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MMBT4403WT1G Switching Transistor PNP Silicon Features Moisture Sensitivity Level: 1 ESD Rating: Human Body Model; 4 kV, http://onsemi.com Machine Model; 400 V These Devices are Pb-- Free, Halogen Free/BFR Free and are RoHS Compliant COLLECTOR 3 1 BASE MAXIMUM RATINGS Symbol Value Unit Collector -- Emitter Voltage Rating VCEO --40 Vdc Collector -- Base Voltage VCBO --40 Vdc Emitter -- Base Voltage VEBO --5.0 Vdc IC --600 mAdc Collector Current -- Continuous 2 EMITTER 3 1 THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR--5 Board TA = 25C Thermal Resistance, Junction--to--Ambient Junction and Storage Temperature Symbol Max Unit PD 150 mW RθJA 833 C/W TJ, Tstg -- 55 to +150 C 2 SC-- 70 CASE 419 STYLE 3 MARKING DIAGRAM Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2T MG G 1 2T M G = Specific Device Code = Date Code = Pb--Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Device Package Shipping† MMBT4403WT1G SC--70 (Pb--Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2010 October, 2010 - Rev. 3 1 Publication Order Number: MMBT4403WT1/D MMBT4403WT1G ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Max Unit Collector -- Emitter Breakdown Voltage (Note 1) (IC = --1.0 mAdc, IB = 0) V(BR)CEO --40 -- Vdc Collector -- Base Breakdown Voltage (IC = --0.1 mAdc, IE = 0) V(BR)CBO --40 -- Vdc Emitter -- Base Breakdown Voltage (IE = --0.1 mAdc, IC = 0) V(BR)EBO --5.0 -- Vdc Base Cutoff Current (VCE = --35 Vdc, VEB = --0.4 Vdc) IBEV -- --0.1 mAdc Collector Cutoff Current (VCE = --35 Vdc, VEB = --0.4 Vdc) ICEX -- --0.1 mAdc 30 60 100 100 20 ---300 -- --- --0.4 --0.75 --0.75 -- --0.95 --1.3 fT 200 -- MHz Collector--Base Capacitance (VCB = --10 Vdc, IE = 0, f = 1.0 MHz) Ccb -- 8.5 pF Emitter--Base Capacitance (VBE = --0.5 Vdc, IC = 0, f = 1.0 MHz) Ceb -- 30 pF Input Impedance (IC = --1.0 mAdc, VCE = --10 Vdc, f = 1.0 kHz) hie 1.5 15 kΩ Voltage Feedback Ratio (IC = --1.0 mAdc, VCE = --10 Vdc, f = 1.0 kHz) hre 0.1 8.0 X 10-- 4 Small -- Signal Current Gain (IC = --1.0 mAdc, VCE = --10 Vdc, f = 1.0 kHz) hfe 60 500 -- Output Admittance (IC = --1.0 mAdc, VCE = --10 Vdc, f = 1.0 kHz) hoe 1.0 100 mmhos (VCC = --30 Vdc, VEB = --2.0 Vdc, IC = --150 mAdc, IB1 = --15 mAdc) td -- 15 tr -- 20 (VCC = --30 Vdc, IC = --150 mAdc, IB1 = IB2 = --15 mAdc) ts -- 225 tf -- 30 OFF CHARACTERISTICS ON CHARACTERISTICS DC Current Gain (IC = --0.1 mAdc, VCE = --1.0 Vdc) (IC = --1.0 mAdc, VCE = --1.0 Vdc) (IC = --10 mAdc, VCE = --1.0 Vdc) (IC = --150 mAdc, VCE = --2.0 Vdc) (Note 1) (IC = --500 mAdc, VCE = --2.0 Vdc) (Note 1) hFE Collector -- Emitter Saturation