a part of this document. Measurements made using this guide on the
same surface or object may differ due to differences in the environment or history of the surface or object
between the times any two measurements are made.
2
TO:
2.1, 3.3: Change “instrumentation” to “equipment” to be consistent with terminology used throughout the
document.
2.1 The measurement methods described herein can be applied to characterize the general electrostatic
charge, voltage, field level(s) and electrostatic discharge on objects and surfaces in semiconductor
manufacturing environments. Acceptable equipment, calibration, and measurement techniques are
described in this document. Appendices include background information on the equipment specified and
calibration procedures, as well as information and advice on performing a useful general static survey.
3.3 This guide does not describe equipment and techniques capable of making highly precise
measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and
no methods of characterizing the basic electrostatic performance of materials, such as tribocharging,
resistance/resistivity, and decay rate are a part of this document. Measurements made using this guide on the
same surface or object may differ due to differences in the environment or history of the surface or object
between the times any two measurements are made.
Justification: Add clarification and consistency of terminology used.
4241 ECs (submitted to the A&R SC)
FROM:
5.1-5.3: Italicize the terms being defined per SEMI Standard Style Manual (SM) 5-39.6.
5.1 electrostatic discharge (ESD) — the rapid spontaneous transfer of electrostatic charge induced by a
high electrostatic field. Also referred to as an “ESD event”.
5.2 grounded — connected to earth or some other conducting body that serves in the place of earth.
5.3 ground — a conducting connection between an object, electrical equipment, and earth, such as the
portion of an electrical circuit of the same electrical potential as earth.
TO:
3
5.1-5.3: Italicize the terms being defined per SEMI Standard Style Manual (SM) 5-39.6.
5.1 electrostatic discharge (ESD) — the rapid spontaneous transfer of electrostatic charge induced by a
high electrostatic field. Also referred to as an “ESD event”.
5.2 grounded — connected to earth or some other conducting body that serves in the place of earth.
5.3 ground — a conducting connection between an object, electrical equipment, and earth, such as the
portion of an electrical circuit of the same electrical potential as earth.
Justification: Comply with the Editorial Guidelines
FROM:
5.4.1-5.4.14: Italicize the acronyms being defined and replace the en dashes with em dashes per SM 539.6. Insert new acronyms for direct current (DC), COG, LSR, SI, EMC, iNARTE, EIA, IC, etc. used
later in the document.
4
5.4.1 ANSI – American National Standards Institute
5.4.2 CDM – Charged Device Model
5.4.3 EIA – Electronic Industries Association
5.4.4 EMI – Electromagnetic Interference
5.4.5 ESD – Electrostatic Discharge
5.4.6 HBM – Human Body Model
5.4.7 EC – International Electrotechnical Commission
5.4.8 ITRS – International Technology Roadmap for Semiconductors
5.4.9 JEDEC – Joint Electron Devices Engineering Council
5.4.10 MIL-STD – U. S. Military Standard
5.4.11 MM – Machine Model
5.4.12 RMS – root mean square
5.4.13 SED – static event detector
5.4.14 MOSFET – metal oxide semiconductor field effect transistor
4241 ECs (submitted to the A&R SC)
TO:
5.4.1-5.4.14: Italicize the acronyms being defined and replace the en dashes with em dashes per SM 539.6. Insert new acronyms for direct current (DC), C0G, LSR, SI, EMC, iNARTE, EIA, IC, etc. used
later in the document.
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.4.6
5.4.7
5.4.8
5.4.9
5.4.10
5.4.11
5.4.12
5.4.13
5.4.14
5.4.15
5.4.16
5.4.17
5.4.18
5.4.19
5.4.20
ANSI — American National Standards Institute
CDM — Charged Device Model
DC — Direct Current
EIA — Electronic Industries Association
EMC — Electromagnetic Compatibility
EMI — Electromagnetic Interference
ESD — Electrostatic Discharge
HBM — Human Body Model
EC — International Electrotechnical Commission
IC — Integrated Circuit
iNARTE — International Association of Radio, Telecommunications, and Electromagnetics
ITRS — International Technology Roadmap for Semiconductors
JEDEC — Joint Electron Devices Engineering Council
LSR — Low Series Resistance
MIL-STD — U. S. Military Standard
MM — Machine Model
RMS — root mean square
SED — static event detector
SI — International System of Units
MOSFET — metal-oxide-semiconductor field-effect-transistor
Justification: Comply with the Editorial Guidelines
FROM:
6: Capitalize the “p” in “precautions”.
6 Safety precautions
TO:
5
6:
6
Capitalize the “p” in “precautions”.
Safety Precautions
Justification: Should be title case.
4241 ECs (submitted to the A&R SC)
FROM:
7.1.1: Change “instrument” to “equipment”. Lowercase the “O” in “Ohm” to be consistent with how it
is defined elsewhere in the document (e.g., R3-1.2).
7.1.1 An electrometer is defined as an electrical instrument for measuring electric charge, electric current
and/or electrical potential difference (voltage). Measurements of electric current with an electrometer are not
discussed in this document. An electrometer that measures electric charge only is called a coulombmeter.
One of the typical features of an electrometer used in the charge or the voltage measurement mode is very
high input impedance. That high impedance is needed to prevent or to minimize the transfer of electric
charges between the measured object and electrometer. Ideally, the input impedance would be infinite. In
practice, it is limited by intrinsic physical materials properties of insulators and by stray leakage paths
between the input terminals. Low voltage electrometers (below 200 Volt) have typical input resistances of
1014 Ohms or higher and accuracies better than 0.1%. In the voltmeter mode, an electrometer can resolve
microvolt potentials. High voltage electrometers (kilovolts range) usually rely on resistive voltage dividers
and have typical input impedances in the 1011 Ohms range with accuracies in the 1% range. It is important
to evaluate and understand the burden that the input impedance of an electrometer represents when
measuring charge or voltage on charged objects.
6
TO:
7.1.1: Change “instrument” to “equipment”. Lowercase the “O” in “Ohm” to be consistent with how it
is defined elsewhere in the document (e.g., R3-1.2).
7.1.1 An electrometer is defined as an electrical equipment for measuring electric charge, electric current
and/or electrical potential difference (voltage). Measurements of electric current with an electrometer are not
discussed in this document. An electrometer that measures electric charge only is called a coulombmeter.
One of the typical features of an electrometer used in the charge or the voltage measurement mode is very
high input impedance. That high impedance is needed to prevent or to minimize the transfer of electric
charges between the measured object and electrometer. Ideally, the input impedance would be infinite. In
practice, it is limited by intrinsic physical materials properties of insulators and by stray leakage paths
between the input terminals. Low voltage electrometers (below 200 Volt) have typical input resistances of
1014 ohms or higher and accuracies better than 0.1%. In the voltmeter mode, an electrometer can resolve
microvolt potentials. High voltage electrometers (kilovolts range) usually rely on resistive voltage dividers
and have typical input impedances in the 1011 ohms range with accuracies in the 1% range. It is important to
evaluate and understand the burden that the input impedance of an electrometer represents when measuring
charge or voltage on charged objects.
Justification: Clarification and consistency throughout the document.
FROM:
7.2: Delete the extra “/”.
7.2 Fieldmeter/ /Field Sensor
7
TO:
7.2:
Delete the extra “/”.
