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Team 13:
Doug Brunner
Adam Fauer
Claire Jones
Michael Klein
Next Generation Laminator
Sponsors: David Timpe, Geno Amalfatino
Advisor: Dr. James Glancey
Problem
Current laminating processes
encounter high amounts of
voids between a silicone
adhesive and a circuit board.
Voids will not allow for proper
heat transfer and could cause
the circuit board to overheat.
Test Plan
Arlon
70% Voids!
Arlon is the manufacturer of Thermabond®, a silicone adhesive
used to laminate circuit boards to heat sinks. Arlon wishes to
expand sales of this product by introducing an improved method
of applying Thermabond®.
Our Solution
•A double chamber vacuum box in a
clamshell design
Project Goal
•Pressure applied from the top half
Laminator: Open View
Workholding Frame
•Frame will hold circuit board
above heat sink for first step of
vacuum
•Springs will compress and lower
the frame holding the circuit board
onto the heat sink when pressure
from top half is applied
Vacuum Bagging System
http://torrtech.com
Ease of Use
Circuit Board
Laminator with Vacuum/Pressure Operation
http://www.meikiss.co.jp/e_lineup/e_mvlp.htm
Prototyped workholding
fixed clamp frame proves
to hold a circuit board by
the edges.
5% or less
±0.005 inches
Laminate boards up to 24 inches square
Speed (temperature ramp rates)
Temperature and Pressure Controls
12ºF/min heating
40ºF/min cooling
400ºF max.
50 psia max.
Senior Design Team
Laminator
Type
Vacuum Bag (current
method)
Next Generation
Laminator (new
method)
Laminate
Sizes
12 tests of 6 in. x 8 in. 12 tests of 6 in. x 8 in.
New design for
workholding
mechanism will
retract clamps.
12 tests of 4 in. x 4 in. 12 tests of 4 in. x 4 in.
Number of
Operators
2
2
Materials
0.125 in. glass /
Thermabond / 0.125 in
glass
0.125 in. glass /
Thermabond / 0.125
in glass
Number of
Lots of
Thermabond
2
2
No. of Tests
24
24
Want/Metric
Key Customer Wants and Metrics
Alignment Accuracy
Arlon
Expected Performance
Initial Validation
Void Reduction
Factors
•Heaters and coolers in the bottom half
Our goal is to design an automated process that
will create a void-free bond between a silicone
adhesive, a circuit board and an aluminum plate.
Current Technology
Design of Experiments
Senior Design Team
<5% void
Yes
Automantion
Yes
±0.005 inches
accuracy
Reaches 400ºF
Yes
Reaches 50 psia
Yes
Yes
Acknowledgements
We sincerely appreciate everyone who has given us the
opportunity to have a successful senior design. Special
thanks to our sponsors at Arlon for their support in this
project. Also, thank you Ann Connor, Mr. Beard, and
Dr. Glancey for your guidance and instruction.