Download 0.2W Side View 6014 Red(Au) - LG Innotek

CUSTOMER :
.
DATE
:
2016. 03. 03 .
REV
:
1.1
.
SPECIFICATIONS FOR APPROVAL
Side View Type Red SMD LED
MODEL NAME : LERRS61E00SM01
RoHS
Compliant
APPROVAL
REMARK
APPENDIX
Designed
Checked
Approved
2016.03.03
2016.03.03
2016.03.03
M.S.KIM
J.J.CHOI
J.J.YOON
LGIT Confidential and Proprietary
TABLE OF CONTENTS
1. Features
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3
2. Outline Dimensions
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3
3. Applications
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4
4. Absolute Maximum Ratings
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4
5. Electro-Optical Characteristics
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4
6. Bin Structures
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5
7. Typical Characteristic Curves
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6
8. Reliability Test Items and Conditions
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7~8
9. Package and Labeling of Products
─────────
9~12
10. Soldering Conditions
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13
11. Cautions on Use
─────────
14~17
12. Disclaimers
─────────
18
13. Change History of Revision
─────────
19
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1. Features
- Lighting Color : Red
- Lead Frame Type LED Package : 6.14 x 1.4 x 1.65 (L x W x H) [unit : mm]
- Viewing Angle : 120˚
- Chip Material : AlGaInP
- Soldering Methods : Reflow Soldering
- Taping : 12 mm clear carrier tape & antistatic clear cover tape
2,500 pcs/reel, Φ178 mm Wheel
2. Outline Dimensions
( unit : mm )
POLARITY
②Cathode
③-
Recommendable soldering pattern
(For reflow soldering)
+ Anode ①
Exposed Cu for soldering
※ Observe the recommended guideline
by all means.
Cu area for improving heat dissipation
Do not use this area for electrical contact.
Cu area ≥ 1.48 mm2 per pad
Tolerances unless otherwise specified ±0.10mm
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3. Applications
- Interior and Exterior Illumination, Automotive Lighting
* Meets SAE/ECE Automotive Color Requirements
4. Absolute Maximum Ratings
Items
( Ta = 25℃ )
Symbols
Ratings
Unit
If
140
mA
Ir
10
µA
Ifp
200
mA
Operating Temperature
Topr
-40 ~ 100
℃
Storage Temperature
Tstg
-40 ~ 100
℃
Junction Temperature
Tj
125
℃
Forward Current
Reverse Current
Pulse Forward Current
*
Soldering Temperature
JEDEC-J-STD-020D
ESD Classification
Class 2 (JESD22-A114)
*1) Pulse width = 10 ms, duty cycle ≤ 10%
※ The stresses beyond those listed under absolute maximum ratings may cause permanent damages to the device.
These or any other conditions beyond those indicated under recommended operating conditions are not implied.
The exposure to the absolute maximum rated conditions may affect device reliability.
※ LEDs are not designed to be driven in reverse voltage.
5. Electro - Optical Characteristics
Items
( Ta = 25℃ )
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage
Vf
If = 100mA
1.80
-
2.40
V
Reverse Current
lr
Vr =10V
-
-
10.0
uA
Luminous Flux
lm
If = 100mA
13.0
-
18.0
lm
Dominant Wavelength
Wd
If = 100mA
613
-
622
nm
Viewing Angle
2Θ1/2
If = 100mA
-
120
-
deg
Thermal resistance
Rthj-s
-
120
-
°C/W
-1.0
-
-3.0
mV/°C
Typical Temperature Coefficient
of Forward Voltage*1)
ΔVf / ΔTj
If = 100mA
*1) Measured at Ta between between 25℃ and 85℃
※ These values are measured by the LG Innotek optical spectrum analyzer within the following tolerances.
- Luminous Flux (Im ) : ±5%, Forward Voltage(Vf ) : ±0.1V
※ Although all LEDs are tested by LG Innotek equipment, some values may vary slightly depending on the
conditions of the test equipment.