7.2 Fieldmeter/ Field Sensor
4241 ECs (submitted to the A&R SC)
Justification: Typo
FROM:
7.2.1.1: Insert a comma after “ionization”.
7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.”
For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The
fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or
less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters
that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld
fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between
the fieldmeter sensor and the object under investigation.
8
TO:
7.2.1.1: Insert a comma after “ionization”.
7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.”
For measurements in the presence of air ionization, a chopper stabilized fieldmeter is required. The
fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or
less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters
that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld
fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between
the fieldmeter sensor and the object under investigation.
Justification: Grammatical
4241 ECs (submitted to the A&R SC)
FROM:
7.2.1.1, 9.3.1.4, 9.3.1.5, NOTE 2, etc.: Replace “Section” with the appropriate ¶ or § symbols
throughout the document per SM Table A4-1.
7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.”
For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The
fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or
less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters
that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld
fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between
the fieldmeter sensor and the object under investigation.
9
9.3.1.4 Directing or Pointing the Sense Head — Direct or point the sense head of the fieldmeter or
voltmeter at the center and parallel to the surface of the plate at a distance at least twice of that
recommended by the manufacturer. Slowly move the sense head toward the surface of the charged plate
until a reading equal to the voltage applied to the plate in Section 9.3.1.1 above is displayed by the meter.
Measure and record the distance from the sense head to the surface to the plate. Using the plate voltage from
Section 9.3.1.1 above and the recorded distance, compute the field strength for the fieldmeter. See Figure 3,
Fieldmeter and Voltmeter Verification Check.
9.3.1.5 Alternative to Section 9.3.1.2 — Take measurements at a specified/fixed distance per
manufacturer's instructions. Locate the sense head of the fieldmeter or voltmeter as in Section 9.3.1.4, but,
at specified distance; reading displayed (on meter) should be within 5% of applied voltage to plate.
NOTE 2: Section 9.3.1.4 or 9.3.1.5 should be applicable to most meters. However, in every case, the electrostatic
fieldmeter or voltmeter manufacturer's instructions should be read, understood, and followed.
4241 ECs (submitted to the A&R SC)
TO:
7.2.1.1, 9.3.1.4, 9.3.1.5, NOTE 2, etc.: Replace “Section” with the appropriate ¶ or § symbols
throughout the document per SM Table A4-1.
7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.”
For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The
fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or
less, from the field source to the sensor for this guide, as written. However, see ¶ 9.2.4 for fieldmeters that
are operated at fixed distance(s), and adjust values in this document where applicable. The handheld
fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between
the fieldmeter sensor and the object under investigation.
9.3.1.4 Directing or Pointing the Sense Head — Direct or point the sense head of the fieldmeter or
voltmeter at the center and parallel to the surface of the plate at a distance at least twice of that
recommended by the manufacturer. Slowly move the sense head toward the surface of the charged plate
until a reading equal to the voltage applied to the plate in ¶ 9.3.1.1 above is displayed by the meter. Measure
and record the distance from the sense head to the surface to the plate. Using the plate voltage from ¶ 9.3.1.1
above and the recorded distance, compute the field strength for the fieldmeter. See Figure 3, Fieldmeter and
Voltmeter Verification Check.
9.3.1.5 Alternative to ¶ 9.3.1.2 — Take measurements at a specified/fixed distance per manufacturer's
instructions. Locate the sense head of the fieldmeter or voltmeter as in ¶ 9.3.1.4, but, at specified distance;
reading displayed (on meter) should be within 5% of applied voltage to plate.
NOTE 2: ¶ 9.3.1.4 or ¶ 9.3.1.5 should be applicable to most meters. However, in every case, the electrostatic
fieldmeter or voltmeter manufacturer's instructions should be read, understood, and followed.
Justification: Comply with Style Manual
FROM:
7.4.1: Delete the hyphen in “pre-conditioned”.
7.4.1 All previously mentioned measurement devices should be turned on and pre-conditioned for as long
a warm-up period as recommended by the manufacturer
TO:
10
7.4.1: Delete the hyphen in “pre-conditioned”.
7.4.1 All previously mentioned measurement devices should be turned on and preconditioned for as long
a warm-up period as recommended by the manufacturer
Justification: Grammatical
4241 ECs (submitted to the A&R SC)
FROM:
7.5.1: Lowercase the “E” in “ESD Events” in 2nd sentence. In the last sentence, insert “(DC)” after
“direct current” and delete the hyphen in “in-situ” and replace with a space.
7.5.1 An electrostatic discharge, or ESD event, is a source of damage to the devices and reticles.
Measurements of ESD events are the only direct way of assessing the actual ESD exposure.
ESD Events
can be measured directly or indirectly. Direct measurements are possible by inserting a current probe into
the discharge path and measuring the discharge current. Such measurements, though providing the
maximum accuracy, are largely limited to laboratories as it is impractical to do in an operating factory. A
more practical way of detecting and measuring ESD events is by measuring a specific electromagnetic field
that is generated by an ESD event. Though this method may not offer the precision of the direct current
measurements, it does offer a practical way of assessing ESD exposure in-situ.
11
TO:
7.5.1: Lowercase the “E” in “ESD Events” in 2nd sentence. In the last sentence, insert “(DC)” after
“direct current” and delete the hyphen in “in-situ” and replace with a space.
7.5.1 An electrostatic discharge, or ESD event, is a source of damage to the devices and reticles.
Measurements of ESD events are the only direct way of assessing the actual ESD exposure.
ESD events
can be measured directly or indirectly. Direct measurements are possible by inserting a current probe into
the discharge path and measuring the discharge current. Such measurements, though providing the
maximum accuracy, are largely limited to laboratories as it is impractical to do in an operating factory. A
more practical way of detecting and measuring ESD events is by measuring a specific electromagnetic field
that is generated by an ESD event. Though this method may not offer the precision of the direct current
(DC) measurements, it does offer a practical way of assessing ESD exposure insitu.
Justification: Grammatical and introducing acronym when first mentioned.
FROM:
8: Capitalize the initial letter in “number” and “measurements”.
8
12
Sufficient number of measurements
TO:
8: Capitalize the initial letter in “number” and “measurements”.
8
Sufficient Number of Measurements
Justification: Title case
FROM:
9: Delete the “d” at the end of “Performanced”.
13
9 Test Methods, Measurements and Performanced Verification Methods
4241 ECs (submitted to the A&R SC)
TO:
9: Delete the “d” at the end of “Performanced”.
9 Test Methods, Measurements and Performance Verification Methods
Justification: Misspelling
FROM:
9.1.2: Italicize “Performance … mode)” and insert an em dash before “Refer”.
9.1.2 Performance Verification of a Coulombmeter (or an Electrometer used in the charge
measurement mode) Refer to Figure 1.
14
TO:
9.1.2: Italicize “Performance … mode)” and insert an em dash before “Refer”.
9.1.2 Performance Verification of a Coulombmeter (or an Electrometer used in the charge
measurement mode) — Refer to Figure 1.
Justification: Comply with Style Manual
FROM:
9.1.2.1:
9.1.2.1
Change “instrument” to “equipment”.
Reset (zero) the instrument prior to each measurement.
TO:
15
9.1.2.1:
9.1.2.1
Change “instrument” to “equipment”.
Reset (zero) the equipment prior to each measurement.
