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Copyright © 2007 Year IEEE. Reprinted from International Solid States Circuits
Conference, ISSCC 2007, 11 - 15 February 2007.. This material is posted here with
permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE
endorsement of any of Institute of Microelectronics’ products or services. Internal or
personal use of this material is permitted. However, permission to reprint/republish this
material for advertising or promotional purposes or for creating new collective works for
resale or redistribution must be obtained from the IEEE by writing to [email protected].
ISSCC 2007 / SESSION 6 / UWB and mm-WAVE COMMUNICATIONS SYSTEMS / 6.2
6.2
A 0.18µm CMOS Dual-Band UWB Transceiver
Yuanjin Zheng, King-Wah Wong, M. Annamalai Asaru, Dan Shen,
Wen Hu Zhao, Yen Ju The, P. Andrew, Fujiang Lin, Wooi Gan Yeoh,
Rajinder Singh
Institute of Microelectronics, Singapore, Singapore
inductive feedback (realized by L2 and L5). To reduce power consumption without sacrificing the gain, a current reuse technique
is applied to the two cascoded transistors M1 and M2. The DA
measures a gain of 10.5dB and a passband of 3 to 9.5GHz while
drawing 5.4mA. Two stages of DA are cascaded in the TX to realize a pulse-shaping function that can comply with the FCC spectrum mask.
UWB is recognized as one of the most promising techniques for
short-range high-data-rate wireless applications such as wireless
USB, AV streaming, and cable replacement [1]. The current
implementions of UWB transceivers typically operate in the FCC
low band of 3 to 5GHz [2-4]. There is a necessity to extend to the
high band of 6 to 10GHz for two reasons. Firstly, to avoid the
strong interference from other communication systems operating
in the low band (e.g., WiMAX), some countries already considered
to extend UWB to the high band and leave the low band as an
option. Secondly, this could further improve transmission data
rates without significantly increasing the power consumption. In
this paper, a dedicated dual-band UWB transceiver architecture
is proposed which can selectively work at low, high, or both bands
of the UWB spectrum. Implemented in a 0.18µm CMOS process,
it can achieve high data rate transmissions.
A measured pulse sequence at the TX output and its spectrum are
shown in Fig. 6.2.3. The two parallel pseudo-digital data
sequences are upconverted by the 4GHz and 8GHz LO, respectively. The emission pulse sequence appears as the addition of
two upconverted pulses as shown in Fig. 6.2.3(a). The measured
spectrum of the pulse sequences is shown in Figure 6.2.3(b),
where the dual-band signals span from 3 to 5GHz and 7 to 9GHz
and fit into the FCC spectral mask.
Figure 6.2.1 shows the dual-band UWB transceiver architecture.
On the TX side, the parallel digital data bits (from a S/P converter) are converted to UWB pulses through pulse generators, which
are then DSB upconverted to two bands centered at frequencies
4 and 8GHz, respectively. The dual-band signals are combined,
pulse shaped, amplified, and applied to the antenna. On the RX
side, the weak signal is amplified by an LNA, followed by SSB I/Q
down-conversion mixers in the two bands, and then the downconverted signals are demodulated in parallel. The demodulated signals are converted to digital data by ADCs and then multiplexed
to a serial data through a P/S converter. The frequency synthesizer generates 4GHz and 8GHz LO signals concurrently.
The low-pass filter is used to reject strong out-of-band interference and also suppress the leaked high frequency pulse signal. It
is implemented by a 3rd-order active RC filter with cut-off frequency of 250MHz. The two-stage cascaded variable-gain amplifier achieves a dynamic gain from –10 to 45dB with a bandwidth
of 300MHz. A low-pass feedback network is used to reject the DC
offset with resulted cut-off frequency of 200kHz. The demodulator is implemented with two squarers and one nonlinear low-pass
filter (NLPF), as illustrated in Fig. 6.2.4. Here, the input stage
M7/M8 (M9/M10), common-mode input stage M17/M18 (M15/16),
and current mirror M4/M13 (M3/M11) work as a squarer. The two
squared currents are combined at the enhanced active load
M1/M5 and M2/M6 to achieve a high gain. A 3-stage NLPF is
used to extract different signal levels, where each stage is a common-mode-subtracted amplifier. Since the loading of the amplifier is an RC low-pass filter and a gate, thus the in-band DC level
can be boosted while out-off band noise and interference can be
filtered out. Through this demodulator, the data bits can be recovered. The demodulator has input sensitivity of 150mV with
4.8mA current draw.
