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STATUS OF DAQ PROJECT T.T. LOW VOLTAGE POWER SUPPLIES NETWORK, RACKS & CABLING PT DAQ DEVELOPMENTS CONCLUSIONS OPERA collaboration meeting, Hamburg, 3-5 June, ’04 J.Marteau TT LOW VOLTAGE POWER SUPPLIES POWER SUPPLIES COST : 2 options can be considered OPTION A : 1 output () for 4 boards (i.e. per corner) • offers / SM : 72keuros to 110keuros (SCHROFF, M.E.S., CAEN, WIENER) • remark 1 : CAEN offered a special 24% discount which is over now • remark 2 : WIENER could align its price on the one of CAEN OPTION B : 1 output () for 16 boards (i.e. per TT plane) ex. WIENER PL6021 F8-12 : 6 modules with (+) & (-) outputs, max. 23A/output 1 module/plane remote control & monitoring for each module TCP/IP or CANbus interface 6 crates / SM 1 air ventilation for 5 crates 2 racks / SM 6500euros/crate + 1070euros/fan unit offer / SM : 39keuros delivery : 10-12 weeks, prototype available in 4 weeks meeting in Lyon 08 June with Wiener representatives NETWORK, RACKS & CABLING OPTION A : we made the proposal to put small switches in the TTplane corners, which is an economical but risky option (absence of monitoring, long term stability of the small commercial switches…) cost / SM : 16 keuros OPTION B : we have contact with network specialists who advise to replace these small corner switches with more reliable 24&48 ports switches that can be monitored and to take custom bundle cables. for 1 SM : 12 switches 48 ports, 3 switches 24 ports CISCO systems : 2295euros & 1191euros (IN2P3 34% discount) cost / SM (estimate) : 21 keuros (including discount, 32 keuros otherwise) NETWORK, RACKS & CABLING 48 48 48 48 48 VLAN 1 48 48 48 48 48 1Gbits link 100 Mbits link Level 0 network Level 1 network Admin. network Public network VLAN 2 VLAN 3 48 24 VLAN 4 48 24 192.168.1. VLAN admin. 192.168.2. adm. adm. T.T. DAQ 192.168.3. P.T. DAQ VLAN 0 adm. 192.168.4. RPC-XPCVETO 24 192.168.0. RPC DAQ P.T. DAQ TT DAQ 2 Manager / Admin. DB Internet NETWORK, RACKS & CABLING : TT low voltage distribution main power supply racks each corner redistributes to 4 electronic boards after filtering NETWORK, RACKS & CABLING : TT Ethernet distribution All the cables (power supplies & ethernet) will run along the end-caps in 1 large & 1 small cable trays The connection « platine » is being designed with the Cymantec company. 1st prototype ready. We will define the cable lengths etc on Wall 1 mounted in Strasbourg NETWORK, RACKS & CABLING CONTROL ROOM : A control room will be located behind the last magnet (2 barracks of 2m*3m on top of each other). The control room will host DAQ and remote Slow Control & monitoring. RACKS DISTRIBUTION : RPCs require 16 racks in total. Magnets require 1 rack for power supplies on each side / SM, to be located in the middle of the magnet, with a total clearance of 1.7m. PTs require 6 racks in total. It has been agreed that these racks could be located in the middle of the platform (to be checked w.r.t. the temperature). Details about the racks occupancy have to be provided. 1 slot (1U) has to be left for the PT network switch. TT need 8 racks in total. They are located only on 1 side (wall side). In total 30 racks are needed and should be available from MACRO (to be checked). A cable tray of ~0.5m will collect the cables from the back of the racks. GENERAL SKETCH FOR RACKS ORGANIZATION : see next slide. (assuming standard rack dimensions : ~0.6m width, ~1.8m height) NETWORK, RACKS & CABLING Corridor side Cable tray P.T. racks P.T. racks Cable tray Wall side Spectro.2 T.T.2 Spectro.1 T.T.1 max. 2000 5575 C.R.2 C.R.1 5000 4340 5000 4340 NETWORK, RACKS & CABLING : RPC crates Number of crates required for 1 spectrometer FEB (RPC) 4 3 boards/layer 6 layers/crate 22 layers RPC + 2 layers XPC FEB (XPC) 1 2 layers XPC Controller 8 3.5 boards/layer X 2.5 boards/layer Y 3 layers/crate 22 layers RPC + 2 layers XPC 1 2 layers XPC 2 1 board/layer 22 layers RPC + 2 layers XPC HV (-) 27 crates / spectrometer 1 1 ch/layer 4 layers/board 40 chs/crate 22 layers RPC + 2 layers XPC 2 HV (+) Current Meter 3 chs/layer 40 chs/crate 22 layers RPC + 2 layers XPC 8 7 chs/layer 24 chs/crate 22 layers RPC + 2 layers XPC NETWORK, RACKS & CABLING : RPC racks (odd) Power Management & Alarms Power Management & Alarms Power Management & Alarms Power Management & Alarms Temperature & Reset Temperature & Reset Temperature & Reset Temperature & Reset CTRL FEB (RPC - X+Y View) FEB (RPC - X+Y View) FAN Heat exchanger FAN Heat exchanger FAN Heat exchanger Timing FEB (RPC - X+Y View) FEB (RPC - X+Y View) FAN Heat exchanger Current Meter & HV Distr. Current Meter & HV Distr. FAN