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CPUs and motherboards
Unit objectives:
 Describe the function and features of CPUs,
identify a CPU, and classify CPUs according to
their specifications. Learn how to replace a
CPU
 Describe the techniques used to cool CPUs
and other components in a PC
 Describe motherboards, their components, and
form factors. Learn how to replace a
motherboard
 Identify the symptoms of, probable causes of,
and potential solutions to problems with
motherboards and CPUs
Topic A
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Topic A: Central processing units
Topic B: Cooling techniques
Topic C: Motherboards
Topic D: Motherboard and CPU
troubleshooting
Central processing unit (CPU)
 “Brains” of your PC
 Processes instructions, manipulates data,
controls interactions of other circuits
 Contains:
– A control unit
– One or more
execution units
– Registers
– Single-core vs.
multi-core processors
CPU design characteristics
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Addressable RAM
Address bus
Data bus
Internal bus
Cache
Clock speed
Dual Independent Bus (DIB)
Front-side bus speed
continued
CPU characteristics, continued
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Hyperthreading
Multimedia extensions (MMX)
Multiprocessing
Overclocking
Pipelining
Superscalar
Throttling
Multiple-processor support
 Requires symmetric multiprocessing code
for OS and applications
 Symmetric multiprocessing code is included
in:
– Windows 2000 Professional
– Windows XP Professional
– Windows Vista Business, Ultimate, Enterprise
– Windows 7 32-bit versions
 Linux and Linux applications are available in
symmetric multiprocessing versions
 64-bit versions of Windows 7 use NUMA
Processor specifications
 Manufacturers (e.g.):
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Intel
AMD
Centaur Technology
Elbrus International
Integrated Device Technology, Inc. (IDT)
SIS (Silicon Integrated Systems)
ST Microelectronics
 Primary specifications
 Bus width specifications
 Internal specifications
Activity A-1
Identifying CPUs
Inside the case
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Chipsets
CPU packaging
Slots
Cooling techniques
Chipsets
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Memory control
System bus functions
Audio functions
Video display functions
System management functions
Northbridge and Southbridge
 Two most important components of a
PC chipset
 Northbridge controls interactions
between the CPU, memory (including
cache), AGP and PCIe video control
circuitry, and the Southbridge
continued
Northbridge/Southbridge, continued
 Southbridge controls interactions
between buses and devices not
controlled by the Northbridge
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PCI expansion bus
Floppy drive controller
Serial port
Parallel port
PS/2 keyboard and mouse ports
USB and FireWire
BIOS and CMOS
Etc.
CPU packaging
 Chip = die
 A package is made up of
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Die
Plastic, metal, or ceramic case
Wires or connectors
Support chips
Cooling components
PGA package
80486
SECC package
Pentium 3
Packages
Package
Full name
Description
Processors
PDIP
Plastic dual
inline package
Die is encased in plastic.
Large, flat, metal pins are
inserted into socket that’s
soldered to motherboard.
8080, 8086, 8088
PGA
Pin grid array
Rows of pins extend from
bottom of package. Nickelplated copper slug sits atop
the die to improve thermal
conductivity. Pins are
arranged so that chip can be
inserted in just one way.
80286 (68 pins),
80386 (132 pins),
80486 (168), and
Xeon (603 pins)
CPGA
Ceramic pin grid
array
Uses a ceramic substrate with
pins arranged in a pin grid
array.
AMD Socket A
Athlons and the
Duron
SPGA
Staggered pin
grid array
Similar to PGA, but pins are
staggered to fit more in a
given area.
Pentium, Pentium
MMX, Pentium Pro
with 387 pins
continued
Packages, continued
Package
Full name
Description
PPGA
Plastic pin
grid array
Updated version of SPGA Pentium Pro; early
package.
Celeron processors;
Pentium III with 370 pins
FC-PGA
Flip chip pin
grid array
Similar to PGA, but die is
exposed on top.
Enhances heat transfer
and cooling options.
Pentium III and Celeron
with 370 pins; 423-pin
version used with
Pentium 4 processors
FC-PGA2 Flip chip pin
grid array 2
Similar to FC-PGA, but
with integrated heat sink,
connected to the die
during manufacturing.
Pentium III and Celeron
with 370 pins; 478-pin
version used with
Pentium 4 processors;
469 version used with
AMD Athlon Thunderbird
processors
OOI
Die mounted face-down,
423-pin Pentium 4
as with FC-PGA, for
better cooling, but uses
different pin arrangement.
OLGA On
Interposer
Processors
continued
Packages, continued
Package
Full name
Description
Processors
OPGA
Organic pin
grid array
Silicon die is attached to
AMD Athlon XP
organic plastic plate, which is
pierced by array of pins to make
connections to socket.
Cheaper, thinner, and lighter
than ceramic package.
Reduces electrical impedance.
