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ATLAS Status of 8ch calib prototype N. Dumont-Dayot, G. Perrot, P. Perrodo, I Wingerter-Seez LAPP Annecy U. Schafer, D. Schroff, Univ Mainz C. de La Taille, N. Seguin-Moreau, L. Serin LAL Orsay 8ch prototype status Slice of 8 analog channels + complete digital part 3 boards received in apr 02 2 in Orsay (-> 1 to Mainz), 1 in Annecy SPAC2 Calolgic TTCRx Delay 8 outputs 21 jun 2002 DAC Opamps & switch C. de La Taille calibration board design review 2 8channel prototype chips DAC V2 Improved reference 123 chips received may 02 110 work OK QFP100 Opamp V2 offset trimmed to 15 µV HF switch integrated 463 chips available QFP44 Calogic V2 40 chips available in QFP100 Tested to SEE in Louvain 21 jun 2002 C. de La Taille calibration board design review 3 Digital part Worked OK at once TTCRx + Calogic + Delay chip + SPAC3 Jitter visibly improved 21 jun 2002 C. de La Taille calibration board design review 4 DC uniformity Correction of output line resistance Rout (Ω) t = 35 µm R = 0.5 mΩ/• ΔL = 17 cm W = 200 µm Expect : ΔRline = 0.4 Ω ΔVout = 0.8 % effect Correction by ΔR (5Ω) 10*ΔR (5Ω) decreasing Iout by increasing R(5Ω) Exact correction for W = 2mm : ΔR5 =40 mΩ Measured value = 60 mΩ -> overcompensation output layer CH0 CH7 VP6 layer 21 jun 2002 C. de La Taille calibration board design review 5 DC uniformity DC current output 1.4% variation between CH0 and CH7 Consistent with +5.5V additionnal resistance 5 Ω resistors All in ± 0.1% Rms = 0.04% 2 resistors where low by 1% : DAMAGED ? 21 jun 2002 C. de La Taille calibration board design review 6 Lots of unexpected problems… Board very different from mod0 Channels no longer aligned but staggered in depth Lots of problems with the 8 channels 21 jun 2002 Ground bounce 2V change with enabled channels 80 µV DAC offset DAC change with all channels on Overshoot Signal uniformity DC uniformity Damaged chips Oscillations Ripple noise Linearity C. de La Taille calibration board design review 7 Example : Ground bounce Observation 100 ns bounce on small signals Worst on far channels (->7) Clean on channel 0 Present even with collector open Dissapears if termination resistor (R0) removed Explanation Large digital current (200 mA) in inductive ground Produces 1 mV ground bounce, coupled to the output through R0 Cure Try to reduce digital current (difficult) Move R0 in quiet zone near inductor Minimize loop area around NE856 21 jun 2002 C. de La Taille calibration board design review 8 Parasitic injected charge (PIC) Parasitic signal when DAC=0 Proportionnal to CGS and ΔVGS ringing with parasitic inductance (L ~ 3 nH) Reducing VG can reduce the PIC • Effect very visible, scaling with VGS • Below VG= - 0.4V, some PMOS are not completely OFF : not acceptable Improved by connecting the nwell to the source Referred to DAC value Peak of PIC after shaping 1 V DAC makes 5 V output pulse 1 GeV (η=0,MID) corresponds to DAC=500 µV L = 0, 22 nH, 100 nH 21 jun 2002 C. de La Taille calibration board design review 9 Parasitic injected charge (PIC) Parasitic injected charge extraction DAC set at \x0004 = 64 µV Signal due to offset needs to be substracted 21 jun 2002 C. de La Taille calibration board design review 10 Parasitic injected charge (PIC) Parasitic injected charge very uniform on 8 channels Equivalent to DAC=0006=100 µV (180 MeV in the barrel middle) in peak Subsequently reduced by a factor ~3, very close to noise level (50MeV) Well differentiated Injected charge x 10 = 500 µV pulse ~DAC=100µV 21 jun 2002 C. de La Taille calibration board design review 11 Linearity Measured on each gain 1-10-100 Pulse measurements In red After shaping DC current measur. In black With Keithley Several problems DAC referenced to VP6 Bad 5Ω resistor brand Well below 0.1% 21 jun 2002 C. de La Taille calibration board design review 12 Linearity Fit residuals show opamp offset Very small contribution of parasitic injected charge Offset of High gain range in agreement with low offset Opamp measurement Effect too small to be seen in other ranges 21 jun 2002 C. de La Taille calibration board design review 13 Linearity Fit slopes give uniformity Very small contribution of parasitic injected charge Slope different by 5 % in high gain range due to attenuator 21 jun 2002 C. de La Taille accuracy = 0.3 % but 5 V stripline compensation deteriorates calibration boardthe design uniformity review 14 Pulse uniformity 1.5 % effect from 5.5 V compensation foreseen when 50 near switch 0.6 % from different output