Justification: Clarification and consistency throughout the document
16
FROM:
9.1.2.3: Replace the lowercase “x” with the multiplication symbol per SM Table A4-1.
9.1.2.3 Charge the reference calibration capacitor to 1 volt with a charging source (power supply).
Calculate the amount of charge on the capacitor by multiplying the voltage by the value of the capacitor.
Example: 1V x 10 nF = 10 nC of charge.
4241 ECs (submitted to the A&R SC)
TO:
9.1.2.3:
Replace the lowercase “x” with the multiplication symbol per SM Table A4-1.
9.1.2.3 Charge the reference calibration capacitor to 1 volt with a charging source (power supply).
Calculate the amount of charge on the capacitor by multiplying the voltage by the value of the capacitor.
Example: 1V × 10 nF = 10 nC of charge.
Justification: Comply with Style Manual
FROM:
9.2.1: Capitalize initial character in “selection”.
9.2.1 Equipment selection
17
TO:
9.2.1: Capitalize initial character in “selection”.
9.2.1 Equipment Selection
Justification: Title case
FROM:
9.2.2: Capitalize initial characters in “used”, “voltage”, and “mode”.
9.2.3: Capitalize initial characters in “used”, “voltage”, and “mode”.
9.2.2 Performance Verification of an Electrometer used in the voltage mode
9.2.3 Zeroing an Electrometer used in the voltage mode
18
TO:
9.2.2: Capitalize initial characters in “used”, “voltage”, and “mode”.
9.2.3: Capitalize initial characters in “used”, “voltage”, and “mode”.
9.2.2 Performance Verification of an Electrometer Used in the Voltage Mode
9.2.3 Zeroing an Electrometer Used in the Voltage Mode
Justification: Title case
19
FROM:
9.3.1: Replace the hyphen with an em dash before “Refer”.
9.3.1 Performance Verification of Fieldmeters and Voltmeters - Refer to Figure 3.
4241 ECs (submitted to the A&R SC)
TO:
9.3.1: Replace the hyphen with an em dash before “Refer”.
9.3.1 Performance Verification of Fieldmeters and Voltmeters — Refer to Figure 3.
Justification: Comply with Style Manual
FROM:
Table 1:
“guide.”
Format table caption per SM Table 3 4-32.
In Table Note 1, insert “a” between “as” and
#1
If fieldmeter or voltmeter performance verification is needed above 5,000 Volts, it is left to the user to select values using the table as
guide.
TO:
20
Table 1:
“guide.”
Format table caption per SM Table 3 4-32.
In Table Note 1, insert “a” between “as” and
#1
If fieldmeter or voltmeter performance verification is needed above 5,000 Volts, it is left to the user to select values using the table as
a guide.
Justification: Grammatical and table notation formatting per the Editorial Guidelines
FROM:
9.3.1.2: Change “Instrument” to “Equipment”.
9.3.1.2 Instrument Performance Verification — Charge a conductive, isolated test plate to the desired
verification voltage. Use of a suitable power supply or a charged plate monitor for test purposes is
recommended.
21
TO:
9.3.1.2:
Change “Instrument” to “Equipment”.
9.3.1.2 Equipment Performance Verification — Charge a conductive, isolated test plate to the desired
verification voltage. Use of a suitable power supply or a charged plate monitor for test purposes is
recommended.
Justification: Consistent use of term throughout document
4241 ECs (submitted to the A&R SC)
FROM:
9.3.2: Delete the hyphen in “re-verify”.
9.3.2 Check the zero on the fieldmeter or voltmeter as specified by the manufacturer. Usually this is done
while the probe is positioned to view a grounded surface. If the zero of the meter has drifted by more than
5% of the test voltage for any range contained in Table 1, the meter is not suitable for use for measurements
over that range. It may be suitable for use over other ranges contained in Table 1, using other test voltages.
Re-verify the meter’s calibration at the selected test voltage.
22
TO:
9.3.2: Delete the hyphen in “re-verify”.
9.3.2 Check the zero on the fieldmeter or voltmeter as specified by the manufacturer. Usually this is done
while the probe is positioned to view a grounded surface. If the zero of the meter has drifted by more than
5% of the test voltage for any range contained in Table 1, the meter is not suitable for use for measurements
over that range. It may be suitable for use over other ranges contained in Table 1, using other test voltages.
Reverify the meter’s calibration at the selected test voltage.
Justification: Grammatical
FROM:
9.3.4.1: Make last sentence starting with “See Related Information” a NOTE 3: (renumbering the
remaining NOTES accordingly) since the official standard content cannot refer to unofficial content in a
Related Information section, but an unofficial NOTE can.
9.3.4.1 Measurements made to this guide are only valid for surfaces that are flat to a radius of 1.5 times
the measurement distance from a point directly below the sensor head. For surfaces that are not flat,
measurements should be made by moving the sensor over the surface such that the specified measurement
distance is maintained as closely as possible. These measurements may only be stated as a range, with
rounding as applicable to the meter's measurement range according to Section 9.3.1.1. See Figure 4,
Example of a Survey of a Carrier of Semiconductor Wafers. See Related Information 2 for notes on test
methods environment and measurements.
23
TO:
9.3.4.1: Make last sentence starting with “See Related Information” a NOTE 3: (renumbering the
remaining NOTES accordingly) since the official standard content cannot refer to unofficial content in a
Related Information section, but an unofficial NOTE can.
9.3.4.1 Measurements made to this guide are only valid for surfaces that are flat to a radius of 1.5 times the
measurement distance from a point directly below the sensor head. For surfaces that are not flat,
measurements should be made by moving the sensor over the surface such that the specified
measurement distance is maintained as closely as possible. These measurements may only be
stated as a range, with rounding as applicable to the meter's measurement range according to
Section 9.3.1.1. See Figure 4, Example of a Survey of a Carrier of Semiconductor Wafers.
NOTE 3: See Related Information 2 for notes on test methods environment and measurements.
4241 ECs (submitted to the A&R SC)
Justification: Referring to unofficial part of the document. Notes are considered an
unofficial part of the document as well, so the reference is more appropriate in this area of
content.
FROM:
Figure 4:
Delete the space before the hyphens in “C)” and “D)”.
24
4241 ECs (submitted to the A&R SC)
TO:
Figure 4:
Delete the space before the hyphens in “C)” and “D)”.
A) Make sure meter is properly grounded according to manufacturer's
instructions.
B) Scan approximately 2.54 cm along both sides and ends of carrier.
C) Scan approximately 2.54 cm length of carrier and top-center of
wafers with meter.
D) Note high-low values for B) & C).
E) Assure that the operator is properly grounded.
Field emanating from carrier of charge
semiconductor wafers.
Meter
Wafers
Carrier
Ground Plane
Justification: Typo
FROM:
NOTE 3: Insert 2 spaces after the colon per SM 4-14.3.
NOTE 3:See Figure 3.
25
TO:
NOTE 3: Insert 2 spaces after the colon per SM 4-14.3.
NOTE 3:
See Figure 3.
Justification: Typo
4241 ECs (submitted to the A&R SC)
FROM:
9.4.1: Insert “a” before “specific”.
9.4.1.1
26
An ESD event generates an electromagnetic field with specific signature characterized by:
TO:
9.4.1: Insert “a” before “specific”.