SECC
Single Edge
Contact
Cartridge
Mounts CPU vertically on
motherboard. Uses an edge
connector similar to an adapter
card’s. Package is covered with
metal case. Metal thermal plate
mounted to back of cartridge
acts as heat sink.
Pentium II
processors with
242 contacts;
Pentium II Xeon
and Pentium III
Xeon processors
with 330 contacts
SECC2
Single Edge
Contact
Cartridge 2
Similar to SECC, but without
thermal plate.
Later versions of
the Pentium II and
III processor with
242 contacts;
AMD Athlon K7
continued
Packages, continued
Package
Full name
Description
Processors
SEP
Single Edge
Processor
Similar to SECC but without
metal case.
Early Celeron
processors with
242 contacts
FCBGA
Flip chip ball Similar to FC-PGA, but uses
Xeon, plus many
grid array
balls for contacts. Balls can’t be support chips in
bent.
current Pentiumclass computers
LGA
Land grid
array
Has small raised contacts.
Corresponding socket has pins
that meet the contacts. A very
high-density package.
Celeron D,
Pentium 4,
Pentium 4 D,
Pentium Extreme
Edition,
Core2 Duo,
Core2 Extreme
PGA-ZIF
Pin grid
array-Zero
insertion
force
Set in place with very little to no
force. Weight of package
enough to seat. Held in place
with lever or slider
Xeon,
Mobile Pentium M,
Mobile Celeron M,
Mobile Core, Core
Duo, and Core 2
Duo
Sockets and slots
Type
Supports these
packages
Processors
Notes
Slot A
AMD’s Card Module
package
AMD Athlon
Wasn’t a popular design;
didn’t last long.
Socket A
(Socket
462)
SPGA with 462 pins
AMD Athlon and
Duron
Eleven holes in socket
were plugged to ensure
that packages were
installed correctly.
Socket 5
PGA, SPGA with 320 Pentium
pins
Socket 7
PGA;
SPGA with 321 pins;
PGA, SPGA, and
FC-PGA with 296
pins
AMD K5 and K6,
Cyrix 6x86,
Pentium, and
Pentium MMX
First socket to support
dual voltage inputs.
Prevents a new CPU from
being plugged into a
Socket 5 socket.
continued
Sockets and slots, continued
Type
Supports these
packages
Processors
Notes
Socket 8
387-pin PGA, SPGA,
and FC-PGA
Pentium Pro
Short-lived socket design
used primarily with
Pentium Pro.
Socket
423
423-pin SPGA and
FC-PGA, OOI
Pentium 4
Short-lived socket design
used for early Pentium 4
processors.
Socket
478
FC-PGA2
Celeron,
Current general-purpose
Pentium 4,
socket for Pentium-class
Pentium D,
processors.
Pentium Extreme
Edition
Socket
370
SPGA and PPGA
with 370 pins
Celeron,
Celeron II,
Pentium III
Similar to Socket 7 design,
with 6 staggered rows of
pins rather than 5.
continued
Sockets and slots, continued
Type
Supports these
packages
Processors
Notes
Socket
603
PGA-ZIF
Xeon
603 contacts in grid
around center of socket.
Socket
604
PGA-ZIF
Xeon
604 pins with 603
contacts. Supports
heatsink.
Slot 1
SECC, SECC2, SEP
with 242 contacts
Pentium II, early
Celeron, and
Pentium III
Edge connector slot
developed specifically for
SECC, SECC2, and SEP
packages.
Slot 2
SECC, SECC2, SEP
with 330 contacts
Pentium II and
Xeon
Similar to Slot 1, but CPU
can communicate with
Level II cache at full CPU
speed.
continued
Sockets and slots, continued
Type
Supports these
packages
Processors
Notes
LGA775
LGA
(Socket T)
Celeron D,
Pentium 4,
Pentium D,
Pentium Extreme
Edition,
Core2 Duo,
Core2 Duo
Extreme
Designed to work
specifically with new highdensity LGA package.
Intel’s current high-end
socket.
LGA 1156 LGA
(Socket H)
Pentium,
Core i3,
Core i5,
Core i7 (800
series),
Xeon
Allows connections to
PCIe 2.0 x16 graphics
card. PCIe 2.0 x4 connect
for DMI communication.
Two memory channels for
DDR3 SDRAM.
LGA 1366 LGA
(Socket B)
Core i7 (900
series),
Xeon (5500
series)
Replaces LGA 775.
Access up to three
channels of DDR3
memory
continued
Sockets and slots, continued
Type
Supports these
packages
Processors
Notes
Socket
479
PGA-ZIF
Mobile Pentium Physically similar to
M and Celeron M Socket 478; different
electrical pin arrangement.
Socket
495
PGA-ZIF
Mobile Celeron
Designed to support a
heatsink.
Socket M
PGA-ZIF
Mobile Core
Solo, Core Duo,
Core 2 Duo
Celeron M
Replaces Socket 479,
however, one pin is
changed.
