D-TEK LM Vehicle Loop Detector Operating Instructions
... There is no skimping on the quality in the D-TEK detector. All the switches have gold plated contacts and are sealed for protection. The detector is protected by easily replaceable fuse, snubbing circuitry on the relay contacts, metal oxide varistor on the power input and triple protection on the lo ...
... There is no skimping on the quality in the D-TEK detector. All the switches have gold plated contacts and are sealed for protection. The detector is protected by easily replaceable fuse, snubbing circuitry on the relay contacts, metal oxide varistor on the power input and triple protection on the lo ...
MM74HC573 3-STATE Octal D
... 3-STATE Octal D-Type Latch General Description The MM74HC573 high speed octal D-type latches utilize advanced silicon-gate P-well CMOS technology. They possess the high noise immunity and low power consumption of standard CMOS integrated circuits, as well as the ability to drive 15 LS-TTL loads. Due ...
... 3-STATE Octal D-Type Latch General Description The MM74HC573 high speed octal D-type latches utilize advanced silicon-gate P-well CMOS technology. They possess the high noise immunity and low power consumption of standard CMOS integrated circuits, as well as the ability to drive 15 LS-TTL loads. Due ...
MP816-93.1-1% - Caddock Electronics, Inc.
... Use your thermal design experience with power semiconductors in the TO-220 and TO-126 style power package. This experience will help you get the most out of this unique family of power resistors. The thermal design issues are the same where power handling capability is based on the case temperature ...
... Use your thermal design experience with power semiconductors in the TO-220 and TO-126 style power package. This experience will help you get the most out of this unique family of power resistors. The thermal design issues are the same where power handling capability is based on the case temperature ...
MM74HC574WMX - West Florida Components
... at the D inputs, meeting the set-up and hold time requirements, are transferred to the Q outputs on positive going transitions of the CLOCK (CK) input. When a high logic level is applied to the OUTPUT CONTROL (OC) input, all outputs go to a high impedance state, regardless of what signals are presen ...
... at the D inputs, meeting the set-up and hold time requirements, are transferred to the Q outputs on positive going transitions of the CLOCK (CK) input. When a high logic level is applied to the OUTPUT CONTROL (OC) input, all outputs go to a high impedance state, regardless of what signals are presen ...
CHA2110-QDG
... down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tb) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below the maximum value specified in ...
... down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tb) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below the maximum value specified in ...
MM74HCT138
... 3-to-8 Line Decoder General Description The MM74HCT138 decoder utilizes advanced silicon-gate CMOS technology, and are well suited to memory address decoding or data routing applications. Both circuits feature high noise immunity and low power consumption usually associated with CMOS circuitry, yet ...
... 3-to-8 Line Decoder General Description The MM74HCT138 decoder utilizes advanced silicon-gate CMOS technology, and are well suited to memory address decoding or data routing applications. Both circuits feature high noise immunity and low power consumption usually associated with CMOS circuitry, yet ...
BDTIC www.BDTIC.com/infineon Re comm en dat ion for Han d lin... an d Ass e mbly of I nfine o n
... Detailed Packing Drawings http://www.infineon.com/packages ...
... Detailed Packing Drawings http://www.infineon.com/packages ...
Quadruple 2-Input Positive-OR Gate (Rev. C)
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
Specific Lighting
... (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. © This LED should be used under forward current, particularly not used under continuous reverse current to avoid the damage to LED. ...
... (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. © This LED should be used under forward current, particularly not used under continuous reverse current to avoid the damage to LED. ...
Assembly and Checkout - StoutWare Engineering
... connecting power, you most likely did something wrong during construction, and probably did damage to the circuit when the spark jumped. ...
... connecting power, you most likely did something wrong during construction, and probably did damage to the circuit when the spark jumped. ...
MM74HC374 3-STATE Octal D-Type Flip-Flop
... at the D inputs, meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions of the CLOCK (CK) input. When a high logic level is applied to the OUTPUT CONTROL (OC) input, all outputs go to a high impedance state, regardless of what signals are present ...
... at the D inputs, meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions of the CLOCK (CK) input. When a high logic level is applied to the OUTPUT CONTROL (OC) input, all outputs go to a high impedance state, regardless of what signals are present ...
