Download High efficiency electronic cooking systems

CALL 2010
Project profile
HEECS
High efficiency electronic cooking systems
Microwave ovens are now based on bulky magnetrons that
have reached their limits of performance and energy efficiency
while occupying a relatively large space. Furthermore,
there are currently no energy labels used in the market for
these appliances. While current standards provide a helpful
comparative test protocol, they do not allow for a full spectrum of
efficiency measurements, representative of realistic use scenarios.
The ENIAC JU project HEECS is addressing the operational
specifications of electronic cooking systems to improve their
efficiency and define a complete set of European standards.
Sub Programme
„„ Nanoelectronics for energy
efficiency
„„ Design methods and tools for
nanoelectronics
„„ Silicon process and integration
In Europe, microwave ovens consume
quently the system as a whole is more
currently some 12.8 TWh of energy a
efficient than the current magnetron
year. They generate heat using the
technology.
radio frequency (RF) radiation of a
One major issue affecting current
magnetron, a rather old-fashioned
micro­wave efficiency is the strongly
method which consumes a lot of en-
fluctuating load on the magnetron
ergy with relatively poor efficiency –
microwave source. This is a function
for nanoelectronics
around 40% to 50% or less, depend-
of the type, volume and location of
„„ Equipment, material,
ing on food type and product design.
the food within the microwave cavity.
The ENIAC JU project HEECS is focus-
To handle the enormous load fluctua-
ing on innovative technologies to re-
tions, the microwave source is heavily
duce energy consumption of domes-
over dimensioned. In addition, the
tic microwave ovens by 25%. Such an
path to the microwave cavity is very
improvement would therefore save
susceptible to energy losses. To over-
more than 3.2 TWh a year.
come these drawbacks, the HEECS
processing for nanoelectronics
project team will investigate the
Green and modular
adoption of multiple solid-state am-
HEECS will take a green and modular
plifier silicon based components and
approach. Modularity involves split-
generators units with several aerials,
ting the microwave system into differ-
each with its individual signal con-
ent modules – patch aerial, RF hybrid
trol.
power board and transistors, RF signal conditioning board, thermal and
A revolutionary approach
packaging modules – and focusing
Breakthrough technologies in the
on increasing the energy efficiency
HEECS project will include:
of each element. The approach will
1. New and improved semiconduc-
be green because it will ensure that
tor process technologies, devices
each module is improved and conse-
and integrated circuits featuring
HEECS
submicron lithographic dimen-
monolithic
sions and layer stack control;
circuits. Improvements in overall ef-
2. An improved thermal manage-
ficiency will be obtained by improved
Partners:
ment system capable of efficient-
impedance matching for each heat-
ly cooling the RF circuit package
ing operation. Integrated circuits will
and making use of the dissipated
be studied to manage the control of
heat energy in an efficient way;
multiple RF power amplifiers.
microwave
integrated
Energy efficiency
3.Intelligent electromagnetic field
New wide-band materials systems,
controllers optimising the micro-
such as gallium nitride (GaN) tech-
wave energy transfer to the food
nology, will be explored and new de-
„„ Bergh Hybrid Circuits
„„ Chalmers University of Technology
„„ ComHeat Microwave
„„ Delft University of Technology
„„ NXP Semiconductors Netherlands
„„ Plextek
„„ University of Padua
„„ Warsaw University of Technology
„„ Whirlpool Europe
„„ Whirlpool Sweden
and the energy distribution with-
vices will be produced to benefit from
Project co-ordinator:
in the food that will use monolith-
the enormous performance potential
„„ Fredrik Hallgren, Whirlpool Sweden
ic microwave integrated circuits
of GaN in terms of power density
Key project dates:
and dedicated microcontrollers
and efficiency as well as its excellent
in high-end integration technolo-
thermal properties due to the use of
„„ Start: March 2011
„„ Finish: February 2014
gies; and
silicon carbide substrates. With this
Countries involved:
4. Optimised configuration and sys-
work, the peak power added effi-
tems architecture delivering opti-
ciency is expected to rise from a cur-
mum efficiency of the hardware,
rent 50% to above 60%, reducing the
„„ Italy
„„ The Netherlands
„„ Poland
„„ Sweden
„„ United Kingdom
firmware and software compon­
wasted power by 20%.
Total budget:
ents – such as aerial, RF transis-
„„ €4.99 million
tor, RF emission drive control and
New standards/markets
packaging modules.
The primary aim of the ENIAC JU
By achieving and integrating these
project HEECS is to combine syner-
four main technical objectives, HEECS
getically the skills and experience of
will improve the energy efficiency of
leading European specialists to ad-
future microwave ovens and dramati-
dress the operational specifications
cally change the entire concept for the
of electronic cooking systems with
better. It will migrate from a tradition-
much improved energy efficiency
al magnetron source to an innovative
and to establish a complete set of
silicon-based solid-state RF system us-
Euro­pean standards. This will in turn
ing optimised silicon-based solid-state
open up marketing opportunities on
components, dedicated aerials and
a worldwide scale and reinforce the
the RF dissipation – waste energy –
leading role of European domestic
for convective and other food-heating
appliance manufacturers.
techniques, such as steam heating or
Many other applications could also
direct infrared radiation.
benefit from HEECS technologies.
Details correct at time of print but subject to possible
change. Updates will be included in the project
summary at the end of the project.
These could include: pharmaceuti-
Advanced devices
cals preparation; plasma lighting;
The ENIAC JU project will investigate
drying cereal grains and powders;
a new way to focus electromagnetic
improved base station technology for
field intensity and to enhance power
mobile phones; and low cost, high
distribution to the food by means of
power solid-state scanning radar.
The ENIAC Joint Undertaking, set up in February 2008, co-ordinates European
nanoelectronics research activities through competitive calls for proposals. It takes
public-private partnerships to the next level, bringing together the ENIAC member
states, the European Commission and AENEAS, the association of R&D actors in this
field, to foster growth and reinforce sustainable European competitiveness.
ENIAC Joint Undertaking • Brussels • Belgium
Tel : +32 2 221 81 02 • email: [email protected] • website: www.eniac.eu