Socket P
PGA
Mobile Core 2
Duo, Core 2
Quad
Celeron M
Pentium DualCore
478 pins, but incompatible
with Socket M or Socket
478.
continued
Pentium with MMX CPU & Socket 7 socket
Activity A-2
Identifying your CPU’s socket and
package type
CPU installation
 CPU typically replaced as part of new
motherboard
 Add another CPU to multiprocessor
motherboard
 CPU packaging must match slot or
socket in motherboard
 CPU packages held in place by
retaining clips, locking lever, or other
mechanism
Zero insertion force socket
Locking socket arm
Installing a CPU
1. Unplug the computer and open the
case
2. Remove the old CPU
3. Store the old CPU
4. Insert the new CPU package into its
socket and secure it with the retaining
mechanism
5. Close the case, reconnect cables, and
boot the PC
Activity A-3
Replacing a CPU (optional)
Topic B
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Topic A: Central processing units
Topic B: Cooling techniques
Topic C: Motherboards
Topic D: Motherboard and CPU
troubleshooting
Typical cooling mechanisms
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Fans
Heat sinks and cooling fins
Heat pipes
Water pumps
Peltier coolers
Phase-change cooling
Undervolting
Power supply and CPU fans
Power supply fan
Auxiliary fan
Cooling fins
Cooling fins and a fan
Other cooling techniques
 Heat pipes — Small tubes filled with fluid
 Water pumps — Tubes filled with water,
moved away from CPU to outside case and
through cooling fins
 Peltier coolers
– Electronic device that gets colder when voltage
is applied
– Non-convection
– Connected directly to CPU
– Can be combined with water coolers
continued
Other cooling techniques, continued
 Phase-change cooling
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Vapor compression
Gas to liquid
Liquid absorbs processor heat and evaporates
Gas returned to compressor
Cycle begins again
More efficient than water cooling systems
Generate significant noise
 Undervolting
– Less power; less heat
– Can cause system problems
Activity B-1
Examining the cooling systems in your PC
Activity B-2
Replacing a system fan
Topic C
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Topic A: Central processing units
Topic B: Cooling techniques
Topic C: Motherboards
Topic D: Motherboard and CPU
troubleshooting
A motherboard
Socket 478
connector
3 DIMM banks
Back panel
connectors
ATX power
supply
2 IDE ports
Chipset
AGP slot
Chipset
Floppy drive
port
4 PCI slots
CMOS battery
BIOS
CD-in connector
(white line)
Motherboards
 Components review
CPU
IEEE 1394 / FireWire port
Expansion slots
Serial port
AGP graphics adapter slot
Parallel port
Hard drive interface connectors
Battery
Floppy drive interface connector
Network interface
Optical drive interface connector
Video connectors
Power connector
Memory slots
PS/2 mouse and keyboard ports
USB port
Daughter board
 A circuit board
 Connects to another circuit board to
provide or assist with its functions
 Most often used with video cards
Riser card
Form factor
 Size and shape of a motherboard
 Dictates power supply and case
 Describes physical layout of
components
Activity C-1
Examining motherboard components
and form factor
Motherboard installation
 Failures from manufacturing defects or
rough handling
 Replaced due to failure; upgrades;
building PC from scratch
 Held in place by screws or plastic clips
 Remove wires, cables, connectors,
and other system components, such
as power supply and drives
Installing a motherboard
1.
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5.
6.
7.
Unplug the computer and open the case
Disconnect all wires from old motherboard
Remove the power supply and drives
Remove the old motherboard
Store the old motherboard
Orient motherboard; match mounting holes
Remove old standoffs and/or install new
standoffs
8. Install the new motherboard
9. Reinstall the power supply and drives
10.Connect all wires
11.Close the case, reconnect cables, and boot
the PC
Windows activation
 Type of cataloging process
 Entered into Microsoft database:
– Software product
– Product key
– Hardware signature
 Commercial versions have 30-day grace
period
 Activate by:
– Internet
– Telephone
 Volume licenses don’t require activation
Activity C-2
Replacing a motherboard (optional)
Topic D
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Topic A: Central processing units
Topic B: Cooling techniques
Topic C: Motherboards
Topic D: Motherboard and CPU
troubleshooting
Motherboard and CPU problems
 System fails to boot
 Burning or foul odor or smoke comes out of
the case
 Fans come on and power lights indicate that
power is present, but system fails to boot
 Video display problems occur on system
with integrated display adapter
 Intermittent problems occur that can’t be
traced to failure of other components
Activity D-1
Troubleshooting motherboard
and CPU problems
Unit summary
 Described the function and features of
CPUs, identified a CPU, and classified
CPUs according to their specifications.
Learned how to replace a CPU
 Described the techniques used to cool
CPUs and other components in a PC
 Described motherboards, their components,
and form factors. Learned how to replace a
motherboard
 Identified the symptoms of, probable causes
of, and potential solutions to problems with
motherboards and CPUs