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RQ1E070RP Pch -30V -7A Power MOSFET Datasheet lOutline VDSS -30V RDS(on) (Max.) 17mW ID -7A PD 1.5W lFeatures (8) (7) (6) (5) TSMT8 (1) (2) (3) (4) lInner circuit 1) Low on - resistance. (1) Source (2) Source (3) Source (4) Gate 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TSMT8). 4) Pb-free lead plating ; RoHS compliant (5) Drain (6) Drain (7) Drain (8) Drain *1 ESD PROTECTION DIODE *2 BODY DIODE lPackaging specifications Packaging Taping Reel size (mm) lApplication DC/DC converters Type 180 Tape width (mm) Basic ordering unit (pcs) 8 3,000 Taping code TR Marking UE lAbsolute maximum ratings(Ta = 25°C) Parameter Symbol Value Unit Drain - Source voltage VDSS -30 V Continuous drain current ID *1 7 A ID,pulse *2 28 A VGSS 20 V PD *3 1.5 W PD *4 0.55 W Tj 150 °C Tstg -55 to +150 °C Pulsed drain current Gate - Source voltage Power dissipation Junction temperature Range of storage temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/11 2012.11 - Rev.C Data Sheet RQ1E070RP lThermal resistance Parameter Symbol Values Min. Typ. Max. Unit Thermal resistance, junction - ambient RthJA *3 - - 83.3 °C/W Thermal resistance, junction - ambient RthJA *4 - - 227 °C/W lElectrical characteristics(Ta = 25°C) Parameter Drain - Source breakdown voltage Breakdown voltage temperature coefficient Symbol V(BR)DSS Conditions VGS = 0V, ID = 1mA ΔV(BR)DSS ID = 1mA ΔTj referenced to 25°C Values Unit Min. Typ. Max. -30 - - V - -25 - mV/°C Zero gate voltage drain current IDSS VDS = -30V, VGS = 0V - - -1 mA Gate - Source leakage current IGSS VGS = 20V, VDS = 0V - - 10 mA Gate threshold voltage VGS (th) VDS = -10V, ID = -1mA -1.0 - -2.5 V Gate threshold voltage temperature coefficient ΔV(GS)th ΔTj ID = 1mA referenced to 25°C - 3.9 - mV/°C VGS= -10V, ID= -7A - 12 17 VGS= -4.5V, ID= -3.5A - 17 24 VGS= -4.0V, ID= -3.5A - 19 27 VGS= -10V, ID= -7A, Tj=125°C - 26 37 RG f = 1MHz, open drain - 5 - W gfs *5 VDS = -10V, ID = -7A 6.0 15 - S Static drain - source on - state resistance Gate input resistannce Transconductance RDS(on) *5 mW *1 Limited only by maximum temperature allowed. *2 Pw 10ms, Duty cycle 1% *3 Mounted on a ceramic board (30×30×0.8mm) *4 Mounted on a FR4 (20×20×0.8mm) *5 Pulsed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/11 2012.11 - Rev.C Data Sheet RQ1E070RP lElectrical characteristics(Ta = 25°C) Parameter Symbol Conditions Values Min. Typ. Max. Input capacitance Ciss VGS = 0V - 2700 - Output capacitance Coss VDS = -10V - 390 - Reverse transfer capacitance Crss f = 1MHz - 350 - VDD ⋍ -15V, VGS = -10V - 16 - tr *5 ID = -3.5A - 35 - td(off) *5 RL = 4.3W - 140 - tf *5 RG = 10W - 70 - Turn - on delay time Rise time Turn - off delay time Fall time td(on) *5 Unit pF ns lGate Charge characteristics(Ta = 25°C) Parameter Total gate charge Symbol Qg *5 Gate - Source charge Qgs *5 Gate - Drain charge Qgd *5 Conditions Values Min. Typ. Max. VDD ⋍ -15V, ID = -7A VGS = -5V - 26 - VDD ⋍ -15V, ID = -7A VGS = -10V - 50 - - 7.5 - - 8.0 - VDD ⋍ -15V, ID = -7A VGS = -5V Unit nC lBody diode electrical characteristics (Source-Drain)(Ta = 25°C) Parameter Inverse diode continuous, forward current Forward voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. Symbol IS *1 VSD *5 Conditions Values Unit Min. Typ. Max. Ta = 25°C - - -1 A VGS = 0V, Is = -7A - - -1.2 V 3/11 2012.11 - Rev.C Data Sheet RQ1E070RP lElectrical characteristic curves Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area 120 100 100 80 60 40 20 0 0 50 100 150 1 DC Operation 0.1 0.01 200 Operation in this area is limited by RDS(on) ( VGS = -10V ) Ta=25ºC Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm) 0.1 1 10 100 Drain - Source Voltage : -VDS [V] Junction Temperature : Tj [°C] Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width Fig.4 Single Pulse Maximum Power dissipation 10 10000 Ta=25ºC Single Pulse 1 top D=1 D=0.5 D=0.1 D=0.05 D=0.01 bottom Signle 0.1 0.01 0.001 0.0001 Rth(ch-a)=83.3ºC/W Rth(ch-a)(t)=r(t)×Rth(ch-a) Mounted on ceramic board (30mm × 30mm × 0.8mm) 0.01 1 Peak Transient Power : P(W) Normalized Transient Thermal Resistance : r(t) PW = 100μs 10 Drain Current : -ID [A] Power Dissipation : PD/PD max. [%] PW = 10ms PW = 1ms 100 10 1 0.01 1 100 Pulse Width : PW [s] Pulse Width : PW [s] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1000 0.1 0.0001 100 Ta=25ºC Single Pulse 4/11 2012.11 - Rev.C Data Sheet RQ1E070RP lElectrical characteristic curves Fig.6 Typical Output Characteristics(II) Fig.5 Typical Output Characteristics(I) Ta= 25ºC VGS= -10V VGS= -4.5V VGS= -4.0V 4 VGS= -3.0V VGS= -2.8V 2 VGS= -2.5V 0 0 0.2 0.4 0.6 0.8 Ta= 25ºC 4 VGS= -2.5V 2 0 1 0 2 4 6 8 10 Drain - Source Voltage : -VDS [V] Drain - Source Voltage : -VDS [V] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. VGS= -10V VGS= -4.5V VGS= -4.0V VGS= -3.0V VGS= -2.8V 6 Drain Current : -ID [A] Drain Current : -ID [A] 6 5/11 2012.11 - Rev.C Data Sheet RQ1E070RP Fig.7 Breakdown Voltage vs. Junction Temperature Fig.8 Typical Transfer Characteristics 10 60 VGS=0V ID= -1mA VDS= -10V 1 Drain Current : -ID [A] Drain - Source Breakdown Voltage : -V(BR)DSS [V] lElectrical characteristic curves 40 20 0 -50 0 50 100 0.1 0.01 0.001 150 0 Junction Temperature : Tj [°C] VDS= -10V Transconductance : gfs [S] 2 1 0 3 100 VDS= -10V ID= -1mA -50 2 Fig.10 Transconductance vs. Drain Current 3 0 1 Gate - Source Voltage : -VGS [V] Fig.9 Gate Threshold Voltage vs. Junction Temperature Gate Threshold Voltage : -VGS(th) [V] Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 50 100 Ta = -25ºC Ta = 25ºC Ta = 75ºC Ta = 25ºC 1 0.1 0.01 150 Junction Temperature : Tj [°C] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 10 0.1 1 10 Drain Current : -ID [A] 6/11 2012.11 - Rev.C Data Sheet RQ1E070RP lElectrical characteristic curves Fig.11 Drain CurrentDerating Curve Fig.12 Static Drain - Source On - State Resistance vs. Gate Source Voltage 100 1 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 125 150 Static Drain - Source On-State Resistance : RDS(on) [mW] Drain Current Dissipation : ID / ID max.