As shown in Fig. 6.2.2, self-synchronized modulation and demodulation schemes are proposed. The digital input data signals (a)
and (b) are converted to spread-spectrum sequence (c) and (d) in
parallel through pulse generators. Data signals (c) and (d) are
upconverted by 4 and 8GHz LO, respectively, and then combined,
pulse shaped, and amplified. The output of the driver amplifier
(DA) is shown in (e). In the RX, signals (f) and (g) are the I/Q
downconverted, squared, and combined versions of the received
signals for the two bands, respectively. The low-pass filtered signal (applied to (f) and (g)) (h) and (i) can recover the transmitted
data (a) and (b) correspondingly. This receiver does not require
external synchronization since the LO phase uncertainty is eliminated by the SSB downconversion, squaring, and summation.
Furthermore, the digital data signals, upconverted to two bands,
are separated after the downconversion. Therefore this transceiver (TRX) allows concurrent operation of dual-band or one band at
a time.
The transmitter circuits are also shown in Fig. 6.2.2. First, a
high-speed XOR logic is used to act as a UWB pulse generator
where one of the inputs is the digital data and the other is the
1GHz system clock. The generated pulse is then band-limited by
a first-order RC filter. For the upconversion mixer, transistors M5
and M6 act as source followers to sense the large-swing input signal, and the generated current is steered through M1-M4 by LO
signals. A high linearity is achieved with 1Vpp linear operation
region for the RF input, and the two mixers are tuned to two
bands separately. The inductor peaking (realized by L1 and L2) is
used to expand the mixer bandwidth. The mixer achieves the following measured results: a conversion gain of –8dB, a noise figure of 8.2dB, and a –3dB bandwidth of 2.5GHz. The differential
outputs of the mixer are converted to single-ended through a
buffer without sacrificing the bandwidth, and the outputs from
two mixers are combined together. Also shown in Fig. 6.2.2 is a
DA. A wide bandwidth is achieved by combining two techniques,
namely inductive shunt peaking (realized by L3, L4, and L6) and
114
In the receiver, LNA is realized using a circuit similar to the DA
in Fig. 6.2.2 but the input matching is designed to be less than
–10dB across the 3 to 10GHz band. The mixer is basically a single-balanced Gilbert cell mixer with RC low-pass filtering at the
output to remove the high-frequency components. The combined
RF front-end achieves a voltage gain of 20.2dB, a noise figure of
5.6dB, and a –3dB bandwidth of 1.5GHz.
A separate ADC chip with a flash architecture and 4b resolution
is adopted for further signal processing in baseband. An integerN frequency synthesizer is implemented as shown in Fig. 6.2.4.
The quadrature VCO operates at 8GHz and generates a 4GHz
quadrature signal through a CML divider. The TSPC divider is
optimized for high-speed operation and low power consumption.
The measured phase noise is –100.15dBc/Hz at 1MHz offset for
8GHz LO with output power of –9.42dBm.
The transceiver IC is integrated in a 0.18µm CMOS process. The
chips are directly mounted on a PCB and evaluated. The transmitted data pattern (at TX input), the measured emitted pulse
pattern (at TX output), and the demodulated data pattern (at RX
demodulator output), generated by directly connecting TX/RX
and using an external LO for the purpose of testing, are shown in
Fig. 6.2.5. The transceiver performance is summarized in Fig.
6.2.6. The chip micrograph is shown in Fig. 6.2.7.
References:
[1] S. Roy, J.R. Foerster, V.S. Somayazulu, et al. “Ultrawideband Radio
Design: The Promise of High-Speed Short-Range Wireless Connectivity,”
Proc. IEEE, vol. 92, pp. 295-311, Feb., 2004.
[2] S. Lida, K. Tanaka, H. Suzuki, et al., “A 3.1 to 5 GHz CMOS DSSS UWB
Transceiver for WPANs,” ISSCC Dig. Tech. Papers, pp. 214-215, Feb.,
2005.
[3] C. Sandner, S. Derksen, D. Draxelmayr, et al., “A WiMedia/MBOACompliant CMOS RF Transceivers for UWB,” ISSCC Dig. Tech. Papers,
pp. 122-123, Feb., 2006.
[4] Y. Zheng, Y. Tong; C.W. Ang, et al. “A CMOS Carrier-less UWB
Transceiver for WPAN Applications,” ISSCC Dig. Tech. Papers, pp. 116117, Feb., 2006.