lenghes from 50 to connector (on 128 boards connector position will add a few per mille 5 resistor at 0.1 % as expected slope uniformity 0.3 % 21 jun 2002 C. de La Taille What should we compensate on 128 boards ? calibration board design review 15 Oscillations Observation 1 Large oscillation at 350 MHz when channels 2,3 or 4 are pulsed together with DAC>0.25V Barely visible oscillation at 350 MHz on all the channels, increasing with DAC>0.25V Was not present on single channel test-board Explanation 1 None (as usual for HF oscillations) Cure 1 Add 150 pF to ground on Cp (gate of current source output transistor) Observation 2 180 MHz oscillation on large pulses, alters decay time Explanation 2 Delay chip loaded by coax for triggering purposes Cure 2 21 jun 2002 Add 50 Ω in series for trigger output C. de La Taille calibration board design review 16 Damaged opamps Observation + 2V moves up to 5.5 V Some chips (4/18) show large current (5-50mA) from 7.5V to +2V They still work correctly, but with degraded offset All chips in parallel on supplies, common 100 Ω protection resistor on +2 V Difficult to locate bad chips Explanation None, could only be reproduced with 7.5V raised to 15V Several power supplies mishandlings have been tried without damage Cure Individual current limitation resistors on +2V and +7.5V Series resistors on input and common voltage busses (Vref) 21 jun 2002 C. de La Taille calibration board design review 17 Damaged DAC Observation 1 chip damaged on brd 3 DAC = 0 gives 2 mV 4 µA leakage current on MSB Explanation None Chip could not be remounted on DAC test board (pins damaged) Cure 21 jun 2002 To be examined C. de La Taille calibration board design review 18 Enable schematic Common emitter between VDD and VSS VDD Channels enabled flow 1 mA in VSS Channels ON by default (Enable=VDD) 100K Calogic 0-5V Enable 2-7V 5K VSS Go to common base configuration Powered between VDD and GND No current in VSS Base connected to VCC through 47 kΩ Channels OFF by default VDD 100K 50K Calogic 0-5V Enable 2-7V 50K VCC 21 jun 2002 C. de La Taille calibration board design review 19 Robustness Power supplies Effect of missing +7.5V : maximum current flowing (0.3A/ch) -> add 1MΩ to 5.5V on output transistor Effect of missing +9.5V : maximum current flowing (0.3A/ch) -> Produce +7.5V from +9.5V Effect of missing +5.5V : none. Effect of missing -6 V : barely visible, can be almost any (negative) value Tests of robustness The chip starts to deteriorate at VDD = 12 V Permanent damage in protection diodes, if unlimited current for V DD = 14 V Offset variations Observation : offset changes by 40 µV when all channels are ON Explanation : Offset sensitivity to Vss power supply : dVoff/dV2V = 100 µV/V = 0.01% Cure : • Reduce +2V impedance by decreasing resistance in series with the 3 diodes • Maintain robustness by individual large resistive decoupling • Use regulator on +7.5V 21 jun 2002 C. de La Taille calibration board design review 20 Summary of proposed modifications General Power supplies reduced by 0.5V to VP6=+5V, VDD=+7V and VP9=+9V Individual channels 21 jun 2002 R0 = 50 Ω moved away from switch, close to inductor Output line impedance decreased to 25 Ω Bulk connected to source instead of VDD via 1 MΩ, 100 nF decoupling Gate connected to GND, no VG adjustment 150 pF to ground on Cp and 1 MΩ to VDD 1 kΩ in series with Vss = + 2 V (I = 100 µA) 200 Ω in series with fuses to Vss (I = 2 mA) 100 Ω in series with Vdd = +7V (I = 2.1 mA) Enable translator changed from common emitter to common base configuration, with no connection to Vss Short path between emitter of switching NE856 and decoupling capacitor of preceding emitter follower. Series resistor of follower increased from 51 Ω to 82 Ω (910 Ω was really too much !) C. de La Taille calibration board design review 21 Summary of proposed modifications Groups of 8 channels Remove 50 Ω parallel termination on command line Change 0 Ω series termination to 50 Ω // 33 pF Add fuse on VP6 if RFUSE < 50 mΩ Have local +2V with 3 diodes Keep possibility of local VG = -0.4 V ? DAC Correct star disribution for VP6 on resistor ladder Keep bandgap and reference possibility DAC distribution 21 jun 2002 150 pF to ground on Cp and 1 MΩ to Vdd Connect drain to ground via 1 k instead of using PMOS switch 1 kΩ in series with Vss = + 2 V (I = 100 µA) 200 Ω in series with fuses to Vss (I = 2 mA) 100 Ω in series with Vdd = +7V (I = 2.1 mA) C. de La Taille calibration board design review 22 Pending questions Digital part Clock terminations Reset scheme Regulator on +5V Maximum current : 3A => • All channels ON with DAC=100mV (1/10 full scale) • 10 channels with maximum DAC Filtering Use of Bandgap reference Not yet tested Schedule for opamps production Issue order in june ? How many wafers : 12, 13, 14 ? 