Download SN74LVC16374 数据资料 dataSheet 下载

SN74LVC16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005
FEATURES
•
•
•
•
•
•
•
Member of the Texas Instruments Widebus™
Family
EPIC™ (Enhanced-Performance Implanted
CMOS) Submicron Process
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C
Latch-Up Performance Exceeds 250 mA
Per JEDEC Standard JESD-17
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages
DESCRIPTION
This 16-bit edge-triggered D-type flip-flop is designed
for 2.7-V to 3.6-V VCC operation.
The SN74LVC16374 is particularly suitable for
implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers. It can be used as
two 8-bit flip-flops or one 16-bit flip-flop. On the
positive transition of the clock (CLK) input, the Q
outputs of the flip-flop take on the logic levels set up
at the data (D) inputs.
P LD RO GGD
EGAKCA
)WEIVTP( O
EO1
1Q1
2Q1
DNG
3Q1
4Q1
V CC
5Q1
6Q1
DNG
7Q1
8Q1
1Q2
2Q2
DNG
3Q2
4Q2
V CC
5Q2
6Q2
DNG
7Q2
8Q2
EO2
1
84
KLC1
2
74 1D1
3
64 2D1
4
54DNG
5
44 3D1
6
34 4D1
7
24
8
14 5D1
9
04 6D1
01
93DNG
11
V CC
83 7D1
21
73 8D1
31
63 1D2
41
53 2D2
51
43DNG
61
33 3D2
71
23 4D2
81
13
91
03 5D2
02
92 6D2
12
82DNG
22
72 7D2
32
62 8D2
42
52
KLC2
V CC
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or
low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines
without need for interface or pullup components.
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74LVC16374 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus, EPIC are trademarks of Texas Instruments.
www.BDTIC.com/TI
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1993–2005, Texas Instruments Incorporated
SN74LVC16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005
FUNCTION TABLE (EACH FLIP-FLOP)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
LOGIC SYMBOL(1)
1OE
1CLK
2OE
2CLK
1D1
1D2
1D3
1D4
1D5
1D6
1D7
1D8
2D1
2D2
2D3
2D4
2D5
2D6
2D7
2D8
1
48
24
25
47
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1EN
C1
1CLK
C1
C2
1D
1D1 47
2
1
3
44
5
43
6
41
8
40
9
38
11
37
12
35
33
48
2EN
46
36
1
2D
13
2
14
16
32
17
30
19
29
20
27
22
26
23
1Q1
1Q1
1Q2
1Q3
1Q4
To Seven Other Channels
1Q5
1Q6
1Q7
2OE
24
1Q8
2Q1
2CLK
25
2Q2
2Q3
C1
2D1
36
1D
2Q4
2Q5
2Q6
2Q7
2Q8
To Seven Other Channels
(1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
2
2
1D
www.BDTIC.com/TI
13
2Q1
SN74LVC16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VI
Input voltage range (2)
–0.5
4.6
V
–0.5
VCC + 0.5
range (2) (3)
UNIT
VO
Output voltage
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0 or VO > VCC
±50
mA
IO
Continuous output current
VO = 0 to VCC
±50
mA
±100
mA
Continuous current through VCC or GND
Maximum power dissipation at TA = 55°C (in still air) (4)
Tstg
(1)
(2)
(3)
(4)
DGG package
0.85
DL package
Storage temperature range
V
W
1.2
–65
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 4.6 V maximum.
The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For
more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data
Book, literature number SCBD002B.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
VCC = 2.7 V to 3.6 V
VIL
Low-level input voltage
VCC = 2.7 V to 3.6 V
VI
Input voltage
VO
Output voltage
MIN
MAX
2.7
3.6
2
UNIT
V
V
0.8
V
0
VCC
V
0
VCC
V
VCC = 2.7 V
–12
VCC = 3 V
–24
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
0
10
ns/V
TA
Operating free-air temperature
–40
85
°C
(1)
VCC = 2.7 V
12
VCC = 3 V
24
mA
mA
Unused control inputs must be held high or low to prevent them from floating.
