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Introduction to VLSI Circuit Design Problem set #3 (Due date: Nov. 10, 2008(中午12pm)) 請班代收集交到610實驗室 ____________________________________________________________ 1. A method for reducing interconnection resistance in the polysilicon lines is to use silicide material deposited on top to form polycide. This process can reduce the nominal sheet resistance from 20 to 2 or even less. For the same purpose, silicide material is also deposited on top of source of silicide can be achieved on polysilicon gates and source and drain regions of MOS transistors. Discuss how such deposition can be achieved without causing electrical shorts between the gate and source or drain of an individual transistor. 2. Exercises 3.7 on page 155 3. Exercises 3.8 on page 155 4. Explain why substrate and well contacts are important in CMOS. VDD 5. The following figure presents a simple CMOS layout (assuming p-well process on n-substrate). (a). Study the layout, and from it produce a circuit diagram. (b). Explain the nature and purpose of the circuit. (c). Draw the cross section along the a-a’ line ( ). n+ m as p+ active k output A a’ a VS S p+ m as k B C