9.4.1.1
An ESD event generates an electromagnetic field with a specific signature characterized by:
Justification: Grammatical / typo
FROM:
9.4.1.2: Lowercase the initial character in “Event”, “Detectors”, and “Simulators”.
9.4.1.2 Studies published by Intel (ESD Symposium 2005) and others provide correlations between
measurements of electromagnetic field generated by ESD events and their magnitude. Verification of the
performance of ESD Event Detectors can also be done using the various industry ESD Simulators.
27
TO:
9.4.1.2: Lowercase the initial character in “Event”, “Detectors”, and “Simulators”.
9.4.1.2 Studies published by Intel (ESD Symposium 2005) and others provide correlations between
measurements of electromagnetic field generated by ESD events and their magnitude. Verification of the
performance of ESD event detectors can also be done using the various industry ESD simulators.
Justification: Should not have been in title case – grammatical
FROM:
9.4.2: Change “Tools” to “Equipment”.
9.4.2 Measurement Tools for ESD Events
TO:
28
9.4.2: Change “Tools” to “Equipment”.
9.4.2
Measurement Equipment for ESD Events
Justification: Consistency of use of terms throughout document
FROM:
9.4.2.2.2: Change “Instruments” to “Equipment”.
29
9.4.2.2.2 Instruments with lesser performance specifications would either miss or misinterpret important
parameters of ESD events.
4241 ECs (submitted to the A&R SC)
TO:
9.4.2.2.2: Change “Instruments” to “Equipment”.
9.4.2.2.2 Equipment with lesser performance specifications would either miss or misinterpret important
parameters of ESD events.
Justification: Consistent use of terminology throughout document
FROM:
9.4.2.2.3: Insert a hyphen between “time” and “domain” in two places.
9.4.2.2.3 The use of a high-speed oscilloscope must be accompanied by the use of a proper antenna for
receiving the electromagnetic fields. For time domain measurements it is important to use an antenna
with a flat frequency response since frequency correction that is common in the frequency domain is not
possible for time domain measurements. Also, it is important to note that a typical oscilloscope captures
only one event (first or last one, depending on trigger setting), missing multiple ESD events that are
common.
30
TO:
9.4.2.2.3: Insert a hyphen between “time” and “domain” in two places.
9.4.2.2.3 The use of a high-speed oscilloscope must be accompanied by the use of a proper antenna for
receiving the electromagnetic fields. For time-domain measurements it is important to use an antenna
with a flat frequency response since frequency correction that is common in the frequency domain is not
possible for time-domain measurements. Also, it is important to note that a typical oscilloscope captures
only one event (first or last one, depending on trigger setting), missing multiple ESD events that are
common.
Justification: Grammatical
FROM:
9.4.2.2.4: Define acronym EMC here as first time used.
9.4.2.2.4 Spectrum analyzers commonly used in EMC test and wireless communication are not practical
for detecting eletromagnetic signals from ESD events due to their unacceptably low acquisition speed.
31
TO:
9.4.2.2.4: Define acronym EMC here as first time used.
9.4.2.2.4 Spectrum analyzers commonly used in electromagnetic compatibility (EMC) test and wireless
communication are not practical for detecting eletromagnetic signals from ESD events due to their
unacceptably low acquisition speed.
Justification: First time acronym was introduced and need clarification / defining of letters
4241 ECs (submitted to the A&R SC)
FROM:
9.4.2.3.2: Lowercase the “E” in “Event”.
9.4.2.3.2 ESD Event monitors may range from a simple device with only an indication of the occurrence
of ESD event, to a more complex device that can measure the strength of each individual event and provide
correlation to the strength of the electrostatic discharge based on the distance from the location of the
discharge and other parameters.
32
TO:
9.4.2.3.2: Lowercase the “E” in “Event”.
9.4.2.3.2 ESD event monitors may range from a simple device with only an indication of the occurrence of
ESD event, to a more complex device that can measure the strength of each individual event and provide
correlation to the strength of the electrostatic discharge based on the distance from the location of the
discharge and other parameters.
Justification: Should not be capitalized
FROM:
A1-1.1: Change “Instrument” to “Equipment”.
A1-1.2:
Change “instruments” to “equipment”.
A1-1.1 Tables A1-1 and A1-2 are intended to assist in the selection of an appropriate instrument for
making electrostatic measurements. Users should note that a variety of measurement methods is available
for any given situation. Consult manufacturers of the equipment for additional information concerning its
proper use and applicability.
A1-1.2 Some instruments are used for making measurements of electric charge, voltage or field indirectly.
This means that the desired property can be calculated from the measurement of another physical quantity.
For example, electric charge deposited on an object can be calculated from electrostatic field or electrostatic
voltage (potential) associated with that object.
33
TO:
A1-1.1:
Change “Instrument” to “Equipment”.
A1-1.2:
Change “instruments” to “equipment”.
A1-1.3 Tables A1-1 and A1-2 are intended to assist in the selection of an appropriate equipment for
making electrostatic measurements. Users should note that a variety of measurement methods is available
for any given situation. Consult manufacturers of the equipment for additional information concerning its
proper use and applicability.
A1-1.4 Some equipment are used for making measurements of electric charge, voltage or field indirectly.
This means that the desired property can be calculated from the measurement of another physical quantity.
For example, electric charge deposited on an object can be calculated from electrostatic field or electrostatic
voltage (potential) associated with that object.
4241 ECs (submitted to the A&R SC)
Justification: Consistency of terms used throughout the document.
grammatical purposes.
Deletion of “an” for
FROM:
Table A1-1: Change “Instruments” to “Equipment Types” in table caption and header. Italicize the
names of the different equipment types in second row as they are also column headers. Need to correct the
placement of the header row and entry row on p. 13 due to the table breaking across the pages.
Table A1-1 Recommended Instruments for Electrostatic Measurements
34
TO:
Table A1-1: Change “Instruments” to “Equipment Types” in table caption and header. Italicize the
names of the different equipment types in second row as they are also column headers. Need to correct the
placement of the header row and entry row on p. 13 due to the table breaking across the pages.
Table A1-1 Recommended Equipment Types for Electrostatic Measurements
Justification: Need to re-apply the styles in the table for the italicizing and format the row to
not break across the page. The word change is for consistency of the use of the term
throughout the entire document.
FROM:
R1-2.1, R1-2.2:
Define “RMS” the first time it is used in R1-2.1, not in R1-2.2.
R1-2.1 The verification procedure is intended to ensure that the meter used does not drift excessively (less
than 5% in 5 minutes) and can repeatedly measure a known field to within 5%. When actually using the
meter to do a field survey, maintaining the correct distance from the sensor head to the surface or object
being measured becomes the greatest source of error. If the ability of the meter operator to maintain the
correct distance is within 10%, then the total error of the measurement would be within about 12% using
this calibration procedure (RMS of the 5% drift, 5% repeatability, and 10% distance errors).
35
TO:
R1-2.1, R1-2.2:
Define “RMS” the first time it is used in R1-2.1, not in R1-2.2.
R1-2.1 The verification procedure is intended to ensure that the meter used does not drift excessively (less
than 5% in 5 minutes) and can repeatedly measure a known field to within 5%. When actually using the
meter to do a field survey, maintaining the correct distance from the sensor head to the surface or object
being measured becomes the greatest source of error. If the ability of the meter operator to maintain the
correct distance is within 10%, then the total error of the measurement would be within about 12% using
this calibration procedure (root mean square [RMS] of the 5% drift, 5% repeatability, and 10% distance
errors).
