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FGH50N3 300 V SMPS IGBT April 2013 FGH50N3 300 V SMPS IGBT General Description Features Using Fairchild®'s planar technology, this IGBT is ideal for many high voltage switching applications operating at high frequencies where low conduction losses are essential. This device has been optimized for medium frequency switch mode power supplies. • Low Saturation Voltage: VCE(sat) = 1.4 V max • Low EOFF = 6.6 uJ/A • SCWT = 8 us @ = 125℃ • 300V Switching SOA Capability Applications • Positive Temperature Coefficient above 50 A • SMPS Package Symbol E C C G TO-247 G COLLECTOR (FLANGE) E Device Maximum Ratings TC= 25°C unless otherwise noted Symbol BVCES Parameter Collector to Emitter Breakdown Voltage Ratings 300 Unit V IC25 Collector Current Continuous, TC = 25°C 75 A IC110 Collector Current Continuous, TC = 110°C 75 A Collector Current Pulsed (Note 1) 240 A VGES Gate to Emitter Voltage Continuous ±20 V VGEM Gate to Emitter Voltage Pulsed ±30 V SSOA Switching Safe Operating Area at TJ = 150°C, Figure 2 ICM 150A at 300V EAS Single Pulse Avalanche Energy, ICE = 30A, L = 1.78mH, VDD = 50V 800 mJ EARV Single Pulse Reverse Avalanche Energy, IEC = 30A, L = 1.78mH, VDD = 50V 800 mJ Power Dissipation Total TC = 25°C 463 W Power Dissipation Derating TC > 25°C 3.7 W/°C PD TJ Operating Junction Temperature Range -55 to 150 °C TSTG Storage Junction Temperature Range -55 to 150 °C tSC Short Circuit Withstand Time (Note 2) 8 µs CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 180V, TJ = 125°C, VGE = 12Vdc, RG = 5Ω www.BDTIC.com/FAIRCHILD ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. C0 1 www.fairchildsemi.com Device Marking FGH50N3 Device FGH50N3 Package TO-247 Tape Width N/A Quantity 30 Electrical Characteristics TJ = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Unit Off State Characteristics BVCES Collector to Emitter Breakdown Voltage ICE = 250µA, VGE = 0V 300V - - V BVECS Emitter to Collector Breakdown Voltage IEC = 10mA, VGE = 0V 15V - - V ICES IGES Collector to Emitter Leakage Current Gate to Emitter Leakage Current VCE = 300V TJ = 25°C - - 250 µA TJ = 125°C - - 2.0 mA - - ±250 nA TJ = 25°C - 1.30 1.4 V TJ = 125°C - 1.25 1.4 V VGE = 15V - 180 - nC VGE = 20V - 228 - nC VGE = ± 20V FGH50N3 300 V SMPS IGBT Package Marking and Ordering Information On State Characteristics VCE(SAT) Collector to Emitter Saturation Voltage ICE= 30A VGE = 15V Dynamic Characteristics QG(ON) VGE(TH) VGEP Gate Charge ICE = 30A VCE = 150V Gate to Emitter Threshold Voltage ICE = 250µA, VCE = VGE 4.0 4.8 5.5 V Gate to Emitter Plateau Voltage ICE = 30A, VCE = 150V - 7.0 - V 150 - - A Switching Characteristics SSOA Switching SOA TJ = 150°C, RG = 5Ω, VGE = 15V , L = 25µH, Vce = 300V td(ON)I Current Turn-On Delay Time IGBT and Diode at TJ = 25°C, ICE = 30A, VCE = 180V, VGE = 15V, RG = 5Ω, L = 100µH, Test Circuit - Figure 20 - 20 - ns - 15 - ns - 135 - ns - 12 - ns - 130 - µJ - 92 120 µJ IGBT and Diode at TJ = 125°C, ICE = 30A, VCE = 180V, VGE = 15V, RG = 5Ω, L = 100µH, Test Circuit - Figure 20 - 19 - ns TO-247 trI td(OFF)I tfI Current Rise Time Current Turn-Off Delay Time Current Fall Time EON2 Turn-On Energy (Note 1) EOFF Turn-Off Energy (Note 2) td(ON)I Current Turn-On Delay Time trI td(OFF)I tfI Current Rise Time Current Turn-Off Delay Time Current Fall Time EON2 Turn-On Energy (Note 1) EOFF Turn-Off Energy (Note 2) - 13 - ns - 155 190 ns - 7 15 ns - 225 270 µJ - 135 200 µJ - - 0.27 °C/W Thermal Characteristics RθJC Thermal Resistance Junction-Case NOTE: EON2 is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in figure 20. 