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6. Bin Structures
 Rank of Luminous Flux (@ 100mA)
Rank
 Rank of Forward Voltage (@ 100mA)
Ø v (lm, @ 100mA)
Min.
Typ.
Max.
E1
13.0
-
14.0
E2
14.0
-
E3
17.0
-
Rank
Vf (V, @ 100mA)
Min.
Typ.
Max.
V1
1.80
-
1.95
17.0
V2
1.95
-
2.10
18.0
V3
2.10
-
2.25
V4
2.25
-
2.40
 Rank of Dominant Wavelength (@ 100mA)
Rank
W1
Wd (nm, @ 100mA)
Min.
Typ.
Max.
613
-
622
※ Bin structure: Please refer to the following example.
Bin Code : E1-W1-V2 (Φv Bin = E1, Wd Bin = W1, Vf Bin = V2)
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7. Typical Characteristic Curves
 Forward Current vs. Forward Voltage
 Relative Luminous Flux vs. Forward Current
Ta = 25℃
Forward Current [mA]
Relative Luminous Flux [%]
Ta = 25℃
Forward Voltage [V]
Forward Current [mA]
 Spectrum
 Luminous Flux vs. Temperature
Ta 25℃, If = 100mA
Relative Luminous Flux [%]
Relative Luminous Intensity [%]
If = 100mA
Wavelength (nm)
Tb(°C)
 Radiation Characteristics
 Derating Curve
Ta 25℃, If = 100mA
30
-60
60
-90
100
Forward Current [mA]
0
-30
50
0
50
90
100
Ambient Temperature[°C]
※ The ambient temperatures for each graph are based on the LG Innotek equipment
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8. Reliability Test Items and Conditions
8-1. Criteria for Judging the Damage
•
Item
Symbol
Test Condition
Forward Voltage
Vf
Luminous Flux
Øv
Limit
Min
Max
If = 100mA
-
Initial Value  1.2
If = 100mA
Initial Value  0.8
-
Using Stand FR4 PCB Size is 25×25×1.6 mm3 (L×W×H)
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8. Reliability Test Items and Conditions
8-2. Reliability Test
No
Item
Test Condition
Hour/
Cycles
Sample
Size
Ac/Re
Ta = 25℃, If = 140mA
1,000
Hours
77PCS
0/1
Ta = 85℃, RH = 85%, If = 90mA
1,000
Hours
77PCS
0/1
1
Room Temperature
Operating Life (RT)
2
High Humidity High Temp.
Operating Life (H3TOL)
3
High Temperature
Operating Life (HTOL)
Ta = 100℃, If = 60mA
1,000
Hours
77PCS
0/1
4
Low Temperature
Operating Life (LTOL)
Ta = -40℃, If = 140mA
1,000
Hours
77PCS
0/1
5
High Temperature
Storage Life (HTSL)
Ta = 100℃
1,000
Hours
77PCS
0/1
6
Low Temperature
Storage Life (LTSL)
Ta = -40℃
1,000
Hours
77PCS
0/1
7
Power Temperature Cycle
(PTC)
Tc = -40℃/85℃, If = 90mA,
Dwell : 10min, Transfer : 20min (1hour/ 1cycle),
On/Off : 2min
1,000
Hours
77PCS
0/1
8
Temperature Cycling (TC)
-40℃~110℃,
Dwell : 25 min, Transfer : 5 min
1,000
Hours
77PCS
0/1
9
Vibration Variable
Frequency (VVF)
0.06 inch displacement, 20 to 100Hz, 50g
100Hz to 2kHz
-
30PCS
0/1
10
Thermal Shock (TS)
-40℃/110℃, Dwell : 20 min, Transfer : <10sec
1,000
Cycles
77PCS
0/1
3 times
30PCS
0/1
R1:10㏁, R2:1.5㏀, C:100 (Test Voltage : 2kV)
R1
R2
11
ESD Characterization
(Human Body Model)
12
Resistance to Solder Heat
(RSH)
Test for solder conditions 260℃ for 10 sec on
solder pads with solder iron
-
30PCS
0/1
13
Solderability (SD)
Test for solder conditions 215℃ for 3 sec on
solder pads
-
10PCS
0/1
14
Mechanical Shock (MS)
1500g’s for 0.5ms, 5 blows, 3 orientations
3 times
30PCS
0/1
V
S1
D.U.T
※All reliability tests are qualified (Cumulative test results obtained from testing performed in accordance with AEC-Q101).