• 2007 IEEE International Solid-State Circuits Conference
1-4244-0852-0/07/$25.00 ©2007 IEEE.
ISSCC 2007 / February 12, 2007 / 2:00 PM
Mixer
LPF2
Squarer
VGA
Squarer
VGA
Squarer
VGA
Squarer
NLPF
8GHz LO (Q)
LNA
LPF2
4GHz LO (I)
Receiver (Rx)
NLPF
ADC
buffer
/2
8GHz Frequency
Synthesizer
buffer
8GHz LO (I/Q)
Frequency
Synthesizer
DA
1
Pulse Generator
8 GHz LO (I)
Pulse Clock
LPF1
Transmitter (TX)
Driver amplifier
6
Pulse Clock
Pulse Generator
4 GHz LO (I)
Series to Parallel to (S/P)
LPF1
D to S converter
TX mixer
VGA control
Mixer
Pulse
shaping
RX data
Baseband
Processor
4GHz LO (Q)
4GHz LO (I/Q)
Switch
LPF2
ADC
Demodulator
LPF2
Parallel to Series (P/S)
VGA
8GHz LO (I)
Antenna
TX data
(a)
0.5
(c)
2
0
0
4
0
0
1
(b)
100
200
300
0
0
4
400
(d)
100
200
300
400
1
(f)
0.5
100
200
300
400
(h)
2
0
0
100
200
300
2
(g)
0.5
0
0
0.5
100
300
400
(i)
-0.5
0
400
200
0
100
200
300
400
1
0
0
0.5
100
200
300
400
100
200
300
400
0
-0.5
0
4
2
(e)
0
-2
-4
0
50
100
150
200
250
300
350
400
Figure 6.2.2: Pulsed TX circuits and modulation/demodulation scheme.
Figure 6.2.1: The dual-band UWB transceiver system architecture.
Digital data for 8GHz upconversion
Digital data for 4GHz upconversion
3.1GHz
FCC UWB spectral mask
Nonlinear LPF
Squarer and Combiner
To 8GHz I/Q output buffer
QVCO
8GHz upconverted data
4GHz upconverted data
4GHz
Divider by 2
CML
Buffer
TSPC
TSPC Divider
Divider
8GHz
(b)
(a)
To 4GHz I/Q output buffer
Figure 6.2.3: Measured TX pulses and spectrum:
(a) time-domain pulses, (b) frequency spectrum.
LPF
Figure 6.2.4: The demodulator circuit schematic and the frequency synthesizer
diagram.
Receiver
(a) (channel 2)
RX Noise Figure
RX Sensitivity
(b) (channel 1)
(c) (channel 4)
5ns/div, 4GHz LO, 250Mb/s
Ref Clock
PFD & CP
Transmitter
8.6 to 9.4dB
-79 to -76dBm
Transmitted Power
-2dBm
Digital data input range
1V peak-to-peak
IIP3 at Max Gain
-10.3dBm @ 4GHz
-8.2dBm @ 8GHz
TX Bandwidth (-10dB)
2GHz for each band
IIP3 at Reduced Gain
-2.2dBm @ 4GHz
0.2dBm @ 8GHz
TX Current Dissipation
55mA
RX P-1 dB
-24dBm to -22dBm
300Mbps @ BER10 3
(400Mbps@ BER10 2)
for each band
TX data rate (Maximum)
Selectivity (5.5GHz tone)
>30dB rejection
(a) (channel 2)
RX Current Dissipation
(b) (channel 1)
VGA Gain Range
(c) (channel 4)
LPF Bandwidth
76mA
5-6 GHz notch
-10 to 45dB
>20dB
Overall
Supply Voltage
5ns/div, 8GHz LO, 250Mb/s
Figure 6.2.5: Measured RX outputs: (a) transmitted data pattern (b) emitted data
pattern (c) recovered data pattern.
250MHz
Technology
TRX Die Size
Detector Sensitivity
150mV
Frequency synthesizer
1.8V
0.18-µm CMOS
16.7mm²
4GHz & 8GHz Quadrature
Figure 6.2.6: Summary of transceiver performance.
Continued on Page 590
DIGEST OF TECHNICAL PAPERS •
115
ISSCC 2007 PAPER CONTINUATIONS
LNA+Mixers
Frequency
Synthesizer
VGAs
TX Mixers
Demodulators
Driver Amplifiers
Figure 6.2.7: TRX chip micrograph.
590
• 2007 IEEE International Solid-State Circuits Conference
1-4244-0852-0/07/$25.00 ©2007 IEEE.