(%) 1.2 Ta= 25ºC 80 60 20 0 10 10 Static Drain - Source On-State Resistance : RDS(on) [mW] Static Drain - Source On-State Resistance : RDS(on) [mW] VGS= -4.0V VGS= -4.5V VGS= -10V Drain Current : -ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 10 15 30 Ta= 25ºC 1 5 Fig.14 Static Drain - Source On - State Resistance vs. Junction Temperature 1000 0.1 0 Gate - Source Voltage : -VGS [V] Fig.13 Static Drain - Source On - State Resistance vs. Drain Current(I) 1 ID= -7.0A 40 Junction Temperature : Tj [ºC] 100 ID= -3.5A 20 10 VGS= -10V ID= -7A 0 -50 -25 0 25 50 75 100 125 150 Junction Temperature : Tj [ºC] 7/11 2012.11 - Rev.C Data Sheet RQ1E070RP lElectrical characteristic curves 1000 1000 VGS = -10V Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 100 10 1 0.1 1 10 Static Drain - Source On-State Resistance : RDS(on) [mW] Fig.16 Static Drain - Source On - State Resistance vs. Drain Current(III) Static Drain - Source On-State Resistance : RDS(on) [mW] Fig.15 Static Drain - Source On - State Resistance vs. Drain Current(II) Drain Current : -ID [A] VGS = -4.5V Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 100 10 1 0.1 1 10 Drain Current : -ID [A] Fig.17 Static Drain - Source On - State Resistance vs. Drain Current(IV) Static Drain - Source On-State Resistance : RDS(on) [mW] 1000 VGS = -4.0V Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 100 10 1 0.1 1 10 Drain Current : -ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/11 2012.11 - Rev.C Data Sheet RQ1E070RP lElectrical characteristic curves Fig.18 Typical Capacitance vs. Drain - Source Voltage Fig.19 Switching Characteristics 10000 10000 1000 Ta = 25ºC f=1MHz VGS=0V 1000 Crss Coss 100 0.01 0.1 1 Ta = 25ºC VDD= -15V VGS= -10V RG=10W td(off) Switching Time : t [ns] Capacitance : C [pF] Ciss tf 100 td(on) 10 tr 10 1 100 0.01 0.1 1 10 Drain Current : -ID [A] Drain - Source Voltage : -VDS [V] Fig.20 Dynamic Input Characteristics Fig.21 Source Current vs. Source Drain Voltage 10 10 8 Source Current : -IS [A] Gate - Source Voltage : -VGS [V] VDS=0V 6 4 Ta = 25ºC VDD= -15V ID= -7A RG=10W 2 0 0 10 20 30 40 Ta = 125ºC Ta = 75ºC Ta = 25ºC Ta = -25ºC 0.1 0.01 50 Total Gate Charge : Qg [nC] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1 0 0.5 1 1.5 Source-Drain Voltage : -VSD [V] 9/11 2012.11 - Rev.C Data Sheet RQ1E070RP lMeasurement circuits Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 10/11 2012.11 - Rev.C Data Sheet RQ1E070RP lDimensions (Unit : mm) D b x e S A e1 l2 e Lp HE c L E L1 TSMT8 Lp1 A A1 y S l1 A S b2 Pattern of terminal position areas [Not a recommended pattern of soldering pads] DIM A A1 b c D E e HE L L1 Lp Lp1 x y DIM b2 e1 l1 l2 MILIMETERS MIN MAX 0.75 0.85 0.00 0.05 0.27 0.37 0.12 0.22 2.90 3.10 2.30 2.50 0.65 2.70 2.90 0.10 0.30 0.10 0.30 0.19 0.39 0.19 0.39 0.10 0.10 INCHES MIN 0.030 0.000 0.011 0.005 0.114 0.091 MAX 0.033 0.002 0.015 0.009 0.122 0.098 0.026 0.106 0.004 0.004 0.007 0.007 - MILIMETERS MIN MAX 0.47 2.41 0.49 0.49 0.114 0.012 0.012 0.015 0.015 0.004 0.004 INCHES MIN - MAX 0.019 0.095 - 0.019 0.019 Dimension in mm / inches www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 11/11 2012.11 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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