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9. Package and Labeling of Products
9-1. Taping Outline Dimensions
 Reel
( Unit : mm )
EIAJ-RPM 12 B
 Packing Materials :
Width
W1
W2
12mm
9.0 ±0.3
11.9 ±1.0
- Reel : Conductive PS (Black)
- Emboss Tape : Conductive PET (limpidity)
- Cover Tape : Antistatic PET Base
 Tape
cathode
Anode
Polarity
direction
 Taping Arrangement
Arrangement of Tape ( in case of 2,500ea)
(End)
(Start)
Unloaded Tape
(Min. 200mm)
LG이노텍(주)
Mounted with LED
(2,500 pcs)
Unloaded Tape
(Min. 40mm)
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Leading Part
(250 ~ 600mm)
13-ETC-0906
LGIT Confidential and Proprietary
9. Package and Labeling of Products
9-2. Label Structure
Products are packed in one bag of 2,500 pcs (one taping reel) and
a label is affixed on each
bag specifying Model , Rank, Quantity and Run number.
Label A
( Model, Rank,
Q’ty, Run number)
Label A
( Model, Rank,
Q’ty, Run number)
Label B
( Array Model Add… )
- Package : damp-proof package made of aluminum
※. Label A
Specifying Lot ID, MES ID, Rank, Quantity, Run No, Rack No, Model Name, MSL Lv.
※. Label B
Specifying Lot ID, Array Model, PKG Model, Rank, Run No, Quantity, Rack No
Label A
Label B
 Run No indication
1
Code
2
Manufacture Manufacture
Site
Year
Paju
:1
Huizhou : 9
LG이노텍(주)
3
2012 : 2
2013 : 3
···
2020 : 0
2021 : 1
4
5
6
Manufacture
Month
Manufacture
Date
1~9 : 1~9
10 : A
11 : B
12 : C
(01~31)
10 / 19
7
8
9
10
TP #
Serial No
(00 ~ 99)
(00 ~ ZZ)
13-ETC-0906
LGIT Confidential and Proprietary
9. Package and Labeling of Products
9-2. Label Structure
※. Label C
Specifying Customer, Date, Model Name, Total Quantity, Outbox ID, Rank info & Quantity
 Outbox ID. indication
1
2
3
4
5
Manufacture
Site
PKG
Site
Box
Year
Month
Date
Serial No
PKG :S, P
Inner Box : I
Outer Box : O
2012 : 2
2013 : 3
···
2020 : 0
2021 : 1
1~9 : 1~9
10 : A
11 : B
12 : C
(01 ~ 31)
(001 ~ 999)
Paju
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8
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LGIT Confidential and Proprietary
9. Package and Labeling of Products
9-3. Packing Specifications
Reeled products (numbers of products are 2,500 pcs) are packed in a sealed-off aluminum
moisture proof bag along with desiccants (Silica gel).
Four aluminum bags (total maximum number of products are 10,000 pcs) packed in an inner
box and Six inner boxes are put into an outer box.
Label A
Vacuum Packing
Label A
Taping Reel
Label B
Silica Gel
Pb-Free
Sticker
1 Bag : 1Reel / 1Silica Gel
Inner Box
Label B (4ea)
Aluminum Moisture
Proof Bag
Pb-Free Mark
Box
1 Inner Box : 4Reel
Size (mm)
W
L
H
Inner
227
82
258
Outer
530
240
280
Outer Box
OPP Tape (50mm)
Label C
Pb-Free Mark
1 Outer Box : 6 Inner Box
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10. Soldering Conditions
-. Reflow soldering method is recommended for LEDs assembly.