FAN FAN Current Meter & HV Distr. FEB (XPC) FEB (RPC - X+Y View) FEB (RPC - X+Y View) Current Meter & HV Distr. FAN Heat exchanger FAN Heat exchanger FAN Heat exchanger FAN Heat exchanger SYS 127 (-) FEB (RPC - X+Y View) FEB (RPC - X+Y View) SYS 127 (-) FAN FAN FAN FAN NETWORK, RACKS & CABLING : RPC racks (even) Power Management & Alarms Power Management & Alarms Power Management & Alarms Power Management & Alarms Temperature & Reset Temperature & Reset Temperature & Reset Temperature & Reset FAN Heat exchanger FAN Heat exchanger FAN Heat exchanger FAN Heat exchanger FEB (RPC -Y View) FEB (RPC -Y View) CTRL FAN FAN FAN FEB (RPC -Y View) FEB (RPC -Y View) CTRL FAN Heat exchanger FAN Heat exchanger FAN Heat exchanger FEB (XPC) SYS 127 (-) Current Meter & HV Distr. Current Meter & HV Distr. Current Meter & HV Distr. Current Meter & HV Distr. FAN Heat exchanger SLOW CONTROL SLOW CONTROL FAN SWITCH 48 FAN FAN Switch required close to controller crates NETWORK, RACKS & CABLING : TT racks Power Management & Alarms Power Management & Alarms Power Management & Alarms Power Management & Alarms Temperature & Reset Temperature & Reset Temperature & Reset Temperature & Reset SWITCH 24 TT DAQ 1 P.C. L.V. POWER SUPPLIES L.V. POWER SUPPLIES PT DAQ P.C. SWITCH 48 SWITCH 48 SWITCH 48 SWITCH 48 SWITCH 48 RPC DAQ P.C. L.V. POWER SUPPLIES L.V. POWER SUPPLIES TT DAQ 2 P.C. L.V. POWER SUPPLIES L.V. POWER SUPPLIES FAN FAN SWITCH 48 SWITCH 48 SWITCH 48 SWITCH 48 SWITCH 48 FAN VME CLOCK FAN PT DAQ DEVELOPMENTS DESIGN OF TDC BOARD, including the Ethernet Mezzanine with MSC company (meeting in April). Collaboration of M.Braueur. VME board TDC 1 TDC 2 Select chip TDC 11 16 bits BUS : signal 6 bits BUS : control TDC 12 Mezzanine : •readout sequence •zero suppress •trigger timestamps Common STOP Clock PT DAQ DEVELOPMENTS TRIGGER STRATEGY (see also talk by M.Braueur) Trigger input (common TDC stop) : OR of 2 nearby (X)RPC planes Trigger rate : around 14 kHz Data flow : 16 bits / channel 16 * 96 * 14 k = 22 Mbits / s / TDC board (max. 100 Mbits / s) possible reduction with zero suppress : typically 3 Mbits / s assuming 3 noisy channels per board still leads to 125 Mbits / s on the PT DAQ PC Being close to the limit, we need the trigger strategy (including XPC & VETO) to be studied in more details (e.g. OR of N1 planes & OR of N2 planes) in terms of rates, efficiencies, hardware setting… PT DAQ DEVELOPMENTS SLOW CONTROL & MONITORING : Hardware setup : HV modules (CAEN SY2527, ethernet CAEN protocol) crates (CAN bus) T sensors (CAN bus) Gas system (dedicated PC) 2-3 PCs to be connected with the DAQ Manager Software : we agreed to use CORBA for communication with DAQ Manager : some libraries already exist for these applications also used by BMM (Brick Manipulator Manager) M.Braueur start to work on it & to compile the libraries Since most the items (hardware & software) are common to PT & RPC, we should optimize the work & avoid double developments : combine the purchase of e.g. racks & crates (also for easier maintenance) adopt the same software environment CONCLUSIONS (I) BUDGET : Update of the DAQ budget performed and submitted to IN2P3 (meeting 09 June) New procedure for the public markets (January ’04) entering into application now MEZZANINE BOARDS PRODUCTION : A serious bug has been discovered (and confirmed by AXIS) recently, concerning the RESET input on some MCM chips. This bug is not fixed by AXIS (not even in the upgraded version of the chip) This requires a new version for the mezzanine (prototype+serie) which prevents us to have the complete TT electronics ready for the 1st 12 walls installation. CAMEROP BOARDS PRODUCTION : Final version now under tests 2 Pre-series available (4+36 boards) to be used for tests & calibration Next serie (this summer) to be installed on the 1st 12 TT walls (mezzanines will be plugged later on the CAMEROP boards : less painful solution to avoid delays). CONCLUSIONS (II) REQUEST : work could be easier if we could use F/E boards & LED pulsers (when it is possible to pick-up samples from the production batches) RPC MEZZANINES (strongly required) : dedicated software version (VHDL & CORBA) needs to be developed a copy of the VME motherboard (+ F/E emulator) has been asked in order to speed up developments and tests PT TDC BOARDS : not on the critical path for the moment. SOFTWARE : CORBA software is improving constantly (1st versions debugged w.r.t. memory leaks) The TTsensor / TTdaq processes defined with omniORB.4.0.3 libraries Automatic board tests program using the CORBA software Start the tests with large number of boards connected (equivalent to 1 TT wall).