Justification: Introduction of an acronym
4241 ECs (submitted to the A&R SC)
FROM:
R3-1.1: Delete the periods at the end of the first two bullets.
R3-1.1 ESD Simulators are used to replicate ESD events.
semiconductor devices and equipment include:
Common types used to characterize
 Component Level HBM ESD Simulator.
 Component Level MM ESD Simulator.
 Component Level CDM ESD Simulator
 System Level HBM/metal ESD Simulator
TO:
36
R3-1.1:
Delete the periods at the end of the first two bullets.
R3-1.1 ESD Simulators are used to replicate ESD events.
semiconductor devices and equipment include:
Common types used to characterize
 Component Level HBM ESD Simulator
 Component Level MM ESD Simulator
 Component Level CDM ESD Simulator
 System Level HBM/metal ESD Simulator
Justification: Grammatical – adhere to the Style Manual
FROM:
R3-1.3: Insert a comma after “handler” and a period after “etc”.
R3-1.3 The component level MM (Machine Model) ESD Simulator represents the parameters agreed upon
for a standard, which represents the discharge from a charged metallic part of a machine (automatic handler
etc). These parameters are 200 pF and zero resistance for the representative capacitance and DC resistance
respectively of the machine part. We note here that the resulting waveform is highly dependent on the
impedance of the measurement circuitry.
37
TO:
R3-1.3:
Insert a comma after “handler” and a period after “etc”.
R3-1.3 The component level MM (Machine Model) ESD Simulator represents the parameters agreed upon
for a standard, which represents the discharge from a charged metallic part of a machine (automatic
handler, etc.). These parameters are 200 pF and zero resistance for the representative capacitance and DC
resistance respectively of the machine part. We note here that the resulting waveform is highly dependent
on the impedance of the measurement circuitry.
Justification: Grammatical
4241 ECs (submitted to the A&R SC)
FROM:
R3-1.5:
Insert a hyphen between “system” and “level”.
R3-1.5 The system level HBM/metal ESD Simulator represents the parameters agreed upon for a
standard, which represents the discharge from a human holding a metallic instrument. These parameters are
the lower resistance 350 ohms and 150 pF for the representative resistance and capacitance respectively of
the human holding a metallic instrument. Note here that the waveform is greatly affected by the measuring
equipment parasitics.
38
TO:
R3-1.5:
Insert a hyphen between “system” and “level”.
R3-1.5 The system-level HBM/metal ESD Simulator represents the parameters agreed upon for a
standard, which represents the discharge from a human holding a metallic instrument. These parameters are
the lower resistance 350 ohms and 150 pF for the representative resistance and capacitance respectively of
the human holding a metallic instrument. Note here that the waveform is greatly affected by the measuring
equipment parasitics.
Justification: Grammatical
FROM:
RI 3 NOTE 1: Number NOTES sequentially (i.e., don’t restart numbering at 1) throughout the main
body, appendices, and RIs per SM 4-14.4.
39
TO:
RI 3 NOTE 1: Number NOTES sequentially (i.e., don’t restart numbering at 1) throughout the main
body, appendices, and RIs per SM 4-14.4.
Justification: To adhere to the Style Manual
FROM:
R3-2.1: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and
“ohm”, and “high” and “bandwidth”. Change “band width” to “bandwidth” throughout the document.
40
R3-2.1 HBM ESD Simulator-component level — The procedure for using this simulator to stress test
devices or wafers is based upon the standard requirements. ANSI and the ESD Association approved the
HBM standard, ANSI/ESD STM5.1-2007, which contains a specific device pin combination sequence for
stress testing. 1 This test procedure is generally referred to as a Pin to Ground test since one pin is always
grounded while the selected second pin is stressed. Calibration before use requires added equipment
components like a current probe, high bandpass cable, a short wire, a 500 ohm resistor and a very high
band width waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22-A114 —
Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2
4241 ECs (submitted to the A&R SC)
TO:
R3-2.1: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and
“ohm”, and “high” and “bandwidth”. Change “band width” to “bandwidth” throughout the document.
R3-2.1 HBM ESD Simulator-component level — The procedure for using this simulator to stress test
devices or wafers is based upon the standard requirements. ANSI and the ESD Association approved the
HBM standard, ANSI/ESD STM5.1-2007, which contains a specific device pin combination sequence for
stress testing. 1 This test procedure is generally referred to as a Pin-to-Ground test since one pin is always
grounded while the selected second pin is stressed. Calibration before use requires added equipment
components like a current probe, high-bandpass cable, a short wire, a 500-ohm resistor and a very highbandwidth waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22-A114 —
Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2
Justification: Grammatical
FROM:
R3-2.2: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and
“ohm”, and “high” and “bandwidth”.
R3-2.2 MM ESD Simulator-component level — The procedure for using this simulator to stress test
devices or wafers is based upon the standard requirements. The ANSI/ESD STM5.2-1999 approved MM
standard specifies a specific device pin combination sequence for stress testing. 1 This test procedure is also
generally referred to as a Pin to Ground test since one pin is always grounded while the selected second pin
is stressed.
This procedure is exactly the same as for HBM. Calibration before use requires added
equipment components like a current probe, high bandpass cable, short wire, a 500 ohm resistor and a very
high band width waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM). 2
41
TO:
R3-2.2: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and
“ohm”, and “high” and “bandwidth”.
R3-2.2 MM ESD Simulator-component level — The procedure for using this simulator to stress test
devices or wafers is based upon the standard requirements. The ANSI/ESD STM5.2-1999 approved MM
standard specifies a specific device pin combination sequence for stress testing. 1 This test procedure is also
generally referred to as a Pin-to-Ground test since one pin is always grounded while the selected second
pin is stressed.
This procedure is exactly the same as for HBM. Calibration before use requires added
equipment components like a current probe, high-bandpass cable, short wire, a 500-ohm resistor and a very
high-bandwidth waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM). 2
Justification: Grammatical
4241 ECs (submitted to the A&R SC)
FROM:
R3-2.4: Insert a comma after “Simulators” and a period after “etc”. Add missing SI units for “4 ft by 4
ft”.
R3-2.4 HBM-metal Simulator- system level — The procedure for using this hand-held simulator for testing
systems (ATE testers, Automatic handlers, computers, printers, ESD Simulators etc) is based upon the
standard requirements. The IEC 61000-4-2, 1996 (formerly 801-2, 1992) standard uses direct contact or air
discharge to the system under test and is a different procedure from the other three procedures mentioned
above. 3 Calibration before use requires the use of a very large vertical ground plane (at least 4 ft by 4 ft
square), a high bandwidth current probe, cables and high bandwidth waveform recorder/digitizer.
42
TO:
R3-2.4: Insert a comma after “Simulators” and a period after “etc”. Add missing SI units for “4 ft by 4
ft”.
R3-2.4 HBM-metal Simulator- system level — The procedure for using this hand-held simulator for testing
systems (ATE testers, Automatic handlers, computers, printers, ESD Simulators, etc.) is based upon the
standard requirements. The IEC 61000-4-2, 1996 (formerly 801-2, 1992) standard uses direct contact or air
discharge to the system under test and is a different procedure from the other three procedures mentioned
above. 3 Calibration before use requires the use of a very large vertical ground plane (at least 1.2 m by 1.2 m
[4 ft by 4 ft] square), a high bandwidth current probe, cables and high bandwidth waveform
recorder/digitizer.
