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Component structure of electrical and electronic equipment
Family Family
#
1
Wire, Cable, Connectors,
Cable Assemblies, IC
Sockets
2
3
Switches, Relays,
Electromechanical
Components
Semiconductors, ICs,
Transistors, Diodes
Group
Wire
Cable
Connectors
Connectors / Cable
Assemblies
Switches
Relays
Electromechanical
Components
Fuses and arresters
Subgroup
#
1.1
1.2
1.3
1.4
1.5
2.1
2.2
2.3
2.4
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
Subgroup / Typical Components
to be defined and differentiated
to be defined and differentiated
Connector Metal Housing
Connector Plastic Housing
to be defined and differentiated
to be defined and differentiated
to be defined and differentiated
to be defined and differentiated
Surge voltage arrester
Plastic axial diode
Surface mount diode in melf packages
Power schottky and rectifier diode
Trisil, transil and schottky diodes in plastic packages
Thyristors
Small signal transistors in metal can packages
Power products in TO3 packages
Small signal transistors in TO92 package
Small outline transistors and diodes – low power
Small outline transistors and diodes – high power
Surface mount devices medium power transistors
Through hole package medium power transistors
Medium/high power transistor/thyristor isolated packages
GBU package
R.F. hermetic packages with stud
R.F. ceramic packages with stud
R.F. hermetic flanged packages
R.F. studless ceramic packages
R.F. ceramic flanged packages
Ceramic dual in line package
Frit-seal ceramic package with bulls-eye (lens)
Component structure of electrical and electronic equipment
3.22
3.23
3.24
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
3.36
3.37
3.38
3.39
3.40
3.41
3.42
3.43
3.44
3.45
3.46
3.47
3.48
3.49
3.50
3.51
3.52
3.53
3.54
Side brazed ceramic dual in line package with and without
lens
J leaded chip carrier
Ceramic leaded chip carrier
Ceramic quad flat packages
Ceramic pin grid array
Dual in line plastic packages – frame 0.25
Power dual in line plastic packages – frame 0.40
Shrink dual in line plastic packages
P-dip zeropower/timekeeper
Small outline plastic packages
Shrink small outline plastic packages
Power SO packages
TO220 packages
Multiwatt
Pentawatt, heptawatt
Flexiwatt packages
Clipwatt packages
Single in line plastic packages
Plastic leaded chip carrier
Thin quad flat packages
Low quad flat packages
Plastic quad flat packages
High quad packages
Thin small outline packages – frame Cu
Thin small outline packages – frame Alloy42
Thin small small outline packages
Low profile ball grid array packages
Thin fine pitch ball grid array packages
Low profile fine pitch ball grid array packages
Plastic ball grid array packages
Very-thin-profile fine pitch ball grid array packages
Very thin fine pitch quad flat package no lead
Flip chip CSP
Component structure of electrical and electronic equipment
4
Capacitors
Electrolytic Capacitors
Ceramic Capacitors
Metallized Film Capacitors
5
Tantalum Capacitors
Resistors, Potentiometers, Leaded Resistors
Thermistor NTC
SMD Resistors
3.55
3.56
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
5.20
Micromodule (potting or molding process)
Micromodule with metal ring
Speciality Polymer Aluminium Electrolytic Capacitor (SMD)
Aluminium Electrolytic Capacitor (axial)
Aluminium Electrolytic Capacitor (radial)
Aluminium Electrolytic Capacitor (Screw)
Aluminium Electrolytic Capacitor (SMD)
Aluminium Electrolytic Capacitor (Snap In)
Aluminium Electrolytic Capacitor (Snap In - TS type)
Ceramic Capacitor MLCC
Metallized Film Capacitor (Boxed)
Metallized Film Capacitor (uncoated)
Metallized Film Capacitor (Film Chip Capacitor)
Tantalum Capacitor (SMD)
Cemented wirewound
Cemented wirewound precision
Low ohmic surge
Low ohmic
High ohmic / high voltage
Professional / Precision
Fusible
Professional power metal film
Radial mounted power film
Radial mounted power wirewound
Standard metal film
Stand-up miniature power film
Stand-up miniature wirewound
Ultra precision
SMD Array
SMD Flat chip
SMD Thick film flat array
Thick film flat chip
MELF
SMD Power thick film flat chip
Component structure of electrical and electronic equipment
Potentiometers
Thermistor NTC
6
7
8
9
10
11
12
13
Inductors, Coils, Filters,
Transformers, Power
Supplies
Active Radio Frequency
Products and Antennas
Crystals, Oscillators
Optoelectronics, LEDs,
LCDs, Lasers, Displays
Audioelectronics,
Speakers, Microphones
Electric motors, fans
Printed Circuit Boards,
Multilayer, Flexlayer
Solder
to be defined and
differentiated
to be defined and
differentiated
to be defined and
differentiated
to be defined and
differentiated, part of family 3
to be defined and
differentiated
to be defined and
differentiated
ZVEI: functional model
available
to be defined and
differentiated, part of family 3
5.21
5.22
5.23
6.1
7.1
8.1
9.1
10.1
11.1
12.1
13.1
to be defined / differentiated
Thermistor NTC (disk)
Thermistor NTC (SMD)
ZVEI: Group A to T; assignment to functional groups not
possible