Voltage (Note 1) (IC = --150 mAdc, IB = --15 mAdc) (IC = --500 mAdc, IB = --50 mAdc) VCE(sat) Base -- Emitter Saturation Voltage (Note 1) (IC = --150 mAdc, IB = --15 mAdc) (IC = --500 mAdc, IB = --50 mAdc) VBE(sat) -- Vdc Vdc SMALL-- SIGNAL CHARACTERISTICS Current -- Gain -- Bandwidth Product (IC = --20 mAdc, VCE = --10 Vdc, f = 100 MHz) SWITCHING CHARACTERISTICS Delay Time Rise Time Storage Time Fall Time ns ns 1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%. SWITCHING TIME EQUIVALENT TEST CIRCUIT - 30 V - 30 V +2 V 0 - 16 V 200 Ω < 2 ns +14 V 0 1.0 kΩ 10 to 100 ms, DUTY CYCLE = 2% 200 Ω < 20 ns CS* < 10 pF 1.0 kΩ - 16 V 1.0 to 100 ms, DUTY CYCLE = 2% + 4.0 V Scope rise time < 4.0 ns *Total shunt capacitance of test jig connectors, and oscilloscope Figure 1. Turn--On Time Figure 2. Turn--Off Time http://onsemi.com 2 CS* < 10 pF MMBT4403WT1G TRANSIENT CHARACTERISTICS 25C 100C 30 Ceb VCC = 30 V IC/IB = 10 3.0 Q, CHARGE (nC) CAPACITANCE (pF) 20 10 7.0 5.0 10 7.0 Ccb 5.0 2.0 1.0 0.7 0.5 QT 0.3 QA 0.2 2.0 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 0.1 30 50 70 100 200 Figure 3. Capacitances Figure 4. Charge Data 300 500 100 IC/IB = 10 70 70 VCC = 30 V IC/IB = 10 50 50 20 t r , RISE TIME (ns) tr @ VCC = 30 V tr @ VCC = 10 V td @ VBE(off) = 2 V td @ VBE(off) = 0 30 30 20 10 10 7.0 7.0 10 20 30 50 70 100 200 300 5.0 500 10 20 30 50 70 100 200 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) Figure 5. Turn--On Time Figure 6. Rise Time 200 IC/IB = 10 t s, STORAGE TIME (ns) t, TIME (ns) 30 20 IC, COLLECTOR CURRENT (mA) 100 5.0 10 REVERSE VOLTAGE (VOLTS) 100 IC/IB = 20 70 50 IB1 = IB2 ts = ts - 1/8 tf 30 20 10 20 30 50 70 100 200 IC, COLLECTOR CURRENT (mA) Figure 7. Storage Time http://onsemi.com 3 300 500 300 500 MMBT4403WT1G SMALL--SIGNAL CHARACTERISTICS NOISE FIGURE VCE = --10 Vdc, TA = 25C; Bandwidth = 1.0 Hz 10 10 8 8 NF, NOISE FIGURE (dB) NF, NOISE FIGURE (dB) f = 1 kHz IC = 1.0 mA, RS = 430 Ω IC = 500 mA, RS = 560 Ω IC = 50 mA, RS = 2.7 kΩ IC = 100 mA, RS = 1.6 kΩ 6 4 2 6 4 2 RS = OPTIMUM SOURCE RESISTANCE 0 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 IC = 50 mA 100 mA 500 mA 1.0 mA 0 100 50 100 200 500 1k 2k 5k 10 k 20 k f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS) Figure 8. Frequency Effects Figure 9. Source Resistance Effects 50 k h PARAMETERS VCE = 10 Vdc, f = 1.0 kHz, TA = 25C This group of graphs illustrates the relationship between hfe and other “h” parameters for this series of transistors. To obtain these curves, a high-- gain and a low-- gain unit were selected from the MMBT4403LT1 lines, and the same units were used to develop the correspondingly numbered curves on each graph. 