Justification: Grammatical and to adhere to Style Manual
FROM:
R3-3.1: Add missing classifications for the seven levels (similar to how MM and CDM are done) if they
are supposed to be there.
R3-3.1 HBM classification
1. < 250 Volts
2. 250 to < 500
3. 500 to < 1000
4. 1000 to < 2000
5. 2000 to < 4000
6. 4000 to < 8000
7. = or > 8000
43
TO:
R3-3.1: Add missing classifications for the seven levels (similar to how MM and CDM are done) if they
are supposed to be there.
R3-3.1 HBM classification
Class 0 - < 250 volts
Class 1A - 250 to < 500 volts
Class 1B - 500 to < 1000 volts
Class 1C - 1000 to < 2000 volts
Class 2 - 2000 to < 4000 volts
Class 3A - 4000 to < 8000 volts
Class 3B - ≥ 8000 volts
Justification: Data was copied from tables contained in E78, but did not include column
headings—this change affects the Related Information section, which is unofficial content.
4241 ECs (submitted to the A&R SC)
FROM:
R3-3.2:
Add missing units.
R3-3.2 MM classification
1. M1 < 100
2. M2 100 to < 200
3. M3 200 to < 400
4. M4 400 to < 800
5. M5 = or > 800
44
TO:
R3-3.2:
Add missing units.
R3-3.2 MM classification
Class M1 - < 100 volts
Class M2 - 100 to < 200 volts
Class M3 - 200 to < 400 volts
Class M4 - 400 to < 800 volts
Class M5 - ≥ 800 volts
Justification: Data was copied from tables contained in E78, but did not include column
headings—this change affects the Related Information section, which is unofficial content.
FROM:
R3-3.3:
Add missing units.
R3-3.3 CDM classification
6. C1 < 125
7. C2 125 to < 250
8. C3 250 to < 500
9. C4 500 to < 1000
10. C5 1000 to < 2000
11. C6 = or > 2000
45
TO:
R3-3.3:
Add missing units.
R3-3.3 CDM classification
Class C1 - < 125 volts
Class C2 - 125 to < 250 volts
Class C3 - 250 to < 500 volts
Class C4 - 500 to < 1000 volts
Class C5 - 1000 to < 2000 volts
Class C6 - ≥ 2000 volts
Justification: Data was copied from tables contained in E78, but did not include column
headings—this change affects the Related Information section, which is unofficial content.
4241 ECs (submitted to the A&R SC)
FROM:
R4-1.1: Insert missing hyphen between “Static” and “charge” in first sentence and between “static” and
“control” in second sentence. Define acronym “ICs”.
R4-1.1 Static charge generation is unavoidable whenever materials come in contact. Without a static
control program, the problems caused by static charge are also unavoidable. The most common problem
caused by static charge is electrostatic discharge (ESD). ESD results in damaged semiconductor ICs,
photomask defects, magneto-resistive (MR) read head defects in disk drives, and failures of the drive
circuits for flat panel displays (FPD). ESD also creates a significant amount of electromagnetic interference
(EMI). Often mistaken for software errors, EMI resulting from ESD interrupts the operation of production
equipment. This is particularly true of equipment depending on high-speed microprocessors for control.
Results include unscheduled downtime, increased maintenance requirements, and frequently, product scrap.
Technology trends to smaller device geometries, faster operating speeds, and increased circuit density make
ESD problems worse.1
TO:
46
R4-1.1: Insert missing hyphen between “Static” and “charge” in first sentence and between “static” and
“control” in second sentence. Define acronym “ICs”.
R4-1.1 Static-charge generation is unavoidable whenever materials come in contact. Without a staticcontrol program, the problems caused by static charge are also unavoidable. The most common problem
caused by static charge is electrostatic discharge (ESD). ESD results in damaged semiconductor integrated
circuits (ICs), photomask defects, magneto-resistive (MR) read head defects in disk drives, and failures of
the drive circuits for flat panel displays (FPD). ESD also creates a significant amount of electromagnetic
interference (EMI). Often mistaken for software errors, EMI resulting from ESD interrupts the operation of
production equipment. This is particularly true of equipment depending on high-speed microprocessors for
control. Results include unscheduled downtime, increased maintenance requirements, and frequently,
product scrap. Technology trends to smaller device geometries, faster operating speeds, and increased
circuit density make ESD problems worse. 2
Justification: Grammatical / introduction of acronym—this change affects the Related
Information section, which is unofficial content
FROM:
R4-1.2:
47
Insert missing hyphen between “static” and “control” in two places.
R4-1.2 For many years static control programs concentrated on protecting components from the charge
generated on the personnel that handled them. Many static control methods were devised to control the
charge on people including wrist and heel straps, dissipative shoes and flooring, and garments. Increasingly,
however, the production of electronic components is done by automated equipment, and personnel never
come into contact with the static-sensitive devices. Solving the ESD problem means assuring that ESD
events do not occur in the equipment used to manufacture and test electronic components.
Levit, L. et al, “It’s the Hardware. No, Software. No, It’s ESD!”, Solid State Technology, May 1999, Pennwell Publishing Company, 98 Spit
Brook Road, Nashua NH 03062.
2
Levit, L. et al, “It’s the Hardware. No, Software. No, It’s ESD!”, Solid State Technology, May 1999, Pennwell Publishing Company, 98 Spit
Brook Road, Nashua NH 03062.
1
4241 ECs (submitted to the A&R SC)
TO:
R4-1.2:
Insert missing hyphen between “static” and “control” in two places.
R4-1.2 For many years static-control programs concentrated on protecting components from the charge
generated on the personnel that handled them. Many static-control methods were devised to control the
charge on people including wrist and heel straps, dissipative shoes and flooring, and garments. Increasingly,
however, the production of electronic components is done by automated equipment, and personnel never
come into contact with the static-sensitive devices. Solving the ESD problem means assuring that ESD
events do not occur in the equipment used to manufacture and test electronic components.
Justification: Grammatical
FROM:
R4-2.1: Insert missing hyphen between “static” and “control”, “static” and “sensitive”, “charge” and
“creating”, and “static” and “dissipative” in two places.
R4-2.1 An effective static control program in equipment starts with grounding all materials that might
come close to, or in contact with the static sensitive components. This prevents the generation of static
charge on machine components and eliminates them as a source of the charge creating ESD events. Care
must be taken in a grounding program to assure that moving equipment parts remain grounded when they
are in motion. In some cases, static dissipative materials may be substituted for conductive materials where
flexibility, thermal insulation, or other properties not available in conductive materials are needed. If
charging of components is unavoidable, static dissipative materials may be used to slow the resulting
discharges and prevent component damage.
48
TO:
R4-2.1: Insert missing hyphen between “static” and “control”, “static” and “sensitive”, “charge” and
“creating”, and “static” and “dissipative” in two places.