-. LG Innotek does not guarantee the performance of the LEDs assembled by dip soldering method.
-. Recommended Soldering Profile (according to JEDEC J-STD-020D)
Profile Feature
Preheat/Soak
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Maximum time(ts) from Tsmin to Tsmax
Pb-Free Assembly
Pb-Based Assembly
150℃
200℃
60~120 seconds
100℃
150℃
60~120 seconds
3℃/ second max.
Ramp-up rate (TL to Tp)
3℃/ second max.
Liquidus temperature (TL)
217℃
183℃
Time (tL) maintained above TL
60~150 seconds
60~150 seconds
Maximum peak package body temperature (Tp)
260℃
235℃
Time(tp) within 5℃ of the specified temperature (Tc)
30 seconds
20 seconds
Ramp-down rate (Tp to TL)
6℃/second max.
6℃/second max.
Maximum Time 25℃ to peak temperature
8minutes max.
6minutes max.
-. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs
although the recommended soldering conditions are specified in the above diagrams.
-. A rapid cooling process is not recommended for the LEDs from the peak temperature.
-. The LEDs encapsulate silicone and have soft surfaces on the tops, which can easily
damaged by pressure. Precautions should be taken to avoid strong pressure on the
encapsulated part when leveraging the pick and place machines. The pick up nozzles should
not directly contact the silicone resin of the LEDs.
-. Reflow soldering should not be done more than two times.
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11. Cautions on Use
11-1.Moisture Proof Package
-. The moisture in the SMD package may vaporize and expand during soldering.
-. The moisture can damage the optical characteristics of the LEDs due to the encapsulation.
11-2. During Storage
Conditions
Temperature
Humidity
Time
before Opening Aluminum Bag
5℃ ~ 30℃
＜ 50%RH
within 1 Year from
the Delivery Date
after Opening Aluminum Bag
5℃ ~ 30℃
＜ 60%RH
≤ 672Hours
65±5℃
＜ 10%RH
10 ~ 24 hours
Storage
Baking
-. MSL Level : 2a
11-3. During Usage
-. LED should avoid the direct contact with exposure to hazardous materials such as sulfur, chlorine,
phthalate, etc..
-. The silver-plated metal parts on LEDs can be rusted when exposed to corrosive gases.
-. The silver-plated metal parts also can be affected not only by the corrosive gases emitted inside of the endproducts but by the gases penetrated from outside environment.
-. The corrosive atmosphere must be avoided during the use and storage.
-. Extreme environments such as sudden ambient temperature changes or high humidity that can cause
condensation must be avoided.
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11. Cautions on Use
11-4. Cleaning
-. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as
they may damage the resin of the LEDs.
-. Isopropyl Alcohol(IPA) is the recommendable solvent for cleaning the LEDs under the following
conditions.
Cleaning Condition : IPA, 25℃ max. x 60sec max.
-. Ultrasonic cleaning is not recommended.
-. Pretests must be followed by the actual cleaning processes to avoid any possible damages
to the LEDs.
11-5. Thermal Management
-. The thermal design of the end product must be seriously considered even from the beginning
stage.
-. The co-efficiency between the heat generation and the thermal dissipation is affected by the thermal
resistance of the circuit boards and the density of the LED placements together with other
components.
11-6. Static Electricity
-. Wristbands and anti-electrostatic gloves are strongly recommended and all devices,
equipment and machineries must be properly grounded when handling the LEDs which are
sensitive against static electricity and surge.
-. Precautions are to be taken against surge voltage to the equipment that mounts the LEDs.
-. Some unusual characteristics such as significant increase of current leakage, decrease of
turn-on voltage, or no operation at a low current can be occurred by damaged LEDs.
