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Project Name
Features:
Diagram/Schematics:
This section should be filled with brief
points describing the main features of the
design and emphasizing what is unique
about it compared to similar designs in the
market, e.g.
This section provides any pin I/o diagrams,
high level block diagrams and schematics
that will assist the understanding of the
design description in the next section. An
example of a block diagram is shown in
Figure 2.
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•
Overload Protection on the Input
and Output
No Latch-Up When the Common
Mode Range is Exceeded
Package Types:
What are the packaging requirements for
this design? Number of pins? Package type?
Figure 1 shows an example of packaging
details.
Description:
This section provides a high level
description of the internal operational
details of the design, which will assist the
reviewers to get a better understanding of
the design, its complexity, its importance
and impact to the market/society. It can
also include operational ranges (voltage,
temperature,…etc).
Fig. 1 Package Types
Testing Methodology:
What is the expected testing methodology?
Will testing be done in-house (by your
team)? Or will it be outsourced? If so,
where?
Patents/Publications:
Fig. 2 Block diagram for the project
description
Applications:
This section mentions any pending/issue
patents or publications related to the
design(s) within this project. Also, if the
results of this project are to be published,
which conferences/journals are you
targeting?
This section describes:
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In which fields/products will this
design be used?
Who are the target users?
What is the market size?
Will this design be provided as a
soft /hard IP or as an end product?
How will this impact the
market/society?
References:
This section contains any references used
within the description of this project.