R4-2.1 An effective static-control program in equipment starts with grounding all materials that might
come close to, or in contact with the static-sensitive components. This prevents the generation of static
charge on machine components and eliminates them as a source of the charge-creating ESD events. Care
must be taken in a grounding program to assure that moving equipment parts remain grounded when they
are in motion. In some cases, static-dissipative materials may be substituted for conductive materials where
flexibility, thermal insulation, or other properties not available in conductive materials are needed. If
charging of components is unavoidable, static-dissipative materials may be used to slow the resulting
discharges and prevent component damage.
Justification: Grammatical
4241 ECs (submitted to the A&R SC)
FROM:
R4-3.1: Insert missing hyphen “static” and “control” in first sentence.
R4-3.1 A static control program begins when the automated equipment is designed by the OEM, and then
continues throughout the lifetime of the equipment. Two basic issues need to be demonstrated. First, are all
components in the product-handling path connected to ground? Second, as the product passes through the
equipment, is it handled in a way that does not generate static charge above an acceptable level on the
component? ESD Association Standard Practice, EOS/ESD SP 10.1-20003. This document contains test
methods to verify the integrity of the ground path to equipment parts, as well as to determine if the product
is being charged during its passage through the equipment. The test methods are applicable during the
original design of the equipment and during acceptance testing by the end user.
49
TO:
R4-3.1:
Insert missing hyphen “static” and “control” in first sentence.
R4-3.1 A static-control program begins when the automated equipment is designed by the OEM, and then
continues throughout the lifetime of the equipment. Two basic issues need to be demonstrated. First, are all
components in the product-handling path connected to ground? Second, as the product passes through the
equipment, is it handled in a way that does not generate static charge above an acceptable level on the
component? ESD Association Standard Practice, EOS/ESD SP 10.1-20004. This document contains test
methods to verify the integrity of the ground path to equipment parts, as well as to determine if the product
is being charged during its passage through the equipment. The test methods are applicable during the
original design of the equipment and during acceptance testing by the end user.
Justification: Grammatical
FROM:
R4-3.2:
Delete the hyphen in “on-line”.
R4-3.2 While the test methods of EOS/ESD SP 10.1-2000 can also be used for periodic verification of the
equipment performance, they have one drawback. The automated equipment must be taken off-line to do the
testing. This means that there is lost production time, and often the periodic testing is eliminated to maintain
product throughput. Other test methods are available that can be performed with the equipment operating
on-line, without altering or disturbing its operation.
50
TO:
R4-3.2:
Delete the hyphen in “on-line”.
R4-3.2 While the test methods of EOS/ESD SP 10.1-2000 can also be used for periodic verification of the
equipment performance, they have one drawback. The automated equipment must be taken off-line to do the
testing. This means that there is lost production time, and often the periodic testing is eliminated to maintain
product throughput. Other test methods are available that can be performed with the equipment operating
online, without altering or disturbing its operation.
Justification: Grammatical
3
4
EOS/ESD SP10.1 - 2000 “Automated Handling Equipment (AHA)”, ESD Association, 700 Turin Road, Rome NY 13440.
EOS/ESD SP10.1 - 2000 “Automated Handling Equipment (AHA)”, ESD Association, 700 Turin Road, Rome NY 13440.
4241 ECs (submitted to the A&R SC)
FROM:
R4-4.2, R4-4.3:
Replace the hyphens with em dashes.
R4-4.2 EMI Locators - When component damage or equipment problems due to ESD are suspected, it
may be useful to detect the EMI generated by the ESD event. This type of testing is both a starting point for
determining that static charge has been generated, and it is a measurement point to ascertain that any static
control methods have been successful. EMI locators measure dynamic operating conditions, as it is usually
not necessary to interrupt equipment operations to make measurements.
R4-4.3 Types of EMI Locators - EMI locators are available in a number of different forms. In its simplest
form, it consists of an AM radio tuned off station. A popping noise will be heard when an ESD event occurs.
At the most complex it consists of a wideband (greater than 1 GHz) digital storage oscilloscope with a set of
appropriate antennas, probes, and software. Measurements of radiated interference can be made using
antennas while probes can be connected to equipment parts or electronics and power lines.
51
TO:
R4-4.2, R4-4.3:
Replace the hyphens with em dashes.
R4-4.2 EMI Locators — When component damage or equipment problems due to ESD are suspected, it
may be useful to detect the EMI generated by the ESD event. This type of testing is both a starting point for
determining that static charge has been generated, and it is a measurement point to ascertain that any static
control methods have been successful. EMI locators measure dynamic operating conditions, as it is usually
not necessary to interrupt equipment operations to make measurements.
R4-4.3 Types of EMI Locators — EMI locators are available in a number of different forms. In its simplest
form, it consists of an AM radio tuned off station. A popping noise will be heard when an ESD event occurs.
At the most complex it consists of a wideband (greater than 1 GHz) digital storage oscilloscope with a set of
appropriate antennas, probes, and software. Measurements of radiated interference can be made using
antennas while probes can be connected to equipment parts or electronics and power lines.
Justification: Adhere to the Style Manual
FROM:
R4-4.3.2:
52
Insert missing hyphen between “high” and “frequency” in two places.
R4-4.3.2 Several other types of EMI locating equipment are currently in use. Most consist of high
frequency receiving circuitry followed by level detectors to determine the magnitude of the signal. For the
purpose of detecting EMI from ESD events, the equipment should have some way of differentiating the
short impulse of EMI from the ESD event from the continuous high frequency radiation of other EMI
sources. Some instruments contain a counter to total the number of ESD events above the threshold, or
alarms to indicate when the number of ESD events exceeds a preset number. This type of instrument can be
placed near a piece of equipment that is suspected of causing ESD events and left in place to monitor.
4241 ECs (submitted to the A&R SC)
TO:
R4-4.3.3:
Insert missing hyphen between “high” and “frequency” in two places.
R4-4.3.2 Several other types of EMI locating equipment are currently in use. Most consist of highfrequency receiving circuitry followed by level detectors to determine the magnitude of the signal. For the
purpose of detecting EMI from ESD events, the equipment should have some way of differentiating the
short impulse of EMI from the ESD event from the continuous high-frequency radiation of other EMI
sources. Some instruments contain a counter to total the number of ESD events above the threshold, or
alarms to indicate when the number of ESD events exceeds a preset number. This type of instrument can be
placed near a piece of equipment that is suspected of causing ESD events and left in place to monitor.
Justification: Grammatical
FROM:
R4-4.4.1: Insert missing hyphen between “radio” and “frequency” and “static” and “control”.
R4-4.4.1 One caution needs to be observed when using EMI locators to detect ESD events that cause
component damage. The signal received by these devices is generated in areas usually surrounded by
grounded metal components. It may have to pass through equipment panels and travel some distance
through the air before it reaches the detector. There maybe other radio frequency sources and reflecting or
absorbing materials in the area. The actual location of the ESD event may be a considerable distance from
the EMI locator. It will be difficult to establish any correlation between the amplitude of the signal received
by the EMI locator and the energy in the ESD event that produced the signal. The EMI locator primarily
indicates the occurrence of an ESD event and can be used to illustrate that a particular static control method
has eliminated it. It should not be assumed that every ESD event detected results in damage to components
or equipment problems. Additional testing will be needed to establish that connection.
53
TO:
R4-4.4.1: Insert missing hyphen between “radio” and “frequency” and “static” and “control”.