1. 2. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. www.BDTIC.com/FAIRCHILD ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. C0 2 www.fairchildsemi.com FGH50N3 300 V SMPS IGBT Typical Performance Curves TJ = 25°C unless otherwise noted 200 ICE, COLLECTOR TO EMITTER CURRENT (A) 175 160 120 80 PACKAGE LIMITED 40 0 150 125 100 75 50 25 0 25 50 75 100 125 TC , CASE TEMPERATURE 150 500 30 75oC 300 VGE = 15V 200 VGE = 10V fMAX1 = 0.05 / (td(OFF)I + td(ON)I) fMAX2 = (PD - PC) / (EON2 + EOFF) 100 PC = CONDUCTION DISSIPATION (DUTY FACTOR = 50%) RØJC = 0.27oC/W, SEE NOTES 60 200 250 300 10 350 800 VCE = 180V, RG = 5Ω, TJ = 125oC 25 700 tSC 20 ISC 600 15 500 10 400 5 300 200 0 2 20 9 100 10 ICE, COLLECTOR TO EMITTER CURRENT (A) 11 12 13 14 16 15 VGE , GATE TO EMITTER VOLTAGE (V) Figure 3. Operating Frequency vs Collector to Emitter Current Figure 4. Short Circuit Withstand Time 60 60 DUTY CYCLE < 0.5%, VGE = 10V PULSE DURATION = 250µs ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) 150 Figure 2. Minimum Switching Safe Operating Area tSC , SHORT CIRCUIT WITHSTAND TIME (µs) TC = 100 VCE, COLLECTOR TO EMITTER VOLTAGE (V) TJ = 125oC, RG = 5Ω, L = 100µH, V CE = 180V 400 50 0 (oC) Figure 1. DC Collector Current vs Case Temperature fMAX, OPERATING FREQUENCY (kHz) TJ = 150oC, RG = 5Ω, VGE = 15V, L = 25µH ISC, PEAK SHORT CIRCUIT CURRENT (A) ICE , DC COLLECTOR CURRENT (A) VGE = 15V 50 40 30 TJ = 25oC 20 TJ = 150oC 10 TJ = 125oC 0 DUTY CYCLE < 0.5%, VGE = 15V PULSE DURATION = 250µs 50 40 30 TJ = 25oC 20 TJ = 150oC 10 TJ = 125oC 0 0.25 0.5 0.75 1.0 1.25 1.5 1.75 2.0 0.25 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 0.5 0.75 1.0 1.25 1.5 1.75 VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 5. Collector to Emitter On-State Voltage Figure 6. Collector to Emitter On-State Voltage www.BDTIC.com/FAIRCHILD ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. C0 3 www.fairchildsemi.com FGH50N3 300 V SMPS IGBT Typical Performance Curves TJ = 25°C unless otherwise noted (Continued) 1.4 400 RG = 5Ω, L = 100µH, VCE = 180V 1.2 EOFF TURN-OFF ENERGY LOSS (µJ) EON2 , TURN-ON ENERGY LOSS (mJ) RG = 5Ω, L = 100µH, VCE = 180V 1.0 TJ = 25oC, TJ = 125oC, VGE = 10V 0.8 0.6 0.4 0.2 350 300 250 TJ = 125oC, VGE = 10V, VGE = 15V 200 150 100 50 TJ = 25oC, VGE = 10V, VGE = 15V TJ = 25oC, TJ = 125oC, VGE = 15V 0 0 0 10 20 30 40 50 60 0 ICE , COLLECTOR TO EMITTER CURRENT (A) 20 40 50 60 Figure 8. Turn-Off Energy Loss vs Collector to Emitter Current 35 100 RG = 5Ω, L = 100µH, VCE = 180V RG = 5Ω, L = 100µH, VCE = 180V 80 trI , RISE TIME (ns) 30 TJ = 25oC, TJ = 125oC, VGE = 10V 25 60 TJ = 25oC, TJ = 125oC, VGE = 10V 40 20 20 TJ = 25oC, TJ = 125oC, VGE = 15V 15 TJ = 25oC, TJ = 125oC, VGE =15V 0 0 10 20 30 40 50 0 60 ICE , COLLECTOR TO EMITTER CURRENT (A) 10 20 30 40 50 60 ICE , COLLECTOR TO EMITTER CURRENT (A) Figure 9. Turn-On Delay Time vs Collector to Emitter Current Figure 10. Turn-On Rise Time vs Collector to Emitter Current 170 24 RG = 5Ω, L = 100µH, VCE = 180V RG = 5Ω, L = 100µH, VCE = 180V 160 20 150 tfI , FALL TIME (ns) td(OFF)I , TURN-OFF DELAY