21 jun 2002 C. de La Taille calibration board design review 23 Pulse shape before shaping Full DAC range 100 µV-> 1V Up to 5V pulses in 50 Ω Undershoot DAC=100µV Due to 50 Ω line between switch and R0 : should be 25 Ω Checked by simulation Will be corrected DAC=1mV 0dB DAC=10mV 0dB DAC=0.1V -20dB Risetime < 2 ns Varies little with DAC 21 jun 2002 DAC=1V -40dB C. de La Taille calibration board design review 24 Pulse shape after shaping 80 dB dynamic range Parasitic injected charge Equivalent to DAC=30 µV Or a pulse of 150 µV At peak < 15 µV Improvement by >10 compared to module0 DAC=0µV DAC=100µV 0dB DAC=1mV -20dB DAC=1V -80dB 21 jun 2002 C. de La Taille calibration board design review 25 PIC uniformity PIC on 8 channels Good uniformity Singularities : CH7 had the Nwell tied to 5V, as in the original configuration : clear improvement ! CH4 has a larger offset (35 µV) damaged ? CH7 : VB=+5V 21 jun 2002 C. de La Taille calibration board design review DAC=1mV -20dB 26 Designing the 128ch board Large number of modifications ! 108 modification on the 8 ch. Board alone Improved performance and robustness Power supplies decreased by 0.5V Goal : have VP6 = 5V uniform for all channels within 0.1% 5V ref Star configuration mandatory All VP6 lines equalized in length Common reference point on borad center : dimension 2 x 1 cm = 1 mΩ Minimize variation of amplitude with number of enabled channels Many tricky PCB layout details 150 mm 220 mm 21 jun 2002 C. de La Taille calibration board design review 27 Schematics : power supplies Regulators on VP9 and VP7 from +11V. Also on VP5 ? Regulators on digital Vcc for delays and logic chips 21 jun 2002 C. de La Taille calibration board design review 28 Schematics : TTCRx Derives 40 MHz clock and calib pulse (CMD) No EPROM used 21 jun 2002 C. de La Taille calibration board design review 29 Schematics : SPAC 21 jun 2002 C. de La Taille calibration board design review 30 Schematics : calogic 1 chip for counter, 1 for DAC and 4 for Enables 21 jun 2002 C. de La Taille calibration board design review 31 Schematics : delay chips Delay chip : AC output as it can be stuck to Vcc Trigger output on front panel 21 jun 2002 C. de La Taille calibration board design review 32 Schematics CMD distribution : White follower 21 jun 2002 C. de La Taille calibration board design review 33 Schematics : DAC Careful separate layout of VP5 and GND External reference to VP9 Internal low offset opamp connected as others 21 jun 2002 C. de La Taille calibration board design review 34 Schematics : DAC distribution Low offset opamp for low impedance DAC fanout to 128 channels 21 jun 2002 External fuses ? C. de La Taille calibration board design review 35 Schematics : 1 pulser Low offset opamp for current source HF switch with external NE856 New enable schematic 21 jun 2002 C. de La Taille calibration board design review 36 PCB layout Top layer : analog components 21 jun 2002 C. de La Taille Bottom layer : digital components calibration board design review 37 PCB layout Layer 2 21 jun 2002 Layer 3 C. de La Taille calibration board design review 38 PCB layout Layer 4 21 jun 2002 Layer 5 C. de La Taille calibration board design review 39 PCB layout Layer 6 21 jun 2002 Layer 7 C. de La Taille calibration board design review 40 PCB layout PCB cross section : all inner copper layers 70 µm thickness Output connector Inductors Analog part Digital part routing Layer 1 Layer 2 GND GND routing GND GND GND VP5 Layer 3 Layer 4 outputs GND outputs GND enables GND enables VP5 Layer 5 Layer 6 outputs GND outputs GND VP5 VP5 VP5 VP5 Layer 7 Layer 8 outputs GND GND GND GND GND routing routing 21 jun 2002 C. de La Taille calibration board design review 41 Summary The operation of the 8 channels board has been more difficult than foreseen Layout very different from module 0 Coupling of large digital signals Many modifications necessary Robustness had been overlooked Performance is good Linearity < 0.1% Parasitic injected charge ten times better than on module 0 The 128 channel is being finalized Difficult layout of uniform VP6 : star configuration Many lines equalized in length Pending issues 21 jun 2002 Voltage regulator on VP5 (pin 4) C. de La Taille calibration board design review 42