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11. Cautions on Use
11-7. Recommended Circuit
-. The current through each LED must not exceed the absolute maximum rating when design the circuits.
-. In general, there can be various forward voltages for LEDs. Different forward voltages in parallel via a single
resistor can result different forward currents to each LED, which also can output different luminous flux values.
In the worst case, the currents can exceed the absolute maximum ratings which can stress the LEDs. Matrix
circuit with a single resistor for each LED is recommended to avoid the luminous flux fluctuations.
L1
RL1
RL2
L2
L3
L1
L2
L3
L1
L2
L3
RL3
RL
Pic.2. Abnormal Circuit
: The current through the LEDs may vary due to
the variation in forward voltage (VF) of the LEDs.
Pic.1 Recommended circuit in parallel mode
: Separate resistor must be used in each LED
-. LED should be operated in forward bias. A driving Circuit must be designed so that
the LED is not subjected to either forward or reverse voltage while it is off. In particular,
if a reverse voltage is continuously applied to the LED, such operation can cause
migration resulting in LED damage.
-. If reverse voltage is applied to the LEDs, it will damage the LEDs and result in destruction.
11-8. Application Limits of LED Driver IC Controller
-. AlGaInP based LED is relatively weak to electrical damage (such as static electricity and over current stress).
Forward leakage of LED occurred by such damage in the forward low current region may result in turn-ondelay of Lighting Module, which is dependent on a specific function of driver IC.
-. For reasons mentioned above, minimum current level (source start-up current) of LED driver IC must be more
than 0.3 mA. LGIT cannot make a guarantee on the LED using in Driver IC with start up current level of < 0.3
mA.
-. When parallel circuit LED driver IC is applied in Lighting Module, Hot spot may occur in low current operation
region (dimming mode) by difference of LED voltage in low current region. So, driver IC with Individual LED
controller is recommended.
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11. Cautions on Use
11-9. Soldering Iron
-. The recommended condition is less than 5 seconds at 260℃.
-. The time must be shorter for the higher temperature. (+10℃ → -1sec).
-. The power dissipation of the soldering iron should be lower than 15W when the surface
temperature of the device should be controlled at or under 230℃.
11-10. Repair
-. Repairing should not be done after the LEDs have been soldered.
-. When repairing is unavoidable, a double-head soldering iron should be used.
-. If should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by
repairing.
-. When Soldering, do not put stress on the LEDs during heating customer must finish rework within 5sec.
under 245℃.
-. The head of Iron can not touch copper foil.
-. Twin-head type is preferred.
(O)
(X)
11-11. Eye Safety Guidelines
-. Do not directly look at the light when the LEDs are on.
-. Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with optical
instruments.
11-12. Manual Handling
-. Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the
surface of the encapsulant. ( encap silicone cure condition : 405min )
CORRECT
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LGIT Confidential and Proprietary
12. Disclaimers
-. LG Innotek is not responsible for any damages caused by any accidents or operational
environments exceeding the absolute maximum ratings.
-. Generally accepted electronic equipment must be used to operate the LEDs in this document.
-. Consultation with LG Innotek is recommended for unassured environments or operations to avoid
any possible malfunctions or damages of the products or risk of life or health.
-. Any unauthorized, without prior written consents from LG Innotek, disassembly is prohibited if
purposed for reverse-engineering. All defected LEDs must be reported to LG Innotek and not to be
disassembled or analyzed.
-. The information or spec can be modified and upgraded without prior notice.
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SPECIFICATION
MODEL
LERRS6E00SM01
DOCUMENT No
2015-PLM-D03843
REG.DATE
2015.12.02
REV.No
1.1
REV.DATE
2016.03.03
PAGE
19
Change History of Revision
Revision
Date
0.0
15.09.07
New establishment
0.1
15.11.11
Characteristic Curves Standardization
1.0
15.12.02
Version Released
1.1
16.03.03
LG이노텍(주)
Contents of Revision Change
Remark
Lm Rank Changed
Al Bag Change (MSL indicated on the label A)
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