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The CMOS inverter VDD p-switch VDD Y A Y n-switch A VSS Paulo Moreira A Y 0 good 1 1 good 0 VSS Inverter 1 The CMOS inverter Inverter DC transfer characteristic 2.5 VDD Slope = -1 2 A Y Vout (V) 2.5/0.25 1.5 Vout=Vin 1 /0.25 Slope = -1 0.5 VSS 0 0 0.5 1 1.5 2 2.5 Vin (V) Paulo Moreira Inverter 2 The CMOS inverter Regions of operation (balanced inverter): Vin n-MOS p-MOS Vout 0 cut-off linear Vdd VTN<Vin<Vdd/2 saturation linear ~Vdd Vdd/2 saturation saturation Vdd/2 Vdd-|VTP|>Vin>Vdd/2 linear saturation ~0 Vdd linear cut-off 0 The CMOS inverter Inverter transient response 3 Vout, Vin (V) 2.5 Vout 2 CL=250fF 1.5 1 0.5 Vin 0 -0.5 0 2 4 6 Time (ns) 8 6 Time (ns) 8 10 12 CL=250fF 0.6 I D(nmos) I D (mA) 0.4 0.2 0 -0.2 -0.4 I D(pmos) -0.6 0 Paulo Moreira 2 4 Inverter 10 12 4 The CMOS inverter Propagation delay Main origin: load capacitance t pLH t pHL C L Vdd k p Vdd VTP C L Vdd k n Vdd VTN 2 CL k p Vdd 2 CL k n Vdd CL 1 t p t pLH t pLH 2 2 Vdd 1 1 kn k p To reduce the delay: Reduce CL Increase kn and kp. That is, increase W/L The CMOS inverter • CMOS power budget: – Dynamic power consumption: • Charging and discharging of capacitors – Short circuit currents: • Short circuit path between power rails during switching – Leakage • Leaking diodes and transistors Paulo Moreira Inverter 6 The CMOS inverter • The dynamic power dissipation is a function of: – Frequency – Capacitive loading – Voltage swing • To reduce dynamic power dissipation – Reduce: CL – Reduce: f – Reduce: Vdd The most effective action Dynamic power VDD Vin Vout Paulo Moreira 1 E = Energy / transition = C L Vdd2 2 2 P = Power = 2 f E f C L Vdd Inverter 7 The CMOS inverter substrate contact (p+) n+ diffusion polysilicon metal n-well n-well contact (n+) p+ diffusion The CMOS inverter n-well contact (n+) n-well contact (n+) n-well n-well substrate contact (p+) substrate contact (p+) polysilicon polysilicon p+ diffusions p+ diffusions polysilicon contacts polysilicon contacts diffusion contacts diffusion contacts n+ diffusions n+ diffusions Why The CMOS inverter is Better?? • 1) Low DC Power Consumption • 2) Abrupt & well defined Voltage transfer Characteristic • 3) Noise Immunity due to Low impedance between logic levels and Supply/Gnd. • Symmetry between Tfall &Trise. • High Density: Si real estate=>Yield=>Cost! • Highly Integrated=>Active & High input Impedance=> Composition equality. • No real trade off between 1,2,3,4,5 & 6