Download TDA8172 - PS electronic, sro

TDA8172
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
FEATURES
■ Power Amplifier
■ Flyback Generator
■ Thermal Protection
DESCRIPTION
The TDA8172 is a monolithic integrated circuit in
HeptawattTM package. It is a high efficiency power
booster for direct driving of vertical windings of TV
yokes. It is intended for use in color and black &
white television as well as in monitors and
displays.
HEPTAWATT
(Plastic Package)
ORDER CODE: TDA8172
PIN CONNECTION (top view)
BLOCK DIAGRAM
October 2003
1/7
1
TDA8172
1
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VS
Supply Voltage (pin 2)
35
V
V5, V6
Flyback Peak Voltage
60
V
VS + 3
V
V3
Voltage at Pin 3 (see Note 1)
V1, V7
VS - 0.5
V
I0
Output Peak Current (non repetitive, t = 2ms)
2.5
A
I0
Output Peak Current at f = 50 to 200 Hz, t ≤ 10µs
±5
A
I0
Output Peak Current at f = 50 to 200 Hz, t > 10µs
2
A
I3
Pin 3 DC Current at V5 < V2
100
mA
I3
Pin 3 Flyback Current at f = 50 to 200 Hz, tfly ≤ 1.5ms
±1.5
A
I3
Pin 3 Sink Current at f = 50 to 200 Hz, t ≤ 10µs
5
A
Ptot
Tstg, Tj
Amplifier Input Voltage
Total Power Dissipation at Tcase = 90 °C
Storage and Junction Temperature
20
W
-40, +150
°C
Note 1:This occurs during the first part of flyback pulse
2
THERMAL DATA
Symbol
Rth(j-c)
3
Parameter
Thermal Resistance Junction-case
Value
Unit
3
°C/W
ELECTRICAL CHARACTERISTICS
(refer to the test circuits, VS = 35V, Tamb = 25°C unless otherwise specified)
Symbol
Pin 2 Quiescent Current
I6
Pin 6 Quiescent Current
I1
Amplifier Input Bias Current
V3L
Pin 3 Saturation Voltage to GND
V5
Quiescent Output Voltage
V5L
V5H
Tj
2/7
1
Parameter
I2
Output Saturation Voltage to GND
Output Saturation Voltage to Supply
Junction Temperature for Thermal Shutdown
Test Conditions
I3 = 0, I5 = 0
Min. Typ. Max. Unit Fig.
8
16
mA
1
I3 = 0, I5 = 0
16
36
mA
1
V1 = 1 V, V7 = 2 V
V1 = 2 V, V7 = 1 V
- 0.1
-1
1
- 0.1
-1
µA
µA
I3 = 20 mA
1
1.5
V
3
VS = 35V, Ra = 39 kΩ
18
V
4
I5 = 1.2 A
1
1.4
V
3
I5 = 0.7 A
0.7
1
V
3
1
- I5 = 1.2 A
1.6
2.2
V
2
- I5 = 0.7 A
1.3
1.8
V
2
140
°C
TDA8172
Figure 1. Measurement of I1, I2, I6
Figure 2. Measurement of V5H
+VS
I2
I6
+VS
2
6
2
6
V5H
5
5
1V
S
a
1
7
b
4
7
TDA8172
1
10kΩ
TDA8172
-I5
V7
I1
V7
4
1V
S1: (a) I2 and I6 ; (b) I1
Figure 3. Measurement of V3L, V5L
Figure 4. Measurement of V5
+VS
+VS
2
6
I3 or I5
2
S1
6
3
1
12kΩ
a
TDA8172
1
b
5
2V
TDA8172
7
4
V5
V7
Ra
5
7
4
V7
V3L
V5L
5.6kΩ
S: (a) V3L ; (b) V5L
3/7
TDA8172
Figure 5. AC test circuit
1N4001
VS
C1
0.1µF
C2
470µF
2
VREF
C3
220µF
D1
6
3
V7
7
Ly
TDA8172
GND
5
R1
Vi
10kΩ
RT1
to
C4
0.22µF
1
t0
tfly
4
R7
1.5Ω
4.7kΩ
Ly
24.6mH
R6
330Ω
Ry
9.6Ω
IN
R2
5.6kΩ
R3
12kΩ
C6
4.7µF
R4
8.2kΩ
C5
2200µF
R5Ly
*Recommended for VREF filtering
4/7
R5
8.2Ω
t0
TDA8172
4
MOUNTING INSTRUCTIONS
The power dissipated in the circuit is removed by adding an external heatsink. With the HEPTAWATT™
package, the heatsink is simply attached with a screw or a compression spring (clip).
A layer of silicon grease inserted between heatsink and package optimizes thermal contact ; no electrical
isolation is needed between the two surfaces since the tab is connected to Pin 4 which is ground.
Figure 6. Mounting examples
5/7
TDA8172
5
PACKAGE MECHANICAL DATA
9 PINS - plastic heptawatt
E
L
D1
C
D
M
A
M1
L1
L2
G2
G
G1
L3
H3
L5
L7
H2
F1
F
Dia.
L6
Dimensions
A
C
D
D1
E
F
F1
G
G1
G2
H2
H3
L
L1
L2
L3
L5
L6
L7
M
M1
Dia.
6/7
Min.
Millimeters
Typ.
2.4
1.2
0.35
0.6
2.41
4.91
7.49
2.54
5.08
7.62
10.05
Max.
4.8
1.37
2.8
1.35
0.55
0.8
0.9
2.67
5.21
7.8
10.4
10.4
Min.
0.094
0.047
0.014
0.024
0.095
0.193
0.295
Max.
0.189
0.054
0.110
0.053
0.022
0.031
0.035
0.105
0.205
0.307
0.409
0.409
0.668
0.587
0.848
0.891
3
15.8
6.6
0.102
0.594
0.236
2.8
5.08
3.65
0.100
0.200
0.300
0.396
16.97
14.92
21.54
22.62
2.6
15.1
6
Inches
Typ.
0.118
0.622
0.260
0.110
0.200
3.85
0.144
0.152
TDA8172
I
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for
the consequences of use of such information nor for any infringement of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of
STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication
supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as
critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
www.st.com
7/7
2