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Xenon Difluoride
High purity XeF2 is used in the MEMS segment of the semiconductor industry as a selective silicon etch gas. XeF2 etches
silicon isotropically at high speed without the use of a plasma. The process is dry with only Xe and SiF4 being released as
gaseous products. The XeF2 is free of any XeF4 contamination.
Identification of Substance
Synonyms:
Xenon (II) fluoride; Xenon fluoride
Chemical Formula:
XeF2
UN No:
1479
HS Code:
2812 90
CAS No:
13709-36-9
Physical & Chemical Properties
Specifications
Purity:
99.999%
Free of any XeF4 contamination
Markets / Applications
Semiconductor:
MEMS (Micro Electro Mechanical
Systems)
FIB (Focussed Ion Beam)
Pharmaceutical: Organic Fluorination
Form:
Solid
Colour:
White
Odour:
Pungent
Density:
4.32 kg/L
Molecular Weight:
169.29
Melting Point:
129°C
Boiling Point:
114°C
Vapour Pressure:
0.5 kPa (4 Torr) at 25oC
Packaging Type & Sizes
PTFE bottles, customer supplied canisters or aluminium
gas cylinders
Picture of packaging options
Material Safety Data Sheet (MSDS)
Xenon Difluoride - XeF2
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