TLE4906-3K - Infineon Technologies
... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Inf ...
... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Inf ...
Multivibrators - Slot Tech Forum
... the Set state for a short while, then reverts back to the Clear state on its own. Monostable Multivibrators are often called Single Shots, One Short, Pulse Generators or many similar names. A Resistor and Capacitor normally determines the length of time it stays in the Set state. The Time Constant f ...
... the Set state for a short while, then reverts back to the Clear state on its own. Monostable Multivibrators are often called Single Shots, One Short, Pulse Generators or many similar names. A Resistor and Capacitor normally determines the length of time it stays in the Set state. The Time Constant f ...
Logic Lab 1 . - Fordham University
... In this lab, the student will learn the basic techniques of connecting input logic voltages to a logic gate, and displaying the output logic levels using an LED. A typical smallscale logic integrated circuit (IC) will be used to demonstrate a logic function, which will be interpreted using both posi ...
... In this lab, the student will learn the basic techniques of connecting input logic voltages to a logic gate, and displaying the output logic levels using an LED. A typical smallscale logic integrated circuit (IC) will be used to demonstrate a logic function, which will be interpreted using both posi ...
current
... 1. Life support devices or systems are devices or systems device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the sonably expected to cause the failure of the life support body, or (b) support or sustain life, and (c) whose failure device or system, ...
... 1. Life support devices or systems are devices or systems device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the sonably expected to cause the failure of the life support body, or (b) support or sustain life, and (c) whose failure device or system, ...
LM2937 - Solarbotics.net
... It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the design. For aluminum electrolytic capacitors, ESR will increase by about 3 ...
... It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the design. For aluminum electrolytic capacitors, ESR will increase by about 3 ...
packaging
... Mechanical interface to PCB Interface for production testing Good signal transfer between chip and PCB Good power supply to IC Cooling Small Cheap ...
... Mechanical interface to PCB Interface for production testing Good signal transfer between chip and PCB Good power supply to IC Cooling Small Cheap ...
packaging
... Mechanical interface to PCB Interface for production testing Good signal transfer between chip and PCB Good power supply to IC Cooling Small Cheap ...
... Mechanical interface to PCB Interface for production testing Good signal transfer between chip and PCB Good power supply to IC Cooling Small Cheap ...
fundamentals of ic assembly - Department of Electrical, Computer
... Fully testable, plastic model, quad-flat-pack Leads on all four sides of the surface mountable package ...
... Fully testable, plastic model, quad-flat-pack Leads on all four sides of the surface mountable package ...
Dual General-Purpose Operational Amplifiers
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
CD4541B (Rev. E) - Texas Instruments
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
Document
... While there are package standards, some components use package variants with different land patterns Proper patterns can always be found in datasheet or by contacting manufacturer Guideline: verify land patterns with component specs if pattern has not been tested in one month. Pay attention to easil ...
... While there are package standards, some components use package variants with different land patterns Proper patterns can always be found in datasheet or by contacting manufacturer Guideline: verify land patterns with component specs if pattern has not been tested in one month. Pay attention to easil ...
PPT - Edutek
... use a spacer (6mm) to space the LEDs far enough from the PCB to clear the other components. 6mm spacer ...
... use a spacer (6mm) to space the LEDs far enough from the PCB to clear the other components. 6mm spacer ...
ISOPLUS-DIL™ Series Designed for Highest Reliability
... Power cycling induces the stress by power loss variations in the die. Especially at low voltage designs these losses are correlated with high current loads. For example: A 25 mm² 1200V IGBT die can handle about 30 A but a 40 V Trench MOSFET die of same size approximately 220 A. Typically the top con ...
... Power cycling induces the stress by power loss variations in the die. Especially at low voltage designs these losses are correlated with high current loads. For example: A 25 mm² 1200V IGBT die can handle about 30 A but a 40 V Trench MOSFET die of same size approximately 220 A. Typically the top con ...
Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.DIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a printed circuit board by inserting the pins through holes in the board and soldering them in place. Where frequent replacement of the parts is desired, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a zero insertion force mechanism.Variations of the DIP package include those with only a single row of pins, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a printed circuit board and which allow higher density of interconnections.