TIME (ns) 30 ICE , COLLECTOR TO EMITTER CURRENT (A) Figure 7. Turn-On Energy Loss vs Collector to Emitter Current td(ON)I, TURN-ON DELAY TIME (ns) 10 TJ = 25oC, TJ = 125oC, VGE = 15V 140 130 120 16 TJ = 25oC, VGE = 10V, 15V 12 8 TJ = 125oC, VGE = 10V, 15V 4 110 TJ = 25oC, TJ = 125oC, VGE = 10V 0 100 0 10 20 30 40 50 60 0 ICE , COLLECTOR TO EMITTER CURRENT (A) 10 20 30 40 50 60 ICE , COLLECTOR TO EMITTER CURRENT (A) Figure 11. Turn-Off Delay Time vs Collector to Emitter Current Figure 12. Fall Time vs Collector to Emitter Current www.BDTIC.com/FAIRCHILD ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. C0 4 www.fairchildsemi.com FGH50N3 300 V SMPS IGBT Typical Performance Curves TJ = 25°C unless otherwise noted (Continued) 16 DUTY CYCLE < 0.5%, VCE = 10V PULSE DURATION = 250µs IG(REF) = 1mA, RL = 5Ω, TJ = 25oC VGE, GATE TO EMITTER VOLTAGE (V) ICE, COLLECTOR TO EMITTER CURRENT (A) 250 200 150 100 TJ = 25oC 50 TJ = 125oC 14 12 VCE = 300V 10 8 6 VCE = 200V 4 VCE = 100V 2 TJ = -55oC 0 0 5 6 7 8 9 10 11 0 25 50 VGE, GATE TO EMITTER VOLTAGE (V) ETOTAL, TOTAL SWITCHING ENERGY LOSS (mJ) ETOTAL, TOTAL SWITCHING ENERGY LOSS (mJ) RG = 5Ω, L = 100µH, VCE = 180V, VGE = 15V ETOTAL = EON2 + EOFF ICE = 60A 0.8 0.6 ICE = 30A 0.4 ICE = 15A 0 25 50 75 100 150 175 200 125 40 TJ = 125oC, L = 100µH, VCE = 180V, VGE = 15V ETOTAL = EON2 + EOFF 10 ICE = 60A 1 ICE = 30A ICE = 15A 0.1 150 1 10 o TC , CASE TEMPERATURE ( C) 100 1000 RG, GATE RESISTANCE (Ω) Figure 15. Total Switching Loss vs Case Temperature Figure 16. Total Switching Loss vs Gate Resistance 3.5 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 10 FREQUENCY = 1MHz C, CAPACITANCE (nF) 125 Figure 14. Gate Charge 1.2 0.2 100 QG , GATE CHARGE (nC) Figure 13. Transfer Characteristic 1.0 75 CIES COES 1.0 CRES 0.1 0.05 DUTY CYCLE < 0.5% PULSE DURATION = 250µs, TJ = 25oC 3.0 ICE = 60A 2.5 ICE = 30A 2.0 ICE = 15A 1.5 1.0 0 10 20 30 40 50 60 70 80 90 6 100 VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 17. Capacitance vs Collector to Emitter Voltage 7 8 9 10 11 12 13 14 15 16 VGE, GATE TO EMITTER VOLTAGE (V) Figure 18. Collector to Emitter On-State Voltage vs Gate to Emitter Voltage www.BDTIC.com/FAIRCHILD ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. C0 5 www.fairchildsemi.com FGH50N3 300 V SMPS IGBT ZθJC , NORMALIZED THERMAL RESPONSE Typical Performance Curves TJ = 25°C unless otherwise noted (Continued) 100 0.50 0.20 t1 0.10 10-1 PD t2 0.05 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD X ZθJC X RθJC) + TC 0.02 0.01 SINGLE PULSE 10-2 -5 10 10-4 10-3 10-2 10-1 100 101 t1 , RECTANGULAR PULSE DURATION (s) Figure 19. IGBT Normalized Transient Thermal Impedance, Junction to Case Test Circuit and Waveforms FFH30US30S DIODE 49449 90% 10% VGE EON2 EOFF L = 100µH VCE RG = 5Ω 90% + FGH50N3 - ICE 10% td(OFF)I VDD = 180V tfI trI td(ON)I Figure 20. Inductive Switching Test Circuit Figure 21. Switching Test Waveforms www.BDTIC.com/FAIRCHILD ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. C0 6 www.fairchildsemi.com FGH50N3 300 V SMPS IGBT Mechanical Dimensions TO-247A03 www.BDTIC.com/FAIRCHILD ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. C0 7 www.fairchildsemi.com *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I64 ©2005 Fairchild Semiconductor Corporation FGH50N3 Rev. 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