www.BDTIC.com/TI
3
SN74LVC16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VCC (1)
TEST CONDITIONS
IOH = –100 µA
VOH
MIN to MAX
II
3V
2.4
IOH = –24 mA
3V
2
IOL = 100 µA
MIN to MAX
IOL = 12 mA
2.7 V
0.4
IOL = 24 mA
3V
0.55
Data inputs
V
0.2
±5
3.6 V
VI = 0.8 V
V
µA
75
3V
VI = 2 V
UNIT
VCC – 0.2
2.2
VI = VCC or GND
II(hold)
TYP (2) MAX
2.7 V
IOH = –12 mA
VOL
MIN
µA
–75
VI = 0 to 3.6 V
3.6 V
±500
IOZ
VO = VCC or GND
3.6 V
±10
µA
ICC
VI = VCC or GND,
3.6 V
40
µA
∆ICC
One input at VCC – 0.6 V, Other inputs at VCC or GND
3 V to 3.6 V
500
µA
Ci
VI = VCC or GND
3.3 V
3.5
pF
Co
VO = VCC or GND
3.3 V
7
pF
(1)
(2)
IO = 0
For conditions shown as MIN or MAX, use the appropriate values under recommended operating conditions.
All typical values are at VCC = 3.3 V, TA = 25°C.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted)
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
UNIT
MIN
MAX
MIN
MAX
100
0
80
fclock
Clock frequency
0
tw
Pulse duration, CLK high or low
4
4
MHz
ns
tsu
Setup time, data before CLK↑
High or low
2
3
ns
th
Hold time, data after CLK↑
High or low
1.5
1.5
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
PARAMETER
TO
(OUTPUT)
fmax
VCC = 3.3 V
± 0.3 V
MIN
VCC = 2.7 V
MAX
100
MIN
UNIT
MAX
80
MHz
tpd
CLK
Q
1.5
7.5
1.5
8.5
ns
ten
OE
Q
1.5
7.5
1.5
8.5
ns
tdis
OE
Q
1.5
7
1.5
8
ns
Operating Characteristics
VCC = 3.3 V, TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance per flip-flop
TEST CONDITIONS
Outputs enabled
Outputs disabled
CL = 50 pF, f = 10 MHz
www.BDTIC.com/TI
TYP
22
9
UNIT
pF
SN74LVC16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCAS316B – NOVEMBER 1993 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
V6
tuptuO morF
T rednU
Ω
005
1S
TSET
nepO
tse
DNG
Fp C05L =
)A etoN ees(
005
1S
tpd
tP LZt/ P ZL
tPH Zt/ P ZH
Ω
nepO
V6
DNG
V 7.2
STUPTUO ROF TIUCRIC DAOL
V 5.1
tupnI gniT
mi
V0
tw
tsu
V 7.2
tupnI
V 5.1
V 5.1
th
V 7.2
V 5.1
tupnI ataD
V 5.1
V0
LOW
V EGTSAMROFA
EV
ARUD ESLUP
NOIT
LOW
V EGTSAMROFA
EV
SEMIT DLOH DNA PUTES
V 7.2
tupnI
V 5.1
V0
V 5.1
V0
tPH L
tP LH
V 7.2
tuptuO
lortnoC
V 5.1
V 5.1
V0
tP ZL
tuptuO
1 mrofW
eva
V
6
t
a 1S
VO L
)B etoN ees(
tP LZ
V3
VO H
V 5.1
tuptuO
V 5.1
tPH L
V 5.1
LOW
V EGTSAMROFA
EV
PORPALAEGDANOIT SEMIT Y
tuptuO
VO H
2 mrofW
eva
DNG ta 1S
VO)LB etoN ees(
VO L
tPH Z
VV
3.O0H−
V 5.1
VO H
V 0
LOW
V EGTSAMROFA
EV
SEMIT ELBASID DNA ELBANE
GNILBANE LEVEL-HG
WIH
OLDNA -
NINON DNA GNITREVNI
naticap:aScEgTijOdN
na eborp s.AeduC
lcnLi
cus snoitidnoc lanretni 1ht.m
iB
wrotufW
epvtuao na rof si
oc lanretni htiw tuptuo na rof 2si
b deilppus era seslup tu.pCni llA
eno derusaem era stuptu.D
o ehT
.Et sat tP
edm
nZaas ehtPeHrZa
L
.Ft sat tP
edm
nLaas ehtPeZH
ra
Z
.Gt sat tPedLm
nHaas ehtPeHrLa
V3
V.O
0 L+
tP ZH
tP LH
V 5.1
tuptuO
V 5.1
W .lortnoc tuptuo eht yb delbasid nehw tpecxe ,
Z ,zHM ≤01
mrofeva
05O=
t
,stn, 5r.≤2
.sn f5
≤.2
d si .
en .
pd .
Figure 1. Load Circuit and Voltage Waveforms
www.BDTIC.com/TI
5
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
www.BDTIC.com/TI