R4-4.4.1 One caution needs to be observed when using EMI locators to detect ESD events that cause
component damage. The signal received by these devices is generated in areas usually surrounded by
grounded metal components. It may have to pass through equipment panels and travel some distance
through the air before it reaches the detector. There maybe other radio-frequency sources and reflecting or
absorbing materials in the area. The actual location of the ESD event may be a considerable distance from
the EMI locator. It will be difficult to establish any correlation between the amplitude of the signal received
by the EMI locator and the energy in the ESD event that produced the signal. The EMI locator primarily
indicates the occurrence of an ESD event and can be used to illustrate that a particular static-control
method has eliminated it. It should not be assumed that every ESD event detected results in damage to
components or equipment problems. Additional testing will be needed to establish that connection.
Justification: Grammatical
FROM:
R4-6.1:
54
Lowercase the initial characters in “Liquid Crystal Display”.
R4-6.1 In some SED devices, the signal is amplified and processed to produce a reflectance change in the
built-in Liquid Crystal Display (LCD). The SED is designed to trip at a predetermined threshold voltage,
detecting ESD transients above the selected amplitude. Some devices can be reset magnetically or optically
making them reusable.
4241 ECs (submitted to the A&R SC)
TO:
R4-6.1:
Lowercase the initial characters in “Liquid Crystal Display”.
R4-6.1 In some SED devices, the signal is amplified and processed to produce a reflectance change in the
built-in liquid crystal display (LCD). The SED is designed to trip at a predetermined threshold voltage,
detecting ESD transients above the selected amplitude. Some devices can be reset magnetically or optically
making them reusable.
Justification: Grammatical
FROM:
R4-6.2: Insert missing hyphen between “ESD” and “damage”, “metal” and “oxide”, “oxide” and
“semiconductor” (two places), “field” and “effect”.
R4-6.2 Other devices use the controllable ESD damage threshold of metal oxide semiconductor field
effect transistors (MOSFET). The test methodology is to amplify an ESD transient to create sufficient
energy to destroy the gate oxide. The device may be used until the specified ESD level is achieved, and then
the SED fails. A similar device is based on the metal oxide semiconductor capacitor (MOSCAP). The
current leakage through the device significantly increases if the ESD amplitude is sufficient to damage the
MOS structure. Both of these types of SED must be removed from where they are installed and require
additional instrumentation to determine their status.
55
TO:
R4-6.2: Insert missing hyphen between “ESD” and “damage”, “metal” and “oxide”, “oxide” and
“semiconductor” (two places), “field” and “effect”.
R4-6.2 Other devices use the controllable ESD-damage threshold of metal-oxide-semiconductor fieldeffect transistors (MOSFET). The test methodology is to amplify an ESD transient to create sufficient
energy to destroy the gate oxide. The device may be used until the specified ESD level is achieved, and then
the SED fails. A similar device is based on the metal-oxide-semiconductor capacitor (MOSCAP). The
current leakage through the device significantly increases if the ESD amplitude is sufficient to damage the
MOS structure. Both of these types of SED must be removed from where they are installed and require
additional instrumentation to determine their status.
Justification: Grammatical
56
FROM:
R4-7: Insert missing hyphen between “static” and “charge”, “high” and “technology”, and “static” and
“control”.
There is little question that static charge problems continue to result in significant losses in high
technology manufacturing. Increasingly, static control methods must be applied in the equipment that
produces the product. It will be important to develop and utilize a range of diagnostic methods and
measurement equipment for ESD in equipment.
4241 ECs (submitted to the A&R SC)
TO:
R4-7: Insert missing hyphen between “static” and “charge”, “high” and “technology”, and “static” and
“control”.
There is little question that static-charge problems continue to result in significant losses in hightechnology manufacturing. Increasingly, static-control methods must be applied in the equipment that
produces the product. It will be important to develop and utilize a range of diagnostic methods and
measurement equipment for ESD in equipment.
Justification: Grammatical
FROM:
9.1.2.2 Maintain a reference calibration capacitor. It should be a polystyrene or polypropylene 10 nF
capacitor (class COG, low series resistance - LSR). Measure the value of the capacitor to better than 1%.
It is important to handle the reference calibration capacitor very carefully. Do not touch or hold the
capacitor by its body or discharge it by touching both leads with the fingers. Hold the capacitor by one
lead only. Use a clip lead connected between ground and this lead of the capacitor to maneuver the other
lead of the capacitor between the “hot” side of the charging source and the input terminal of the
coulombmeter.
57
TO:
9.1.2.2 Maintain a reference calibration capacitor. It should be a polystyrene or polypropylene 10 nF
capacitor (class C0G, low series resistance - LSR). Measure the value of the capacitor to better than 1%.
It is important to handle the reference calibration capacitor very carefully. Do not touch or hold the
capacitor by its body or discharge it by touching both leads with the fingers. Hold the capacitor by one
lead only. Use a clip lead connected between ground and this lead of the capacitor to maneuver the other
lead of the capacitor between the “hot” side of the charging source and the input terminal of the
coulombmeter.
Justification: Typo and was missing related acronym—clarification
FROM:
Remove definition of acronym since introduced in previous section:
R1-2.2 If two operators using two different meters follow the verification procedure, and they both are able
to maintain the correct distance to within 10% as above, then they both would be within 12% of the true
field strength when measuring the same surface or object. Taking the root mean square (RMS) of these
errors, the two operators using two meters should be within 17% of each other.
58
TO:
R1-2.2 If two operators using two different meters follow the verification procedure, and they both are able
to maintain the correct distance to within 10% as above, then they both would be within 12% of the true
field strength when measuring the same surface or object. Taking the root mean square (RMS) of these
errors, the two operators using two meters should be within 17% of each other.
Justification: Mistakenly defined in section after its first introduction.
moved to the section R1-2.1.
4241 ECs (submitted to the A&R SC)
Definition was
FROM:
Update organization name and contact information in section 10.1 and footnote 2:
10.1 It is reasonable to expect that the person chosen to survey production areas for static charge levels
has been certified to perform that task. The certified person shall be someone qualified by education and/or
training to calibrate and make measurements with the equipment called out in this guide. The ESD
Association conducts such education programs and certifies individuals as ESD Program Managers. 1 The
International Association of Radio and Television Engineers (iNARTE) administers an ESD Engineer and
ESD technician certification program.
TO:
10 Certification
59
10.1 It is reasonable to expect that the person chosen to survey production areas for static charge levels has
been certified to perform that task. The certified person shall be someone qualified by education and/or
training to calibrate and make measurements with the equipment called out in this guide. The ESD
Association conducts such education programs and certifies individuals as ESD Program Managers. 1 The
International Association for Radio, Telecommunications, and Electromagnetics (iNARTE)
administers an ESD Engineer and ESD technician certification program. 2
2 International Association for Radio, Telecommunications, and
Electromagnetics (iNARTE), 840 Queen Street, New Bern NC 28560,
www.narte.org
5.4.8 iNARTE — International Association for Radio, Telecommunications, and Electromagnetics
(iNARTE)
Justification: They changed name in 2007 and moved in 2008.
FROM:
Add iNARTE to acronyms: 5.4.8 and renumber the remaining acronyms.
TO:
60
5.4.8 iNARTE — International Association for Radio, Telecommunications, and Electromagnetics
(iNARTE)
Justification: Used acronym but didn’t define
4241 ECs (submitted to the A&R SC)