100 k 700 50 k hfe, CURRENT GAIN 500 300 200 MMBT4403LT1 UNIT 1 MMBT4403LT1 UNIT 2 100 70 50 30 hie , INPUT IMPEDANCE (OHMS) 1000 MMBT4403LT1 UNIT 1 MMBT4403LT1 UNIT 2 20 k 10 k 5k 2k 1k 500 200 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 100 5.0 7.0 10 0.1 0.2 IC, COLLECTOR CURRENT (mAdc) Figure 10. Current Gain 2.0 3.0 5.0 7.0 10 Figure 11. Input Impedance 500 10 MMBT4403LT1 UNIT 1 MMBT4403LT1 UNIT 2 5.0 2.0 1.0 0.5 0.2 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 hoe , OUTPUT ADMITTANCE (m mhos) h re , VOLTAGE FEEDBACK RATIO (X 10- 4 ) 0.5 0.7 1.0 IC, COLLECTOR CURRENT (mAdc) 20 0.1 0.3 100 50 20 5.0 2.0 1.0 0.1 5.0 7.0 10 MMBT4403LT1 UNIT 1 MMBT4403LT1 UNIT 2 10 0.2 0.3 0.5 0.7 1.0 2.0 3.0 IC, COLLECTOR CURRENT (mAdc) IC, COLLECTOR CURRENT (mAdc) Figure 12. Voltage Feedback Ratio Figure 13. Output Admittance http://onsemi.com 4 5.0 7.0 10 MMBT4403WT1G STATIC CHARACTERISTICS h FE , NORMALIZED CURRENT GAIN 3.0 VCE = 1.0 V VCE = 10 V 2.0 TJ = 125C 25C 1.0 - 55C 0.7 0.5 0.3 0.2 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500 IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR-- EMITTER VOLTAGE (VOLTS) Figure 14. DC Current Gain 1.0 0.8 0.6 IC = 1.0 mA 10 mA 100 mA 500 mA 0.4 0.2 0 0.005 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 IB, BASE CURRENT (mA) 2.0 3.0 5.0 7.0 10 20 30 50 Figure 15. Collector Saturation Region 0.5 TJ = 25C 0.8 VBE(sat) @ IC/IB = 10 0.6 VBE(sat) @ VCE = 10 V 0 COEFFICIENT (mV/ C) VOLTAGE (VOLTS) 1.0 0.4 0.2 0.1 0.2 0.5 0.5 1.0 1.5 2.0 VCE(sat) @ IC/IB = 10 0 θVC for VCE(sat) 50 100 200 1.0 2.0 5.0 10 20 IC, COLLECTOR CURRENT (mA) 2.5 0.1 0.2 500 Figure 16. “On” Voltages θVS for VBE 0.5 50 100 200 1.0 2.0 5.0 10 20 IC, COLLECTOR CURRENT (mA) Figure 17. Temperature Coefficients http://onsemi.com 5 500 MMBT4403WT1G PACKAGE DIMENSIONS SC--70 (SOT--323) CASE 419--04 ISSUE N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. D e1 DIM A A1 A2 b c D E e e1 L HE 3 E HE 1 2 b e A 0.05 (0.002) 0.30 0.10 1.80 1.15 1.20 0.20 2.00 MILLIMETERS NOM MAX 0.90 1.00 0.05 0.10 0.70 REF 0.35 0.40 0.18 0.25 2.10 2.20 1.24 1.35 1.30 1.40 0.65 BSC 0.38 0.56 2.10 2.40 MIN 0.032 0.000 0.012 0.004 0.071 0.045 0.047 0.008 0.079 INCHES NOM 0.035 0.002 0.028 REF 0.014 0.007 0.083 0.049 0.051 0.026 BSC 0.015 0.083 MAX 0.040 0.004 0.016 0.010 0.087 0.053 0.055 0.022 0.095 STYLE 3: PIN 1. BASE 2. EMITTER 3. COLLECTOR c A2 MIN 0.80 0.00 L A1 SOLDERING FOOTPRINT* 0.65 0.025 0.65 0.025 1.9 0.075 0.9 0.035 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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